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JP2796070B2 |
Bumps to be connected to inspection electrodes of semiconductor chips are formed on a surface of a flexible substrate. A plating layer is formed which is made of a harder material than the bumps formed on the flexible substrate and which...
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JPH10144750A |
To maintain the structural completion of the contact point of a device, which is brought into contact with chip pads on a wafer, by electrically connecting a burn-in base material with a wafer level contact sheet through a conductive Z-a...
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JPH1082826A |
To efficiently clean an IC socket by moving a head having abrasive sections kept in contact with the contact pins of the socket in the facing direction to the IC socket on a board. This cleaning head 2 has cleaning pins 3 arrangedcorresp...
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JPH1048258A |
To obtain a cross coil instrument in which first and second cross coils can be wound up to a range where a pair of coils could not be wound conventionally by employing a chuck having such shape as blocking intrusion of a chuck jig into t...
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JP2710544B2 |
PURPOSE: To provide a probe structure having a precise pitch by arranging plural cavities whose positions are adjusted to a contact point pad on a device when the probe structure is contacted with a semiconductor device of an inspec tion...
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JP2624873B2 |
An atomic force microscope for observing a sample surface (7) is internally provided with a cantilever stylus (1, 14, 23) and makes use of atomic forces acting between the cantilever stylus (1, 14, 23) and the sample surface. The cantile...
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JP2615381B2 |
A probe unit comprising a base in the form of a rectangular plate and a plurality of ultrathin metal wires which are partially secured to the base at a given pitch. Each of the wires comprises a straight portion firmly secured to the bas...
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JPH08304463A |
PURPOSE: To provide a mounting structure for a cross coil-type instrument main body which can confirm wrong mounting of the cross coil-type instrument in a simple constitution and prevent a wrong mounting. CONSTITUTION: Fixed parts 2b ar...
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JPH08201432A |
PURPOSE: To make the contact resistances between bumps and the electrode pads of a semiconductor wafer even and, at the same time, to eliminate the insufficient continuity between the bumps and electrode pads of the semiconductor wafer. ...
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JP2514305B2 |
PURPOSE: To provide a three-dimensional structure used for packaging an electronic device such as a semiconductor chip which transmits electric signals both in a horizontal and a vertical direction and manufacture thereof. CONSTITUTION: ...
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JPH0882639A |
PURPOSE: To provide a manufacturing method for an assembly for a electromagnetic detection device in which manufacturing hour and manufacturing cost are reduced, and accurate positioning of an integrated circuit can be conducted. CONSTIT...
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JPH0827297B2 |
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JPH07270451A |
PURPOSE: To provide a meter drive unit with a simple circuit constitution by which set values can be easily set and parts management can be simplified. CONSTITUTION: When an operator turns on a setting start switch SW after a meter drive...
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JPH0719021Y2 |
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JPH0792191A |
PURPOSE: To provide a method for manufacturing a probe having arranged undeformable wire bundles with high dimensional accuracy. CONSTITUTION: After arranging wire bundles 2 at a constant interval, temporary bonding parts are provided an...
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JPH0712846A |
PURPOSE: To provide a contact probe having self-cleaning function for removing adhered flux or oxides thoroughly. CONSTITUTION: The contact probe comprises hollow plungers 1a, 1c, 1e extending axially, plungers 1b, 1d, 1f inserted into t...
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JPH075229A |
PURPOSE: To obtain stable measuring conditions by preventing electrically poor contact caused by foreign matters adhering to a socket used during the measurement. CONSTITUTION: A plurality of sockets 1a-1c exceeding the number of sockets...
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JPH0440286Y2 |
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JPH0363027B2 |
There is disclosed a method of testing and verifying a performance for insulation to ground of a disconnecting switch when breaking a charging current. This disconnecting switch has a movable electrode (62) and a fixed electrode (64) whi...
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JPH03188350A |
PURPOSE: To improve the reproducibility and accuracy of a sensor element by forming a ceramic tape sheet so that part of the sheet can constitute the sensor element and fitting a means which detects the physical change of the sensor elem...
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JPH03179760A |
PURPOSE: To form contact elements uniform in height by a method wherein conductive material is filled into an opening provided to a dielectric first layer, a dielectric second layer is made to coat the first layer and the conductive mate...
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JPH02176578A |
PURPOSE: To test electronic parts rapidly and reliably by providing first and second contacts, a contact holder, and a positioning means. CONSTITUTION: A test site 26 is located at the upper part of a conductive still contact 44 that is ...
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JPH01302172A |
PURPOSE: To obtain a probe card with an excellent characteristic, by burying a metal member with both ends thereof exposed from both surfaces of a holder comprising an electrically insulating material while the holding body is provided w...
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JPS63252438A |
PURPOSE: To remove automatically oxide from a contact pad of a wafer to be measured by forcing a probe pad for testing to move crosswise on the contact pad of the wafer. CONSTITUTION: A wafer is pressed to a membrane 1-13 of a probe for ...
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JPS6216821U |
The present invention relates to an electrical measuring instrument of the D'Arsonval type and more specifically to an improved low cost and small suspension system for the bobbin or armature assembly of such an instrument. Such improved...
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JPS6174829U |
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JPS61100661A |
PURPOSE: To reduce the load of an operator participating in range change-over operation while preventing the unnecessary emergency stoppage of an atomic reactor, by outputting the signal from a monitor apparatus only when a signal to be ...
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JPS59162672U |
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JPS598204Y2 |
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JPS58146723U |
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JPS5860272U |
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JPS5635337B2 |
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JPS5635339B2 |
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JPS5635338B2 |
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JPS5578814A |
The present invention relates to an electrical measuring instrument of the D'Arsonval type and more specifically to an improved low cost and small suspension system for the bobbin or armature assembly of such an instrument. Such improved...
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JPS552702Y2 |
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JPS5428097B2 |
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