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WO/2000/016107A1 |
An inspection tray comprising a silicon substrate in which a beam or diaphragm, a probe, and wiring are formed. In order to position an inspection chip with high accuracy, a second substrate for alignment is disposed on the substrate. In...
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WO/2000/010016A1 |
A conventional probe card has a very complicated support structure for a probe terminal and difficulty in changing a probe terminal arrangement according to various arrangements of electrode pads of a sample to be inspected. A contactor ...
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WO/2000/007029A1 |
A holder of an electroconductive contactor comprises a silicon wafer having a multilayer structure in which a silicon oxide film having a thickness of, say, around 1 $g(m)m is formed between first and second silicon layers. A small-diame...
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WO/2000/005595A1 |
A grinding chip has substantially identical shape with a semiconductor device, and it can be detachably fitted into a socket (11) for receiving a semiconductor device on a semiconductor tester. The points (15b) of contact pins (15) of th...
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WO/1999/048147A1 |
A process for manufacturing a semiconductor device comprising an electrical characteristic testing step at which a test structural body having electrically independent projections the number of which is equal to that of the test object c...
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WO/1999/036790A2 |
A test probe interface unit for connecting a test device to a semiconductor device, the unit comprising a dielectric baseplate, probes arranged in the same pattern as contact pads of the IC, contacts connecting the probe unit to the test...
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WO/1999/035505A2 |
A method for removing deposits from a probing feature (72) of a probe card (70), the method includes the step of exposing the probing feature of a probe card to a composition (76) that chemically reacts with the deposits on the probing f...
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WO/1999/013494A2 |
A method and device for cleaning an electrical contact (310a). Semiconductor testing device. Process of manufacturing integrated circuits. The method comprises directing electromagnetic radiation (210) at the contact. The electromagnetic...
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WO/1999/005701A2 |
An improved wear resistant bump contact (Fig. 1, item 16) is produced by the inclusion of small particles (18) of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of electroplating of...
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WO/1999/004274A1 |
A conductive contact having a holder member comprising a holed platelike member made of a material with a small coefficient of thermal expansion. When it is used in a high-temperature atmosphere, the thermal expansion of the holder membe...
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WO/1998/052052A2 |
The invention relates to a magnet core for current sensors made of a soft magnetic alloy (5-7, 11, 12) and comprising at least two bent or buckled alloy strip sections. The invention also relates to a magnetic core with a primary limb (7...
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WO/1998/045716A1 |
The invention concerns a method for making cards with multiple contact tips in particular for testing semiconductor chips or integrated circuits before encapsulation and comprising a silicon substrate (10) oxidised on its opposite surfac...
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WO/1998/011449A1 |
A structure comprising: a substrate having a surface; a plurality of elongated electrical conductors extending away from said surface; each of said elongated electrical conductors having a first end affixed to said surface and a second e...
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WO/1998/011445A1 |
The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electroni...
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WO/1997/044676A1 |
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on...
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WO/1997/043654A1 |
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconduct...
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WO/1997/043653A1 |
Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contac...
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WO/1997/043656A2 |
Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring c...
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WO/1997/027489A1 |
An improved method and apparatus for removing the dielectric layer on bond pads of an integrated circuit includes a probe card (40, 60) with a plurality of probes (49, 62) and a piezoelectric actuator assembly (43, 70). Electrical contac...
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WO/1996/038858A2 |
A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and con...
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WO/1996/037331A1 |
The efficacy of electrical discharges for severing bond wires (102, 202) and/or for forming balls (234, 236) at the ends of bond wires (including bond wires (202) already severed by alternative mechanisms) is improved by performing the e...
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WO/1996/037332A1 |
Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electroni...
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WO/1996/037931A1 |
Spring elements (540) for use as electrical contacts are fabricated by shaping a relatively soft core (112, 122) and overcoating the shaped core (702) with a relatively hard material (114, 124). Additional overcoat layers may be applied ...
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WO/1996/035129A1 |
A method and apparatus for testing unpackaged semiconductor dice includes a mother board (10) and a plurality of interconnects (12) mounted on the mother board (10) and adapted to establish a temporary electrical connection with the dice...
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WO/1995/034000A1 |
A connecting device provided with contact terminals (42) which are brought into contact with an object to be inspected. The contact area is small and accordingly the contact point density is high. Projections for forming the terminals (4...
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WO/1995/034106A1 |
A connector for microelectronic elements includes a sheet-like body (30) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of pr...
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WO/1995/014314A1 |
An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure...
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WO/1994/029816A1 |
A system (99) for inspecting integrated circuit probe cards (45) using a video camera (124) positioned to view probe points on thecard from below. A precision movement stage is used to move the video camera into a known position for view...
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WO/1994/009374A1 |
A probe unit consisting of a rectangular plate type base (3), and a plurality of extremely thin metal wires (4) used for probe pins partly fixed to the base (3) so that the wires (4) are spaced at regular intervals, the extremely thin me...
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WO/1994/009513A1 |
A device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a pluralit...
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JP6735635B2 |
A probe for testing electric properties on a specific location of a test sample, comprises a supporting body defining opposite first and second parts constituting a flexible cantilever part being flexible in one direction and a base part...
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JP2015135350A |
To solve the problem that conventional stamp molding used for forming a probe often causes, to the probe, residual stress that could shorten the durable life, and that a probe manufactured by a mechanical method is difficult to redesign....
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JP5192232B2 |
A probe for testing electric properties on a specific location of a test sample, comprises a supporting body defining opposite first and second parts constituting a flexible cantilever part being flexible in one direction and a base part...
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JP5089166B2 |
A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and ...
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JP2012211911A |
To provide a method for providing alignment of a probe relative to a supporting substrate.The method comprises the steps of: providing the supporting substrate defining a planar surface and an edge, the substrate further defining a first...
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JP4863585B2 |
A method for producing a contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors. The contactor has a tip portion at one end of t...
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JP4837866B2 |
An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of Invar(R), each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The sheets of...
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JP4832664B2 |
A single cleaning sheet capable of simultaneously cleaning both the tip and the side surfaces of a probe is provided. The cleaning sheet 10 is comprised of a base sheet 11, a first polishing layer 12 formed on the surface of the base she...
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JP2011237437A |
To provide a method for producing a probe which can prevent occurrence of a problem cause by a mechanical formation and flexibly cope with the production of differently designed probes.A method for producing a probe test head for testing...
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JP4813739B2 |
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The p...
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JP4795940B2 |
An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the ...
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JP4749666B2 |
Provided is a support member assembly suitable for use in a contact probe head comprising a support member formed with a plurality of holder holes for supporting conductive contact members in a mutually parallel relationship, and a reinf...
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JP4741626B2 |
A plurality of contact elements, such as contact bumps or free-standing spring contacts (710) including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates (702) which, in turn, are mou...
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JP4733244B2 |
A magnet core for current sensors composed of a soft-magnetic alloy is disclosed which comprises at least two bent or buckled alloy band sections.A magnet core is also described with a primary leg and a secondary leg, whereby the seconda...
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JP4721637B2 |
An electrically conductive contact holder (1) includes a supporting member (4) having a structure where a low thermal expansion supporting frame (15, 18) with a coefficient of linear expansion lower than that of a to-be-contacted member ...
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JP4688095B2 |
A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to...
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JP4685309B2 |
A multi-point probe, a method for producing the multi-point probe and a cylindrical nano-drive for in particular driving the multi-point probe in a multi-point testing apparatus for testing electric properties on a specific location of a...
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JP4678918B2 |
A method of producing a contact structure for achieving an electrical connection with a contact target. The contact structure includes a contactor formed on a planar surface of a substrate by a microfabrication technology. In one aspect,...
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JP4598356B2 |
To provide a technology for performing a wafer-level burn-in and test. The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with...
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JP4590032B2 |
Disclosed is a probe arrangement assembly comprising a conductive foil, a plurality of supporting body-corresponding sections formed in the conductive foil, and contact terminal-corresponding members each fixed to one end of each of the ...
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