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JP4598356B2 |
To provide a technology for performing a wafer-level burn-in and test. The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with...
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JP4590032B2 |
Disclosed is a probe arrangement assembly comprising a conductive foil, a plurality of supporting body-corresponding sections formed in the conductive foil, and contact terminal-corresponding members each fixed to one end of each of the ...
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JP2010266465A |
To miniaturize an electric connection mechanism between electronic components. This invention is directed to a method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the m...
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JP4563043B2 |
A power transmission mechanism of a model vehicle capable of mechanically performing accurate straight running and turning control without relying upon the output characteristic of each drive system in an RC tank having two drive systems...
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JP4560292B2 |
A contact structure for electrical connection with a contact target. The contact structure is formed of a contact substrate mounting a plurality of contactors. Each of the contactors is formed of a silicon base having inclined ends, a si...
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JP4560221B2 |
A method of producing a contact structure for establishing electrical contact with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors in which each of the contactors has a hook shape. Th...
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JP4527777B2 |
Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same. The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method inv...
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JP4521611B2 |
Electrical testing is to be performed on a semiconductor integrated circuit device which the test pads formed. To facilitate such testing, the method of manufacture of the semiconductor integrated circuit device employs a probe card whic...
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JP4465995B2 |
A probe card, and a probe sheet used for the method of testing (producing) a semiconductor device using the probe card, include first contact terminals in electrical contact with the electrodes of a test object formed at a narrow pitch, ...
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JP4454246B2 |
Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process param...
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JP4434426B2 |
A contact structure for achieving an electrical connection with a contact target is formed by producing a contactor on a planar surface of a substrate by a microfabrication technology. The contact structure is comprised of a substrate ha...
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JP4430621B2 |
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JP4427239B2 |
A stress-balancing layer (130) is formed over portions (122) of a spring metal finger (120) that remain attached to an underlying substrate (101) to counter internal stresses inherently formed in the spring metal finger (120). The (e.g.,...
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JP4412143B2 |
An inspection device includes a substrate; a stress relieving layer that is provided on the substrate; a contact that is provided on the stress relieving layer; and a wiring pattern that is electrically connected to the contact. Furtherm...
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JP4388620B2 |
A probe card which comes in contact with electrodes of electric components so as to test characteristics of the electric components, includes: a printed board having a plurality of first transmission lines; a build-upboard, attached on t...
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JP4382593B2 |
A method for manufacturing a probe unit includes: (a) preparing a substrate; (b) forming a hollow part in the substrate; (c) forming a sacrificial layer that buries the hollow part on the substrate; (d) forming a first layer on the subst...
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JP4378481B2 |
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wa...
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JP4355127B2 |
A contactor block for a probe card used in testing integrated circuits is characterized by including a beam-like holder (34) having an underside and a retreat portion formed on a side following the underside; and a contact sheet (40) pro...
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JP4308938B2 |
An integrated probe tip (20) parameter measuring device (70) is integrated onto the chuck (24) or substrate holder of a probe test station (10). Probe tip (20) force can be simultaneously measured for either a single probe tip, several p...
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JP4295220B2 |
The present invention relates to a hollow microprobe using an MEMS technique and a method of manufacturing the same. A method of manufacturing a hollow microprobe using an MEMS technique according to the present invention comprises: a st...
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JP4278982B2 |
The invention relates to a method of forming a molded surface on a substrate (32) using a stamping tool (34) having at least a portion that is translucent, said method comprising pressing said stamping tool (34) into a layer (30) of mold...
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JP4216823B2 |
Probe pins related to the present invention are formed from a material which consists essentially of one or more elements selected from the group consisting of platinum, iridium, ruthenium, osmium, palladium and rhodium. A material obtai...
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JP4190828B2 |
A probe testing apparatus reads the surface shape of a contact pad in pressure contact with a contact probe, and differentiates the read surface shape to extract a multiplicity of flat parts. Next, the probe testing apparatus complements...
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JP4185325B2 |
An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which t...
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JP4188546B2 |
To provide a technology for performing a wafer-level burn-in and test. The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with...
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JP2008275646A |
To provide a microelectronic contact structure and its manufacturing method.The method for mounting two or more spring contact elements to the terminals of an electronic component includes fabricating the two or more spring contact eleme...
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JP4150695B2 |
A plurality of contact elements, such as contact bumps or free-standing spring contacts (710) including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates (702) which, in turn, are mou...
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JP4125598B2 |
A probe head assembly (66) for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer (74, 76) portion formed from a plurality of laminated metallic layers (74a-74e, 76...
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JP4124520B2 |
The holder for an electroconductive contact unit according to the present invention uses a silicon wafer having a laminated structure including a first silicon layer, second silicon layer and silicon oxide film which is disposed between ...
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JP2008141211A |
To provide a technology for performing a wafer-level burn-in and test.The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with ...
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JP4092361B2 |
An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure...
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JP4088121B2 |
Contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material. The laser beam can be irradiated, after joining an end of each contact electrode...
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JP4084180B2 |
The contact provides a micro-miniature spring contact for mounting active semiconductor devices. The structure comprises a resilient spring contact (100) with one end (102) being a base end which is mounted to an electronic component. Th...
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JP2008510166A |
A probe has a cantilever arm coupled to a base via an anchor. A surface of the arm facing the base or a surface of the base facing the arm has steps with contact points that contact the base when the arm is depressed. Alternatively, the ...
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JP2008046139A |
To provide a microelectronic contact structure and a manufacturing method for manufacturing the microelectronic contact structure.The method for mounting a plurality of spring contact elements to the terminal of an electronic component i...
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JP4054208B2 |
A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An ...
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JP2008014957A |
To provide a microelectronic contact structure and a method of making the same.A device includes an electronic component including a trench in a surface, a terminal disposed on the surface of the electronic component and spaced from the ...
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JP2007535657A |
A contact of a connector element arranged in an array of connector elements having desirable mechanical and electrical properties simultaneously, as defined by a robust working range. An array pitch is preferably within a range of about ...
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JP4006081B2 |
In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric character...
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JP3996124B2 |
A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surfac...
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JP3996172B2 |
An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure...
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JP3983077B2 |
A probe substrate, wherein step parts (5) are formed at one end of each of a plurality of leads (2) formed in a specified pattern on an insulation base material (1) (for example, resin film), an insulation resin layer (3) is formed on th...
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JP3974389B2 |
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JP3955795B2 |
To provide a method of manufacturing a semiconductor device which allows the production of low-cost and reliable semiconductor devices, by including a process of bringing an inspection device into a reliable contact with electrode pads w...
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JP2007518101A |
An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displa...
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JP3939467B2 |
To provide a semiconductor package assembly which comprises an improved contact structure. In a semiconductor package assembly 611, a board 612 which comprises conductive contact pads on a first surface and a second surface and which is ...
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JP2007134048A |
To provide a method manufacture capable of easily equalizing height of respective bumps, and to improve contact stability of a thin-film sheet with bumps in a card type probe.The method includes steps of: forming a plurality of through-h...
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JP2007512540A |
Methods are provide for making vertical feed through electrical connections structure in a substrate or tile. The vertical feed through (Fig. 2, 10) can be configured to make plated through holes usable for inserting and attaching connec...
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JP2007509352A |
A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes as one or more masks; a step for fabricating the plurality of probes using the mask; and disp...
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JP3888197B2 |
To provide the removing member of foreign matters stuck to a probe tip, which prevents the probe tip from being shaved and from becoming thin and whose life can be prolonged. The removing member of foreign matters stuck to the probe tip ...
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