| Document |
Document Title |
|
WO/2005/071142A1 |
A method and apparatus for stripping electro-deposited metal sheets from a cathode blank. The blank (14) has opposite faces (16) and (18), upstream and downstream ends. The apparatus comprises a stripping assembly (30) for stripping th...
|
|
WO/2005/068088A1 |
Methods for deoxidizing metallic surfaces are disclosed. Such a method may include contacting a surface of a metal strip (102) with one or more chemical solutions until a potential drop across a thickness of the metal strip (102) is less...
|
|
WO/2005/068689A1 |
The invention relates to a method for the electrochemical removal of layers from components. According to the invention, a working point for the removal of electrochemical layers is determined prior to the actual electrochemical removal ...
|
|
WO/2005/066395A2 |
A method of cleaning or polishing an alloy comprising at least one noble metal and at least one non-noble metal said method comprising the step of submerging said alloy in an electrolytic acidic bath comprising at least one complexing ag...
|
|
WO2004111314B1 |
Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In o...
|
|
WO/2005/060379A2 |
Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to co...
|
|
WO/2005/059970A2 |
An electropolishing process in integrated circuit fabrication on a wafer includes applying a stream of electrolyte to the wafer using a nozzle positioned adjacent to the wafer with a gap between the nozzle and the wafer. The removal rate...
|
|
WO/2005/047572A1 |
An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One o...
|
|
WO/2005/042160A2 |
A reactor defines a reaction chamber for processing a substrate. The reactor comprises a first inlet for providing a first reactant and to the reaction chamber and a second inlet for a second reactant to the reaction chamber. A first exh...
|
|
WO/2005/042810A2 |
This invention provides a membrane-mediated electropolishing process for polishing and/or planarizing metal work pieces. The work piece is wetted with a low-conductivity fluid. The wetted work piece is contacted with a first side of a ch...
|
|
WO/2005/038096A1 |
An electrode device with integrated electrolyte supply for the treatment of metals, comprises a nozzle (2) connected with the unipolar electric current supply (7, 16) from an external apparatus, the other pole being connected with the me...
|
|
WO/2005/038877A2 |
A MACs mitigation system includes a MACs film removal sub-system (14) and a wafer surface sustaining subsystem (16) for sustaining or maintaining the cleaned surface (I 8A) of a wafer (18) in a substantially MACs-free condition for som...
|
|
WO/2005/031846A2 |
The removal of contaminant phases by etching processes is an important methodological step in the production of thin-layer solar cells which are made from chalcopyrite semiconductors. The etching method known from DE 100 22 652 C2 uses a...
|
|
WO/2005/024098A2 |
A method for making a ferritic stainless steel article having an oxidation resistant surface includes providing a ferritic stainless steel comprising aluminum, at least one rare earth metal and 16 to less than 30 weight percent chromium,...
|
|
WO/2005/024099A1 |
The invention relates to a method for electropolishing light metal alloy surfaces containing a portion of silicon greater than 3 wt. % in an electrolyte which essentially contains phosphoric acid. The surface is anodically connected and ...
|
|
WO/2005/019494A1 |
A method for dry treating a sputtering target using a sputtering ion plasma at low power to effectively reduce burn-in time of the target; the target so produced; and apparatus (2) used for the target treatment. The apparatus has a rotat...
|
|
WO/2005/012600A1 |
The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can perform processing of a substrate without destroying devices formed in the substrate even when a fragile mateiral is empl...
|
|
WO/2005/008806A2 |
A photoelectrochemical cell which includes a light transmissive enclosure, a semiconductor photoanode disposed within the light transmissive enclosure, a semiconductor photocathode disposed within the light transmissive enclosure, and an...
|
|
WO/2005/006425A1 |
The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can effectively prevent the formation of pits that would impair the quality of the processed product. The electrolytic proces...
|
|
WO/2005/005693A1 |
Disclosed is a reel-to-reel substrate tape polishing and cleaning system including precleaning, electropolishing section and post cleaning sections and which is suitable for polishing and cleaning long lengths of metal substrate tape use...
|
|
WO/2005/004941A1 |
The invention relates to cementable metallic endoprostheses having areas, which are provided for anchoring in the cement and which are electrochemically or chemically polished, and to a method for the production thereof. The invention pa...
|
|
WO/2005/002794A2 |
The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly...
|
|
WO/2005/000512A1 |
A rotation surface-reducing head having a disk-like head pedestal and a rotary shaft, characterized in that disposed in the outer periphery of the lower surface of the head pedestal are two ore more electrodes and grindstones or grindsto...
|
|
WO/2004/113595A1 |
The invention relates to an electrolytic marking unit, comprising a body (2), with supports (5,6) which can be displaced with relation to each other, on which an exchangeable electrolyte reservoir (15,22) is arranged, a marker element (2...
|
|
WO/2004/112065A1 |
The surface of a cold-rolled aluminum material is brought into contact with an aqueous acid solution, and then annealing is conducted under the conditions satisfying the following relationship between (x) and (y): 1.5 hours ≤ x < 8 hou...
|
|
WO/2004/112066A1 |
An aluminum material for electrolytic capacitor electrodes is produced by bringing the surface of a cold-rolled aluminum material into contact with an aqueous acid solution containing one or more acids selected among sulfuric acids, hydr...
|
|
WO/2004/111146A1 |
A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The ...
|
|
WO/2004/108358A2 |
Embodiments of a polishing article for processing a substracte are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer ma...
|
|
WO/2004/106592A1 |
Apparatus (1) for the recovery of synthetic diamonts from capsules includes a plurality of enclosures (2), in this embodiment bags, formed from an ion permeable membrane (3) each having a plate-like anode (5) centrally positioned therein...
|
|
WO/2004/101860A1 |
Disclosed is a solution for an electrochemical process, the solution containing a sulfonic acid and having a low concentration of sulfur compounds, either low or high valence, that are susceptible to reduction and which is intended for u...
|
|
WO/2004/099469A2 |
In accordance with the invention, a surface of a substrate is patterned by the steps of providing the substrate, covering the surface with electrolyte, and disposing at least one nanoscale electrode in the electrolyte adjacent the surfac...
|
|
WO/2004/100283A2 |
The invention relates to electrolytes for electrochemically polishing workpieces consisting of titanium, titanium alloys, niobium, niobium alloys, and tantalum and tantalum alloys, and containing sulphuric acid, ammonium bifluoride and a...
|
|
WO/2004/097070A1 |
Operationally-stressed components are often returned to use by means of an acid treatment. The duration during which the component remains in the acid is conventionally fixed at a standard value, such that individual stresses are not tak...
|
|
WO/2004/097078A1 |
The present invention provides an electrolytic processing apparatus which can suppress the growth of a gas, which is inevitably generated during electrochemical processing, into bubbles thereby effectively preventing the formation of pit...
|
|
WO/2004/097907A2 |
The invention relates to a method for the production of permeable membranes, made from semiconductor materials, by means of electrochemical etching of macropores on a plane side of an essentially planar semiconductor, comprising the step...
|
|
WO/2004/097077A2 |
The invention relates to a method for the production of permeable membranes made from semiconductor materials, by electrochemical etching of macro-pores on a plane side of an essentially planar semiconductor, whereby mesopores are etched...
|
|
WO/2004/095571A1 |
The present invention provides a substrate processing method that can perform improved flattening and processing upon the formation of interconnects. The a substrate processing method includes a step of eliminating a level difference in ...
|
|
WO/2004/094107A1 |
A conductive polishing pad (10) that includes one or more anodes (24) and one or more cathodes (26) formed at or near the polishing surface of a polishing pad. The anodes and cathodes are connected to a wiring network (52) that is part o...
|
|
WO/2004/088004A1 |
The present invention relates to a method for reducing the degradation of reactive compounds during transport of such reactive compounds from one location to another location by electropolishing the surface that the reactive compound con...
|
|
WO/2004/085716A1 |
A release agent for electrolytic silver. The release agent contains no cyanide, has a long life, and is highly effective in silver release from edge sides. It inhibits the necessary silver surface parts from having unevenness of surface ...
|
|
WO/2004/083494A1 |
A composite machining device for reliably machining a conductive material such as a copper film with a low surface pressure and with a high rate while effectively preventing, e.g., a pit. The composite machining device comprises a machin...
|
|
WO/2004/079809A1 |
An electropolishing process endpoint detection method is described. The method is applicable to the electropolishing of a metal layer under a fixed current or voltage, wherein a voltage current detector is installed in the electropolishi...
|
|
WO/2004/078411A2 |
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conduc...
|
|
WO/2004/077526A2 |
A UV detector (10) has a UV detection thin film of coated spherical silicon nanoparticles formed upon a substrate (12). The detector includes structures to bias the thin film. In preferred embodiments, a thin conductor (18) that is at le...
|
|
WO/2004/074545A1 |
A film-forming apparatus component having a structure that enables to separate an adherent film (d) formed on the component in a shorter time than conventional and to reduce damages caused by a cleaning liquid (S) is disclosed. A method ...
|
|
WO/2004/073926A1 |
A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture...
|
|
WO/2004/072332A1 |
A polishing fluid for polishing a surface of a substrate which has a copper film deposited on the surface so that the copper comes into minute recesses. It is characterized by containing at least one of water-soluble inorganic acids or s...
|
|
WO/2004/070088A1 |
An electrolytic solution formulation for an electropolishing process comprises at least an acid solution and an organic additive. The acid solution includes phosphoric acid or a mixture of phosphoric acid and sulfuric acid solutions, whi...
|
|
WO/2004/069437A1 |
A method for removing cross-linked polymers from metal structures involves, in a first embodiment, the introduction of the metal structure into a bath consisting of a concentrated acid and the subsequent action of megasonic energy. In a ...
|
|
WO/2004/067811A1 |
A method of manufacturing a cut electroforming member which has a stepped form and a cut electroforming member made by it are disclosed, in which a nonconductive section is formed in a core material and the cut electroforming member has ...
|
