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WO/2005/124371A1 |
A method for providing alignment of a probe relative to a supporting substrate, comprises the steps of providing the supporting substrate defining a planar surface and an edge, the substrate further defining a first crystal plane, provid...
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WO/2005/122240A1 |
Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same.The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method invo...
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WO2005043594B1 |
A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes (81) as one or more masks (73); a step for fabricating the plurality of probes using the mask...
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WO/2005/103733A1 |
A sheet-like probe in which electrode structure bodies are each composed of a front surface electrode section exposed to the front surface of an insulation layer, projecting from the front surface of the insulation layer, and having a sh...
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WO/2005/103732A1 |
[PROBLEMS] To provide a sheet-shaped probe and a manufacturing method thereof, by which stable connecting conditions are attained even in a microcircuit device of a fine pitch, an electrode structure does not drop from an insulating laye...
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WO/2005/103734A1 |
[PROBLEMS] A sheet-like probe and a method of producing the probe, where the probe can achieve stable connection even for a circuit device having small electrodes with fine intervals, where electrode structure bodies do not come out from...
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WO/2005/103735A1 |
A sheet-shaped probe, a method for manufacturing the probe and application of the probe are provided, by which a small-diameter surface electrode part can be formed, a stable connecting status can be attained even for a circuit device ha...
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WO/2005/103730A1 |
A sheet-like probe has a porous film, and in the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are i...
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WO/2005/103731A1 |
[PROBLEMS] To provide a sheet-shaped probe and a manufacturing method thereof, by which stable connecting conditions are attained even in a microcircuit device of a fine pitch, an electrode structure does not drop from an insulating film...
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WO/2005/076832A2 |
A method for fabricating assembled structures. The method includes providing a tip structure, which has a first end, a second end, and a length defined between the first end and the second end. The second end is a free end. The method in...
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WO/2005/076024A1 |
An interconnect assembly (1) includes a number of interconnects combined in a preferably planar dielectric carrier frame (4) having resilient portions acting as spring members in conjunction with their respective interconnect's rotationa...
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WO/2005/072844A1 |
A power transmission mechanism of a model vehicle capable of mechanically performing accurate straight running and turning control without relying upon the output characteristic of each drive system in an RC tank having two drive systems...
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WO/2005/074328A1 |
Disclosed is an organic EL panel which comprises a light-transmitting supporting substrate and an organic EL device formed on the substrate wherein an organic layer (5) having at least a light-emitting layer (5c) is sandwiched between a ...
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WO/2005/065431A2 |
Embodiments of the present invention are directed to the formation of microprobe tips elements (164) having a variety of configurations. In some embodiments tips (164) are formed from the same building material as the probes themselves, ...
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WO/2005/065432A2 |
Pin probes (102) and pin probe arrays (102) are provided the allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements (202) located within a sheath (204). ...
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WO/2005/065437A2 |
Embodiments of invention are directed to the formation of microprobes (i.e., compliant electrical or electronic contact elements, 404) on a temporary substrate (422), dicing individual probe arrays (404a, 404b, 404c), and then transferri...
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WO2004093252B1 |
An electrical connector includes an electrical contact array (17) having a plurality of contact elements (15) where each contact element has at least one conductive, resilient spring portion.
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WO/2005/064351A1 |
A support (4) for holding a conductive contact holder (1) has a structure of stacking low-thermal-expansion supporting frames (15, 18) having a linear expansion coefficient smaller than that of a body (8) to be touched, and high-thermal-...
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WO/2005/057652A2 |
A connector, and method for forming same, for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element inc...
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WO/2005/057735A1 |
A contact of a connector element arranged in an array of connector elements having desirable mechanical and electrical properties simultaneously, as defined by a robust working range. An array pitch is preferably within a range of about ...
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WO/2005/055369A2 |
Methods are provide for making vertical feed through electrical connections structure in a substrate or tile. The vertical feed through (Fig. 2, 10) can be configured to make plated through holes usable for inserting and attaching connec...
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WO/2005/031376A1 |
Multilayer probe structure (98) for testing semiconductor die are electrochemically fabricated via depositions of one or more materials (94, 96) in a plurality of overlaying and adhered layers. In some embodiments the structures (98) may...
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WO2004001807B1 |
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can...
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WO/2005/003793A1 |
A probe card and a probe sheet used in a testing method (production method) for a semiconductor device using the same has a first contact terminal for electric contact with the electrode of a testing subject object of narrow pitch, a wir...
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WO/2004/113933A2 |
Electronic probe devices (170) are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s) (34), conductive fiber(s) (38), or combination of conductive powder...
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WO/2004/106949A1 |
A photo-fabrication apparatus (1) has a stage (2) for holding a base board (9) thereon, a feeding part (3) for feeding photosensitive material onto the base board (9), a layer forming part (4) for smoothly spreading the fed photosensitiv...
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WO/2004/102208A1 |
A sheet-like probe in which positional deviation between an electrode structure and an electrode under test due to temperature variation can be prevented surely in burn-in test even when a large area wafer having a diameter of 8 inch or ...
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WO/2004/095646A1 |
An anisotropic conductive sheet manufactured at low cost and having electrodes electrically connected properly as required irrespective of the arrangement pattern of the electrodes or even if the pitches of the electrodes are small and t...
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WO/2004/092750A1 |
An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the ...
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WO/2004/092090A2 |
An improved temperature compensated vertical pin probing device having upper and lower spaced die members (56, 58) difining upper (60) and lower (62) pattern of holes therethrough corresponding to the integrated circuit contact pads on a...
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WO/2004/084295A1 |
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wa...
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WO/2004/083980A2 |
A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and ...
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WO/2004/084296A1 |
Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for ...
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WO/2004/070405A1 |
A system and method for optimizing cleaning of a probe card including using the probe card to test the functionality of dies on a wafer, when a die fails the probe test, and the probe reports failure to contact the pads of the die, check...
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WO/2004/059331A2 |
Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control re...
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WO/2004/053976A2 |
A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings...
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WO/2004/049429A1 |
The present invention relates to a probe for testing a flat panel display device, in which a plurality of conductors having a parallel arrangement are stacked between a plurality of other conductors, a probe assembly having the probe, an...
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WO/2004/034068A2 |
A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contactor carrier (222) and a plurality of contactors attached to a contactor carrier. The contactors (230) are inserte...
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WO/2004/030080A1 |
The present invention relates to a hollow microprobe using an MEMS technique and a method of manufacturing the same. A method of manufacturing a hollow microprobe using an MEMS technique according to the present invention comprises: a st...
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WO2003081725B1 |
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs (507), which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the co...
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WO/2004/015762A1 |
An anisotropic conductivity connector wherein the favorable conductivity can be maintained for a long term even if the connector is used repetitively many times or even if the connector is used repetitively in a high-temperature environm...
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WO/2004/010152A1 |
A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has ...
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WO/2004/010153A2 |
Embodiments of an apparatus and method for cleaning the probes of a probe device are disclosed. In an illustrated embodiment, a cleaning apparatus comprises a cleaning member having a cleaning surface and a support member for supporting ...
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WO/2004/008492A2 |
The invention provides a mosaic decal probe, in which a mosaic of probe chips is assembled into a thin membrane (24) that is suspended in a ring (22) which is made of a material that has a TCE matching that of silicon. The membrane is mo...
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WO/2003/101163A1 |
A wiring substrate becoming the base (29) of a bare die carrier produced by forming a wiring film (23) through electrolytic plating on one surface (21a) of a metal plate (21) for forming a protrusion, integrating the metal plate (21) for...
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WO/2003/100445A2 |
A probe measurement system (40-43, 90, 80, 85, 90, 94) for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
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WO/2003/100446A2 |
A probe system for providing signal paths between an integrated circuit (IC) tester (52) and input/output, power and ground pads (54) on the surfaces of ICs (56) to be tested includes a probe board assembly (50), a flex cable (86) and a ...
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WO/2003/079110A1 |
Micro-fabrication forms a plurality of stiff vertical micro probes on the front surface of a ceramic substrate and a plurality of contacts on the back surface of the ceramic substrate. Photolithography, various etching technologies and e...
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WO/2003/075409A1 |
An anisotropic conductive film, and its production method, especially suitable for packaging a semiconductor and sufficiently satisfying the requirements of higher density packaging because short circuit does not occur in the plane direc...
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WO/2003/071289A1 |
A contact structure for electrical connection with a contact target. The contact structure is formed of a contact substrate mounting a plurality of contactors. Each of the contactors is formed of a silicon base having inclined ends, a si...
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