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WO/2023/248960A1 |
A method, for polishing both sides of a workpiece made of a glass substrate, comprises: (1) a step for starting polishing of the workpiece; (2) a step for monitoring the rotational state of the workpiece in real time; and (3) a step for ...
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WO/2023/249678A1 |
A method of controlling a chemical mechanical polishing system includes receiving a respective time-varying test signal from an endpoint detection system for each of a plurality of test substrates, simultaneously visually displaying the ...
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WO/2023/249903A1 |
A robotic abrading system is presented that includes a robotic arm that causes a workpiece to contact an abrasive article according to a set of operational parameters for an abrasive operation. The system also includes a pre-operation to...
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WO/2023/249602A1 |
A cutting segment (110) for mounting onto a work tool to provide an abrasive operation by the work tool, the cutting segment (110) having first and second side walls (220, 230) extending in an intended direction of motion (M) of the cutt...
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WO/2023/250444A2 |
A tool handle having a grip portion with two parallel attachment legs projecting perpendicular to the grip portion; the grip portion having a threaded hole for mounting a threaded extension pole; the threaded hole located on top of the g...
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WO/2023/249572A1 |
This invention relates to a system (1) that determines whether the level of looseness and grain structure of leather cut pieces used in products produced using 100 % natural leather is in accordance with the customer standards and VDA st...
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WO/2023/250445A1 |
A masonry cutting system having an extension handle assembly with a fork assembly mountable to a right-angle grinder in parallel alignment and with a blade on the grinder oriented vertically, a shroud with a self-adjusting guard and the ...
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WO/2023/248951A1 |
The purpose of the present invention is to provide: silica particles which has excellent mechanical strength, polishing characteristics and storage stability; a silica sol; and a polishing composition. The present invention relates to si...
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WO/2023/244740A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization, comprising one or more acrylate urethane oligomers, one or more acrylate monomers and at least one photo-polymerization initi...
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WO/2023/243118A1 |
This honing device comprises: a honing tool (1); a rotary main shaft (2) to which the honing tool (1) is fixed; an axial-direction drive unit (4) that moves the rotary main shaft (2) in the Z-axis direction; a workpiece holder (3) that h...
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WO/2023/241411A1 |
A finishing device, comprising a thrust system (101), a sealing system (102), a conveying pipe system (103), and a recovery system (104), wherein the sealing system (102) comprises a piston (21) and a cylinder body (18) cooperating with ...
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WO/2023/242883A1 |
Position detection unit (10) for a sheet (200) having a perimeter edge (212), comprising a slider (11) and a detection device (13) provided with a detection member (14).
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WO/2023/242471A1 |
A knife sharpener (1), comprising a first grinding drum (2), a second grinding drum (7) and a motor (13) arranged to rotationally drive either or both of the first grinding drum (2) and the second grinding drum (7). A first grinding port...
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WO/2023/241412A2 |
The invention relates to a polishing apparatus, a polishing method and a sealing system. The sealing and polishing apparatus comprises a thrust system; a plurality of sealing systems, wherein each sealing system comprises a piston and a ...
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WO/2023/241408A1 |
A surface finishing method for a micro internal flow channel, a micro internal flow channel workpiece, and a finishing medium. The bore of the micro internal flow channel is less than or equal to 3 mm, and the length-to-diameter ratio of...
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WO/2023/241413A1 |
A pressurizing container, comprising the following segments sequentially distributed from upstream to downstream: a first straight line segment (11) having a length-to-diameter ratio of greater than 5; a second arc segment (12) that is a...
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/244739A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more ac...
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WO/2023/242729A1 |
A finishing station (1) configured for carrying out chamfers and/or slots on a block (5) of friction material of a brake pad (2) including a robotized articulated arm (8) provided with a head (11) rotating around a first axis (A) and car...
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WO/2023/239393A1 |
Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an elect...
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WO/2023/239421A1 |
A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move ...
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WO/2023/239419A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and th...
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WO/2023/240260A1 |
A chemical mechanical polishing (CMP) slurry can comprise a plurality of particles distributed in a carrier, wherein at least a portion of the particles of the plurality of particles can have a body including a core comprising zirconia a...
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WO/2023/238452A1 |
[Problem] To provide a grinding system in which the main body of a glass plate can be firmly fixed and which, when the peripheral edges of the main body of the glass plate are ground by pressing the lateral surface (cylindrical portion) ...
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WO/2023/239420A1 |
A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a...
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WO/2023/234595A1 |
According to one embodiment of the present invention, provided are a magnesium alloy molded product and a method for manufacturing same, the method comprising: a first step of extruding a magnesium alloy billet into a pipe with a predete...
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WO/2023/233681A1 |
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of l...
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WO/2023/230846A1 |
A dovetail grinding fixture for a machine tool comprises a bottom plate and a workpiece, one end of the bottom plate is provided with a baffle, the other end of the bottom plate is provided with a second clamping piece, and three fixing ...
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WO/2023/234555A1 |
Transparent ceramic glass for a cooktop, according to one embodiment, may comprise: a glass material including an uneven layer etched on the upper surface thereof; an upper print layer formed on the upper part of the uneven layer; and a ...
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WO/2023/231063A1 |
A grinding device and grinding method for the periphery of an output shaft. The grinding device comprises at least one grinding unit; the grinding unit comprises a mandrel assembling and disassembling mechanism, a grinding mechanism, and...
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WO/2023/234389A1 |
The present invention addresses the problem of providing a wood-cutting cutter which is used for the cutting processing of a woody material and that can be easily reground. The wood-cutting cutter has a hardened layer provided on a sur...
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WO/2023/234998A1 |
Methods and systems for thinning a device wafer to tens of micron, micron, or sub-micron thicknesses are disclosed. Device wafers are thinned by using a two-step grinding process and a chemical mechanical polish (CMP) process. One or mor...
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WO/2023/233035A1 |
The invention relates to a profiled grinding tool (7) for rotatingly machining workpieces, in particular gearwheels and/or gears, comprising a main body, which has at least one device, in the form of a preferably hollow-cylindrical shape...
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WO/2023/234152A1 |
This superabrasive wheel comprises: a polishing surface which is disposed on the grinding surface of the superabrasive wheel and has a polishing layer including superabrasives; and a dressing surface which is disposed on the grinding sur...
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WO/2023/234974A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/231061A1 |
A fully automatic machining system for an output shaft and a machining method therefor. The machining system comprises a feeding and screening mechanism, a first conveying mechanism, a bushing press-fitting mechanism, a second conveying ...
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WO/2023/235582A1 |
A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier h...
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WO/2023/234663A1 |
According to one embodiment of the present invention, provided are a magnesium alloy molded product and a processing device therefor, the device comprising: a support unit that rotatably supports an object to be processed; at least one h...
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WO/2023/235681A1 |
The subject application relates to a thin wheel with glass reinforcing member, in particular, an abrasive article with an abrasive portion and a reinforcing member. The abrasive portion can include abrasive particles and a bond material....
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WO/2023/234186A1 |
Provided is a working machine including a satisfactory illuminating device. In a grinder 10, illuminating devices 80 are provided in both left and right side portions of a rear end portion of a gear housing 27, and are disposed above a...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/231266A1 |
A heating and ventilation metal pipeline repair device, which comprises a housing (1). Four first rotating grooves (2) are provided at the upper end of the housing (1). A first fixing block (3) is fixedly arranged on each of the first ro...
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WO/2023/231316A1 |
A super-finishing method for a cemented carbide coating of a surface of revolution, comprises the following steps: spraying an outer spherical surface of a surface of revolution part with a cemented carbide coating by means of a spraying...
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WO/2023/234973A1 |
A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relati...
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WO/2023/228579A1 |
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which m...
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WO/2023/229009A1 |
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate. One aspect of the present disclosure pe...
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WO/2023/229660A1 |
The invention relates to a brake disc arrangement (86) having a brake disc (12) that has a friction ring (14) and a brake disc pot having an opening concentric to a central brake disc axis, which opening is delimited by a boundary which ...
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WO/2023/228787A1 |
The present invention provides a method for producing a ground wafer, wherein a ground wafer is produced by grinding a starting material wafer that has a first main surface and a second main surface, the method comprising: a first resin ...
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WO/2023/229658A1 |
A carrier head for chemical mechanical polishing includes a housing, a substrate mounting surface, and a retaining ring assembly. The retaining ring assembly includes an inner ring surrounding the substrate mounting surface and having an...
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WO/2023/228434A1 |
[Problem] To provide a tip dresser that is capable of, when performing resistance welding, applying appropriate electric current and voltage to a welding spot. [Solution] The present invention comprises: a rod-like member 10 which has ...
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