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WO/2024/068635A1 |
According to the method, fluid (1) is pumped from a collection sump (2) of a machine tool to a reservoir (3) of a disinfection system (4) and back to the collection sump. Disinfection is performed by means of an ultraviolet radiation uni...
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WO/2024/068854A1 |
Grinding segment (12) made of a bond material that is at least one of free-form sintered, hot- pressed and infiltrated and of superabrasive particles being arranged according to a prede- termined particle design, the grinding segment hav...
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WO/2024/073127A1 |
A method of manufacturing a saw blade. The method includes providing a body having a plurality of cutting teeth. Each cutting tooth includes a cutting tip, a rake face extending from the cutting tip, and a relief face extending from the ...
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WO/2024/062064A1 |
The invention relates to a process for shaping an ophthalmic product (20) using a machining device (200) equipped with clamping means (202, 203), a machining tool (210) and a force sensor (234) adapted to measure a force that is related ...
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WO/2024/064259A1 |
A precursor for preparing a chemical mechanical polishing pad includes a prepolymer, a disulfide-containing component, and a curative. The chemical mechanical polishing pad prepared from the precursor includes a disulfide bridge in a pol...
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WO/2024/060835A1 |
A rubber powder application device and method for grinding and polishing of a rhinestone, relating to the technical field of rhinestone machining. The device comprises a frame, a support (1) which is arranged on the frame and can move up...
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WO/2024/061693A1 |
The invention relates to a securing device for securing a grinding wheel and/or polishing wheel (20) to a tool holder (12) of a power tool (10), in particular a tool holder (12) of an angle grinder, the securing device comprising: at lea...
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WO/2024/056957A1 |
The invention relates to manual deburring tool (1) comprising: - a consumable carbide plate (10) having deburring edges (12), and - a casing (20) which is configured to be grasped manually and has an internal cavity (22) for housing the ...
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WO/2024/059469A1 |
A guide for cutting a dowel pin of a rotor assembly is provided. The guide includes a catch basin, including a first catch basin portion and a second catch basin portion, and a shim. The first catch basin portion and the second catch bas...
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WO/2024/059269A1 |
Devices, systems, and methods for identifying, tracking, evaluating, and/or conditioning drill bits (e.g., rock drill bits). A computing device can be configured to receive and store data associated with the drill bit. The system can inc...
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WO/2024/055058A1 |
The invention relates to a processing device (5) for processing inner surfaces (6, 6') of pipes (2, 2'). Said processing device (5) comprises a support frame (8) for holding at least one processing unit (9). At least two wheels (12), whi...
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WO/2024/056320A1 |
The invention relates to a device (1) for processing, in particular deep rolling, shafts (4) and other components, comprising two live centres (2A, 2B) for receiving a shaft (4) to be processed on both sides, at least one drive (6A, 6B) ...
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WO/2024/057564A1 |
This polishing brush (1) comprises a brush holder (2) and a brush (3). The brush holder (2) has a shank (5) of which a base-end portion is connected to a tool post of a lathe, and a brush-holding member (6) that is supported by a distal-...
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WO/2024/056315A1 |
The invention relates to an electrolyte medium for electrochemical polishing of metal workpieces, which on the one hand contains a plurality of solid granulate particles and on the other hand contains a liquid electrolyte. According to t...
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WO/2024/057749A1 |
The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method...
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WO/2024/057951A1 |
This substrate processing apparatus comprises: a substrate holding unit that holds a substrate; a drive mechanism that drives a tool for processing the substrate being held by the substrate holding unit; a housing in which the substrate ...
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WO/2024/059749A2 |
Systems and methods for processing additively manufactured objects are described herein. In some embodiments, for example, a system includes a controller configured to provide one or more control signals; a heater coupled to the controll...
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WO/2024/055643A1 |
A crane maintenance robot, comprising a body (1) and a control box (2). The control box (2) is provided on the body (1); a locomotion mechanism for movement is also provided on the body (1); the locomotion mechanism comprises locomotion ...
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WO/2024/050680A1 |
An electrically-controlled grinding-integrated machine for machining, comprising support legs (1), a first chamber door (2), a device base (3), a discharging chamber door (4), a device housing (5), an indicator light (6), a main control ...
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WO/2024/054168A1 |
The invention relates to the full automation of the cold-warm press and pre- grinding production line where the lining production is provided. The subject of the invention is especially related to the cold-warm press station (A), which i...
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WO/2024/053390A1 |
The present invention provides: a polishing agent which is capable of polishing a surface to be polished, the surface containing a resin, highly flat at a high rate; an additive solution for polishing agents; and a polishing method. Th...
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WO/2024/052980A1 |
A work (1) is rotationally symmetric with respect to an axis (L0), and a section of a surface (5) thereof to be polished which is formed by cutting the surface (5) along a virtual plane containing the axis (L0) includes a circular arc (5...
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WO/2024/052352A1 |
A grinding robot (7) for grinding a surface (2, 3, 4, 5) has a grinding device by means of which the surface (2, 3, 4, 5) can be ground using a grinding means, a movement device by means of which the grinding device can be moved over the...
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WO/2024/046699A1 |
The invention relates to a machine tool (10) having a rotating tool (20), wherein, to support a conventional braking operation, the machine tool has an eddy current brake (2), wherein the eddy current brake comprises a means (14) for gen...
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WO/2024/047149A1 |
The invention relates to a glazed assembly comprising a monolithic or laminated glazing (300) and a finishing joint and/or seal (50), the glass sheet of the monolithic glazing, or, respectively, an external sheet (320) of the laminated g...
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WO/2024/049890A1 |
A retaining ring for a carrier head of a chemical mechanical polishing system includes an annular outer portion having an annular outer surface and a plurality of flanges projecting radially inward from the annular outer portion. Adjacen...
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WO/2024/045493A1 |
A shape-controlled flexible polishing method for a microarray mold. The following solution is used: a magnet is mounted below a microarray mold (3), so that a prepared magnetic abrasive is attached to the surface of the microarray mold (...
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WO/2024/047305A1 |
The invention relates to a method for polishing the front face of a polycrystalline silicon carbide slab comprising a surface region at least partially work-hardened under the effect of grinding, comprising: - relative movement of a rota...
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WO/2024/049642A1 |
The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as p...
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WO/2024/050006A1 |
Abrasive agglomerates can include cubic boron nitride particles and a vitrified binder material. An abrasive article can include the abrasive agglomerates and a vitrified bond material. The bond material can include zircon, crystalline z...
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WO/2024/048271A1 |
Provided are: a composition for chemical mechanical polishing; and a polishing method using the same. The composition allows rapid polishing of a polishing surface that contains a silver material for wiring, and makes it possible to obta...
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WO/2024/049562A1 |
The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facilit...
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WO/2023/182264A9 |
This vitrified-bond superabrasive wheel has a superabrasive layer, the superabrasive layer 6 including superabrasive grains 3, pores 5, and vitrified bonds 2. In the superabrasive layer 6, the area ratio of coarse vitrified bond grains h...
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WO/2024/047282A1 |
The invention relates to a cleaning product (100, 200, 300) for dry dust cleaning of a sanded surface. The cleaning product (100, 200, 300) comprises a substrate (101, 201) having a first surface (101a, 201a) and a second surface (101b, ...
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WO/2024/050141A2 |
A polishing pad comprising a textile layer, a compressible layer, and a water impermeable layer disposed between the textile layer and the compressible layer. The polishing pad reduces slurry use by improving slurry transport and require...
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WO/2024/042542A1 |
The present disclosure relates to a Fluid Jet Polishing (FJP) device (200) for a workpiece (203). The FJP (200) includes a mixer (201), a nozzle (202), and an acoustic transducer (202a). The mixer (201) is adapted to mix a carrier fluid ...
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WO/2024/042769A1 |
A cutting device (100) comprises a sliding door structure (200). The sliding door structure (200) is provided with: a rail cover (21) configured to cover a rail (23) that is configured to enable linear movement of a sliding door (20); an...
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WO/2024/042450A1 |
A shaving device (100) including a handle (110), a sharpening member (126), and a cartridge (150, 200, 650). The sharpening member (126) includes an abrasive material. The cartridge (150, 200, 650) couples to the handle (110). The cartri...
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WO/2024/043236A1 |
Provided is a balancer with which it is possible to further inhibit vibrations from occurring when a rotary body is rotating. In a nut 1 serving as a balancer, a groove portion 12 in which balance pieces 30, 40 can be placed along the ci...
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WO/2024/041451A1 |
The present invention relates to the field of optical cold working equipment. Disclosed is a down swing polishing machine, comprising a seat and a base connected to the seat by means of three bearing units; a pressure unit is provided on...
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WO/2024/040700A1 |
Disclosed is an automatic adjustment device for converting linear motion into angle adjustment motion. The automatic adjusting device comprises: a moving assembly, which moves linearly in a first direction; a limiting member, which is fi...
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WO/2024/044023A1 |
The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad The pad surface cleaning system may be used to spray the polishing surface with a h...
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WO/2024/042559A1 |
Holding unit (10) for holding a sheet (200) comprising a stabilizer device (11) provided with gripping members (12, 13) of which at least one is mobile with respect to the other along an axis of grip and release (Z) to hold said sheet (2...
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WO/2024/042829A1 |
Provided is a cylindrical grinding device that produces a slicing single crystal by performing cylindrical grinding in which the outer peripheral surface of a grinding single crystal is ground while the grinding single crystal is caused ...
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WO/2024/043207A1 |
Provided are an aircraft coating removal device and method. The device comprises: a travel cart that can move; a blast head that is mounted on the travel cart and that can spray a blast material; a raising/lowering device that can move t...
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WO/2024/041619A1 |
The present application relates to the technical field of grinding machines, and specifically provides a chuck assembly, a grinding machine and a control method therefor. The grinding machine comprises a feeding device, the chuck assembl...
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WO/2024/043237A1 |
Provided is a flanged grindstone that can reduce the amount of grindstone that is ground due to truing, and to reduce variations in balance adjustment. In a flanged grindstone 1, flanges 30, 51 comprise: spindle insertion holes 33, 52 th...
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WO/2024/043061A1 |
Provided is a polishing composition capable of achieving high HLM rim protrusion resolving ability while maintaining a polishing rate. Also provided is a polishing composition for preliminarily polishing the surface of a silicon material...
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WO/2024/041159A1 |
An ultrasonic thinning device for a wafer, comprising an adsorption unit and a grinding unit. The adsorption unit comprises vacuum suction cups (20) each having a cup body (201); air flow channels (202) and adsorption holes (203) are eve...
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WO/2024/036983A1 |
A polishing pad (2), comprising a polishing layer (20). The polishing layer (20) comprises a polyurethane substrate, and the polyurethane substrate is obtained by reacting a polyfunctional isocyanate, a polyol composition and a polyamine...
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