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WO/2003/083179A1 |
The invention relates to a transfer and insulation device (1) for electrically insulating electrodes, particularly anodes (2) and cathodes (3), used in the electrolytic cleaning of metals, from each other in an electrolytic tank (4), for...
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WO/2003/080899A1 |
The formation of a groove wiring or a via contact which causes no retreat of a metal section by overpolishing by removing a section carrying little current which locally rises in a wafer face with the progress of electropolishing. In an ...
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WO/2003/080898A1 |
An electrochemical machine capable of flattening a conductive material provided on the surface of a substrate or removing (cleaning) matters adhering to the surface of a work, e.g. a substrate, while eliminating the CMP processing itself...
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WO/2003/076134A1 |
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configure...
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WO/2003/076087A1 |
A method for removing solder and other debris from electrical contacts comprising: coupling a positive lead of a power source to the electrical contacts to be cleaned; coupling a negative lead of the power source to a collection plate; p...
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WO/2003/074768A1 |
The problem confronting manufacturers of printed circuit boards (2) of differing thickness is that, as the current density increases and the diameter of the holes decreases, the treatment effect on various locations on the outer side of ...
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WO/2003/072287A1 |
The present invention generally provides methods for fabricating implantable medical devices having microstructures. In one aspect, a method of fabricating an implantable medical device having microstructures for enhancing therapeutic de...
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WO/2003/072511A1 |
A mediated electrochemical oxidation process is used to treat, oxidize and destroy halogentaed hydrocarbon waste materials and combined waste. The halogenated hydrocabon waste materials are introduced into an appartatus for contacting th...
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WO/2003/066939A1 |
An electrolytic recycling device capable of minimizing insoluble sludge produced when etching fluid containing metal ions is recycled in a recycling tank having electrodes therein and eliminating the need of specially installing a sludge...
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WO/2003/064734A1 |
This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolyti...
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WO/2003/065432A1 |
The present invention alleviates workloads in chemical-mechanical polishing (CMP) by replacing all or a portion of the substrate processing by means of chemical-mechanical polishing with electrolytic processing using deionized water, ult...
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WO/2003/064733A1 |
The invention relates to a method for electrically contacting a flat product in electrolytic transport systems wherein the distance between anode and cathode is such that the product can be transported in a contactless manner into the el...
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WO/2003/062499A2 |
The invention relates to a device and a method for the electrochemical metallisation, etching, oxidisation and reduction of items by means of a pulse flow having an extremely high frequency and pulse edge steepness. The invention also re...
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WO/2003/061905A1 |
Systems and methods for detecting the endpoint of a polishing step. In general, an electropolishing system is provided with a power supply configured to deliver a current through an electrolytic solution. Signal characteristics of the si...
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WO/2003/060962A2 |
An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, o...
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WO/2003/060963A2 |
An edge cleaning system and method is disclosed in which a directed stream of a mild etching solution (230) is supplied to an edge area of a rotating workpiece (100), including the front surface edge and bevel, while a potential differen...
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WO/2003/058696A1 |
A current concentration caused by an additive (especially, a brightener) remaining/depositing at a high density at a grain boundary triple-point and in a wiring groove portion in a copper-plating film surface layer is eliminated to restr...
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WO/2003/057948A1 |
There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolyt...
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WO/2003/057934A1 |
An aluminum alloy plate for a lithographic printing form, characterized in that it has a chemical composition, in wt %: Fe: 0.1 to 0.6 %, Si: 0.02 to 0.2 %, Cu: 0.001 to 0.02 %, Zn: 0.01 to 0.1 %, Mg: 0.005 to 0.1 %, Ti: 0.001 to 0.05 %,...
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WO/2003/054255A1 |
There is provided an electrolytic processing apparatus and method that can effect processing of a workpiece with high processing precision and can produce an intended form of processed workpiece with high accuracy of form.The electrolyti...
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WO/2003/053847A2 |
A family of discrete and uniformly sized silicon nanoparticles, including 1 (blue emitting), 1.67 (green emitting), 2.15 (yellow emitting), 2.9 (red emitting) and 3.7 nm (infrared emitting) nanoparticles, and a method that produces the f...
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WO/2003/052165A1 |
Environment-friendly process for descaling, pickling and finishing/passivating in a continuous, integrated and flexible manner, applicable to any type of stainless steel, regardless of its physical structure, chemical composition and nat...
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WO/2003/048423A1 |
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblY (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wo...
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WO/2003/046262A1 |
A surface of an electrolytically dissolvable material, e.g. , an electrolytically dissolvable metal (402), is smoothed by two-step electrochemical process wherein the surface to be smoothed (402) and a counterelectrode (408) are contacte...
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WO/2003/046263A1 |
There is provided a method and device for regenerating an ion exchanger which can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A meth...
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WO/2003/042433A1 |
In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on a wafer (1004). An apparatus includes a wafer chuck (1002) for holding a wafer, an actuator (1000) for rotat...
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WO/2003/041462A2 |
The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemi...
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WO/2003/041147A1 |
An anodic oxidizer which enables the uniform photoirradiation of a treatment part of a target substrate and the more uniform anodic oxidation in the plane of the target substrate, and an anodic oxidation method. The anodic oxidizer compr...
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WO/2003/041126A2 |
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...
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WO/2003/038852A1 |
The invention relates to a method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon. Before the etching takes place, a protective film, comprising pattern...
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WO/2003/038160A1 |
A storage stable hydrogen cell comprising an anode cap subassembly (20), cathode can subassembly (30), and a grommet (40) is disclosed. For one embodiment the cathode (36) in the cathode can subassembly is configured for contact with the...
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WO/2003/035944A1 |
Electrolytic stripping solutions, which incorporate the novel use of oxoacids and/or oxoacid salts, and hydrogen peroxide, have been formulated for the rapid removal of electroless nickel from iron, steel, aluminum, and titanium alloys a...
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WO/2003/036693A2 |
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
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WO/2003/030223A2 |
There is a provided a substrate processing apparatus that can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel...
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WO/2003/029531A2 |
There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surfac...
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WO/2003/026832A1 |
A method of forming a perforate membrane (1) is disclosed for use in a liquid transport device. The membrane has at least plural nozzles (10) formed therethrough. Each of those nozzles has a throat portion (12) opening at opposite end th...
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WO/2003/027359A2 |
A system and process for chemical milling or cleaning a surface portion (103) and/or surface deposit (12, 52, 220) from metal products (14, 54, 100, 202), such as chemically milling a metal member (14, 54, 100, 202) to remove surface def...
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WO2002077327B1 |
The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate when the mask plate surface is disposed on ...
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WO2002027814A9 |
An exemplary embodiment of the regenerative electrochemical cell system comprises: a fuel cell module comprising a fuel cell oxygen inlet in fluid communication a water storage device, and a fuel cell hydrogen inlet in fluid communicatio...
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WO/2003/024172A2 |
Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a ...
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WO/2003/023079A1 |
There is disclosed an AI alloy suitable for processing into a lithographic sheet, the alloy having a composition in wt%: Fe up to 0.4; Si up to 0.25; Ti up to 0.05; Cu up to 0.05; Zr up to 0.005; Cr up to 0.03; Ni up to 0.006; V up to 0....
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WO/2003/023839A1 |
A method of making improved substrates for desorbing and ionizing analytes takes an n-type semiconductor substrate and provides a strong light source. By focusing the illumination from the light source onto the n-type semiconductor subst...
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WO/2003/019641A1 |
A semiconductor structure for providing metal interconnections (140) and a method for electropolishing a metal layer on a semiconductor structure. A semiconductor structure includes a dielectric layer (151) with recessed areas (151r) and...
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WO/2003/015870A2 |
A radiolabeled implantable device includes a base, a first layer including Cu and a radioactive isotope on the base, and a second layer including Sn on the first layer. Preferably, the base is formed of stainless steel and the radioactiv...
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WO/2003/017330A2 |
A method for planarizing and electropolishing a conductive layer on a semiconductor structure includes forming a dielectric layer with recessed areas and non-recessed areas on the semiconductor wafer. A conductive layer is formed over th...
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WO/2003/012162A1 |
A uniform, controllable method for electrochemically roughening an aluminum-comprising surface to be used in a semiconductor processing apparatus is disclosed. Typically the aluminum-comprising surface is aluminum or an aluminum alloy. T...
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WO/2003/010353A1 |
The invention relates to stainless steel fibers obtained by bundled drawing of stainless steel wires embedded in a matrix material. The composition of the stainless steel fibers comprises iron and the following components expressed in pe...
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WO/2003/009321A1 |
An aluminum foil for an electrolytic capacitor which comprises a foil base material and, attached to the surface thereof, zinc phosphate composite particles comprising zinc and phosphorus or zinc phosphate composite particles comprising ...
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WO/2003/008336A2 |
A method for pretreating waste water for use in reverse osmosis filtration is provided. Small amounts of chemicals are added to the waste water to promote formation of filterable particles from collodial and dissolved solids. These parti...
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WO/2003/002774A1 |
The invention relates to a method for the removal of metals From their aqueous solution with lime precipitation, in conditions where a precipitate of metal hydroxide and gypsum is formed, which settles well and is easy to filter. The met...
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