| Document |
Document Title |
|
WO/2004/067810A1 |
A method of manufacturing a cut electroforming member and a cut electroforming member made by it are disclosed, in which an electroforming process is performed in an electroforming tub by connecting a negative electrode to a core materia...
|
|
WO/2004/065665A1 |
The invention relates to an electrochemical treatment of flat articles which are electroconductive at least on the surface thereof. Said invention is used for continuously operating or immersed devices in particular for accurately treati...
|
|
WO/2004/065049A1 |
A system and method are described for holding and releasing a workpiece (108) for electrochemical machining. In one embodiment, a workpiece holder (104) has a workpiece surface that couples to the workpiece when negative pressure is appl...
|
|
WO/2004/061165A1 |
A method of applying an electrochemical influence to a component of a machine, in situ, comprises connecting the component, while in situ, into an electrolysis system so that the component functions as at least one electrode of the syste...
|
|
WO/2004/057063A1 |
The invention relates to a method for improving the interaction between an electrolyte and a component. In many different engineering fields, components are placed in contact with electrolyte, thereby producing an interaction therebetwee...
|
|
WO/2004/057065A1 |
Disclosed is a method for removing surface areas (19), which makes use of gas bubbles (25) located within said surface area (19) in order to form cracks and consequently remove surface areas (19).
|
|
WO/2004/057067A1 |
The invention relates to a method for removing surface areas of a substrate. In a present state-of-the-art, electrolytic processes used for removing surface areas are time-consuming and costly. The inventive method for removing the surfa...
|
|
WO/2004/057066A1 |
In a present state-of- the- art, electrolytic processes used for removing surface areas are time-consuming and costly. The inventive method for removing the surface areas makes it possible to produce at least one gas bubble (25) on the s...
|
|
WO/2004/054699A2 |
Structural components are contacted in many domains of technology with a medium, whereby for example a chemical or electrochemical interaction between the medium and the structural component is desired. Often, the interaction is not suff...
|
|
WO/2004/053972A1 |
A lead frame and its manufacturing method are disclosed. The lead frame is detachably formed on overlapped electrode bases having the same pattern as that of the lead frame by performing an electroforming process in a lead frame master i...
|
|
WO/2004/045739A2 |
Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the proc...
|
|
WO/2004/044273A1 |
The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with ...
|
|
WO/2004/041477A1 |
A surface treatment method for a vacuum member utilized in all fields such as a medical field, an engineering field, an agricultural field, and the like, characterized in that the inner surface of the vacuum member is mechanically polish...
|
|
WO/2004/035876A1 |
The invention relates to a novel method for cleaning and passivating the surfaces of Al or Mg-containing light alloys. The inventive method can be used especially for preparing a coating, for example a metallisation without using externa...
|
|
WO/2004/033384A1 |
A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) s...
|
|
WO/2004/034452A1 |
An electrolytic processing apparatus has at least one processing electrode (86) and at least feeding electrode (86) disposed on the same side as the processing electrode (86) with respect to a substrate (W). An organic compound having an...
|
|
WO/2004/033765A1 |
An electrode (1, 2) for electrolytic processing has a conductive material (1a, 2a) and an organic compound (1b, 2b) having an ion exchange group. The organic compound (1b, 2b) is chemically bonded to a surface of the conductive material ...
|
|
WO/2004/028673A1 |
The present invention relates to an apparatus having a nanodevice (1) for controlling the flow of charged particles in an electrolyte. Such apparatus comprises an electrolytic bath container (2) divided by a polymeric membrane foil (3) i...
|
|
WO/2004/022814A2 |
A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this pr...
|
|
WO/2004/020148A1 |
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus includes a support member configured to releasably carry a microelectronic ...
|
|
WO/2004/017384A1 |
The invention relates to a device for etching semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. At least one sample head is mounted inside a displaceably mounted etching trough and sa...
|
|
WO/2004/016833A2 |
The invention relates to a process of reducing scaling of a metal surface exposed to an aqueous solution from which scale may form after a period of exposure. The process comprises applying a cathodic potential to the surface for at leas...
|
|
WO/2004/012206A2 |
A mixed waste mediated electrochemical oxidation process (MEO) process and apparatus for the dissolution of transuranic elements (e.g., plutonium, neptunium, americium, curium, and californium), and/or compounds thereof in transuranic wa...
|
|
WO/2004/011699A1 |
The invention relates to a method for improving the quality of an object made of a copper-based metal alloy, according to which method the object is treated at least in an oxide removal unit (3), so that in the oxide removal unit, oxides...
|
|
WO/2004/010477A2 |
A metal layer formed on a semiconductor wafer is polished, where the metal layer is formed on a barrier layer, which is formed on a dielectric layer having a recessed area and a non-recessed area, and where the metal layer covers the rec...
|
|
WO/2004/009880A1 |
The present invention relates generally to any electrolyte and methods for monitoring the consituents contained therein. More specifically, the present invention relates to platingbaths and methods for monitoring the constituents contain...
|
|
WO/2004/007811A2 |
In manufacturing integrated circuits voids in the metal layer may readily form during electrolytic metal deposition. In order to avoid these faults which adversely affect the functionality of the circuits, the invention suggests to utili...
|
|
WO/2004/007812A1 |
The instrument concerns a method for electrolytic polishing of dental instruments made of nickel-titanium alloy using an electrolyte comprising sulphuric acid and methanol. The electric power supply is provided by applying a current wher...
|
|
WO/2004/006419A2 |
An apparatus and method for improving the accuracy of Electrochemical Capacitance Voltage (ECV) profiling measurements by alerting the operator to the presence of surface films or gas bubbles during the etching process and by using this ...
|
|
WO/2004/003260A1 |
The invention relates to an electrochemical method for the cleaning surfaces of metallic work pieces and an electrode (1) for the electrochemical cleaning of surfaces of metallic work pieces (2), especially surfaces in the region of weld...
|
|
WO/2004/001099A2 |
The invention relates to a composition for treating the surfaces of metals and for depositing metals or metal alloys on plastic surfaces. Said composition contains: a) at least one polymer, as constituent A, containing at least one struc...
|
|
WO/2003/106090A1 |
A method for selectively removing a layer of electrolytically dissoluble metal from a substrate comprising providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, said metal layer serving; a...
|
|
WO/2003/105546A1 |
The device in accordance with the invention and the method serve to treat flat and flexible work pieces (1) with a fluid, preferably in electroplating plants and etching facilities. The device and the method permit to place foil-type wor...
|
|
WO/2003/098673A1 |
A polishing method and a polishing system in which accurate and stabilized electrolytic polishing is realized by controlling the potential of a working electrode correctly, and a method for fabricating a semiconductor device utilizing th...
|
|
WO/2003/097317A1 |
A method for releasing a metal-resin joint which comprises a step (1) of immersing an article having the metal-resin joint in an alkaline solution together with a counter electrode and a step (2) of applying a voltage between a metal par...
|
|
WO/2003/098676A1 |
There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of ...
|
|
WO/2003/095704A1 |
A method for efficiently descaling a pipe or the like. A descaling target with a deposit of scales is to be coated with a solvent at least on the scaled side. Supplying a coil with a frequency signal forms a magnetic field. A descaling t...
|
|
WO/2003/092945A1 |
An electrolytic polishing method in which conductivity is enhanced without causing aggregation or precipitation of abrasive grains and good planarization is realized without causing any defect in a metal film or wiring to be polished. In...
|
|
WO2003011521B1 |
Generally, a method and apparatus for electro-chemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electro-chemical polishing apparatus generally includes a substrate support having a plurality of ...
|
|
WO/2003/092944A1 |
Highly accurate polishing method and polishing system in which an excess metal film (18) can be removed readily and efficiently at the time of planarizing it (18) by polishing. A substrate (17) on which the metal film (18) is formed and ...
|
|
WO/2003/092891A1 |
A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to sepa...
|
|
WO/2003/090964A1 |
A polishing system and a polishing method in which the current density distribution can be kept substantially constant in the wafer plane while suppressing variation in the composition of electrolyte (2), or the like, between a wafer (3)...
|
|
WO/2003/090965A1 |
A polishing method capable of energizing a polished object to the end of polishing with a stable current density distribution and allowing to use the other equipment such as conventional plating equipment and washing equipment and to per...
|
|
WO/2003/091482A1 |
A process for producing an aluminum material for electrolytic capacitor electrode, comprising subjecting in sequence an aluminum slab to hot rolling, cold rolling and final annealing, which process includes a step of, after the hot rolli...
|
|
WO/2003/090792A2 |
A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined temperature T1 to form an ozone-solvent soluti...
|
|
WO/2003/089691A1 |
A device is disclosed having an electro-cleaning (14) and steam cleaning portion (16). A tank (18) is supported within the electro-cleaning portion and is connectable to an electric potential (20). An insert (28) with a support surface (...
|
|
WO/2003/087436A1 |
In one aspect of the present invention, exemplary apparatus and methods are provided for electropolishing and/or electroplating processes for semiconductor wafers. One exemplary apparatus includes a cleaning module having an edge clean a...
|
|
WO/2003/088352A1 |
One aspect is directed to an improved method for polishing an integrated circuit. According to one aspect, metal features deposited on an integrated circuit are polished using electropolishing techniques. Because electropolishing is used...
|
|
WO/2003/087438A1 |
The invention relates to a novel method for cleaning and passivating zinc and zinc alloy surfaces. The inventive method is especially suitable for preparing a coating, for example a metal coating.
|
|
WO/2003/085174A2 |
The prior art uses electrochemical methods to remove surface areas of a metallic component. According to the invention, the electrochemical process is accelerated by using a current pulse transmitter (16).
|
