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WO/2023/272909A1 |
A mobile oscillograph and a movement method therefor. The oscillograph comprises: an oscillograph shell, which is internally provided with an information acquisition device, wherein a mounting member is arranged at the top of the oscillo...
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WO/2023/277442A1 |
A connector for electrical connection disposed between an inspection device and an inspected device is provided. The connector comprises a signal conductive part, a ground conductive part, and a frame part. The signal conductive part inc...
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WO/2023/272867A1 |
A fixing apparatus and fixing method for chip testing, and a test device. The apparatus comprises: a carrier (1) formed therein having a fixing cavity (2) for fixing a chip, wherein a plurality of adjustment members (3) are provided on s...
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WO/2023/277452A1 |
The present invention provides an electrically conductive contact pin which is formed by stacking a plurality of metal layers together and a method for manufacturing the electrically conductive contact pin, wherein metal layers made of t...
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WO/2023/277524A1 |
A probe member for inspection, according to one embodiment of the present invention, comprises: a contact part having one side formed to be sharp and of a first metal, so as to be in contact with an object to be inspected; and a body par...
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WO/2023/272977A1 |
The present application relates to a chip bearing apparatus, and a chip test apparatus and method. The chip bearing apparatus is used for fixing chips of different sizes, and comprises a supporting box and several first elastic clasp rin...
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WO/2023/273370A1 |
A radio-frequency test probe structure, and a radio-frequency test device and system; and same relate to the field of radio-frequency testing, and can solve the problem of a waste of space in a terminal caused by the fact that the volume...
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WO/2023/277407A1 |
The present application provides an electrically conductive contact pin having improved physical or electrical properties. The electrically conductive contact pin is formed by stacking a plurality of metal layers comprising first metal l...
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WO/2023/273072A1 |
A chip bearing assembly, and a chip test apparatus and method. The chip bearing assembly is used for fixing chips of different sizes, and comprises a rotatable vertical rod (10), a cross beam (20), a first side wall (31), and a second si...
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WO/2023/277882A1 |
Embodiments described herein involve a sensor test structure, comprising a substrate. A moat structure is configured to at least partially surround a resonating structure comprising at least one piezoelectric layer. An electrode comprise...
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WO/2023/277242A1 |
A current measuring device, according to the present invention, is for measuring the total current flowing through a metal bar (10) by using the metal bar (10) and a current sensor module (20) coupled thereto. The metal bar (10) has a re...
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WO/2023/277434A1 |
The present invention relates to a high-current probe pin for a semiconductor device test socket. The probe pin comprises: a hollow cylindrical conductor sleeve; a rod-shaped top plunger having one end in contact with and connected to a ...
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WO/2022/271518A1 |
System and method for compensating for power loss due to a radio frequency (RF) signal probe mismatch in conductive RF signal testing of a RF data signal transceiver device under test (DUT). Sourcing the RF test signal with the RF vector...
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WO/2022/269783A1 |
The present invention comprises: a measurement probe (1) connected to a terminal pad (40b) of a measurement object (40); a measurement probe (2) connected to a terminal pad (40c) of the measurement object (40), the terminal pad (40c) bei...
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WO/2022/269069A1 |
A busbar (11, 14) for measuring a direct and/or alternating current, in particular with current intensities of greater than 100 amperes, has connection regions (11a) and at least one resistance region (11b) which is arranged between the ...
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WO/2022/271532A1 |
An example test socket for a test system includes a receptacle to make electrical and mechanical connections to a device under test (OUT) and a lid to cover the OUT in the receptacle. The lid is controllable to open automatically to enab...
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WO/2022/270311A1 |
A socket (10) comprises: a probe (100) that includes a first tapered section (102); and an insulative support body (200) to which is provided a through hole (230) having a second tapered section (202) that receives the first tapered sect...
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WO/2022/262093A1 |
A mounting device and mounting method for a recording fault indicator, which belong to the technical field of recording fault indicators. The mounting device comprises: a first fixing member (1), which is fixed onto a housing; and a seco...
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WO/2022/265325A1 |
Proposed are a supporting plate for an electrical test socket, a socket pin for an electrical test socket, and an electrical test socket that are advantageous for testing high-frequency characteristics of a semiconductor package and are ...
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WO/2022/266579A1 |
A probe head comprising of pogo pins and a slot for accepting a probe board is provided. The pogo pin has a spring-loaded rotating ball at its apex which allows for smooth sliding of a probe board into the slot. The probe board houses a ...
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WO/2022/260371A1 |
The present invention provides an electrically conductive contact pin formed by laminating a plurality of metal layers, wherein the electrically conductive contact pin has improved physical or electrical properties.
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WO/2022/259454A1 |
[Problem] The purpose of the present invention is to enable easy recognition of an alignment mark formed on a probe by suppressing reflection light from a circuit board in which a light-transmissive insulating film is formed on interlaye...
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WO/2022/254005A1 |
The invention relates to a test body (4) for a finger tester (1) for testing printed circuit boards, to a finger tester, and to a method for testing printed circuit boards. The test body comprises: • a slide (14) which can be movably a...
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WO/2022/255599A1 |
Disclosed is a lighting inspection device for micro-light-emitting diodes. A light-emission inspection device for micro-light-emitting diodes, according to the present invention, comprises: a surface contact probe which surface-contacts,...
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WO/2022/247551A1 |
The present invention provides an insulation withstand voltage detection method and detection device for a wiring harness, and an automobile wiring harness assembly line. The insulation withstand voltage detection method for a wiring har...
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WO/2022/249954A1 |
This probe is equipped with first and second tip end sections, and a body section for connecting the first and second tip end sections to one another. The body section is equipped with a first end which is connected to the first tip end ...
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WO/2022/250384A1 |
A conductive connecting member, for electrically connecting a test subject and a test device by having one end coming into contact with the test subject and the other end coming into contact with the test device, according to one embodim...
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WO/2022/251045A1 |
Methods of characterizing electrical properties of a semiconductor layer structure on a wafer with topside semiconductor layers on an insulating or semi-insulating substrate, the semiconductor layer structure including a high electron mo...
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WO/2022/249657A1 |
[Problem] To provide a conductive connector that is easy to manufacture and has a low disconnection risk. [Solution] This conductive connector comprising a non-conductive elastic body 200 and a reticulated fiber body 100 comprising a cov...
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WO/2022/248349A1 |
The invention relates to a current-sensing resistor (10) for measuring an electrical current, comprising: a) a first connection area (11) for introducing the electrical current to be measured, b) a second connection area (12) for dispens...
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WO/2022/251086A1 |
To measure the resistance area product of a high resistivity layer using a microscopic multi point probe, the high resistivity layer is sandwiched between two conducting layers. A plurality of electrode configurations/positions is used t...
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WO/2022/246973A1 |
A waveform recorder having a fast maintenance function, and a use method. The waveform recorder comprises a fixing base (1); a mounting shell (2) is fixedly mounted on the surface of the fixing base (1); a component is mounted in the cav...
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WO/2022/245537A1 |
A high-frequency coaxial attenuator includes a first coaxial cable portion that includes a first center conductor having a first length, and a first insulator of the first length formed around the first center conductor, wherein the firs...
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WO/2022/241889A1 |
A waveform recorder having portable functionality and a usage method therefor, relating to the field of waveform recorders. The waveform recorder comprises a protective box body (1), an opening being formed on an upper part of the protec...
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WO/2022/245408A1 |
An inference engine determines whether a device under test has become stuck in a test socket of an automated test system by analyzing measurement data sampled during normal execution of a production test program for the device. The infer...
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WO/2022/237467A1 |
A current sampling circuit having the function of in-chip real-time calibration. The current sampling circuit is used for measuring a turning-on current of a driving transistor (100), and comprises a first resistor (1), a second resistor...
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WO/2022/237536A1 |
A test clamp for an IGBT module, an examination seat and a test box. The test clamp (100) comprises: a base (110); a first supporting portion (120) and a second supporting portion (130) arranged opposite each other on the base; and a cov...
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WO/2022/239982A1 |
A pin pushing inspection connector according to the present invention may comprise: a first connector assembly, of which the front portion is connected to a connector to be inspected in a first direction and which is provided to be fixed...
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WO/2022/234892A1 |
The present invention provides a semiconductor film layer inspection apparatus (10) and a semiconductor film layer inspection method using the apparatus, the purpose of which is to detect electrical characteristics of a semiconductor fil...
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WO/2022/235005A1 |
The present invention relates to a probe array gripper and probe array bonding equipment comprising same. The probe array gripper of the present invention grasps a probe array on which a plurality of probe pins are fixedly arranged, and ...
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WO/2022/229202A1 |
The invention relates to a protection device (8) for mechanically protecting at least one contact element (4, 5) of an electrical plug-in connector (1), having a protective cover (9) for covering an end face (10) of the contact element (...
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WO/2022/231259A1 |
A probe pin, mounted on a probe card, comprises: a body part; and a top part and a tip part each formed at both ends of the body part, wherein the body part comprises: a first side surface and a third side surface that are opposite to ea...
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WO/2022/231340A1 |
Various embodiments disclosed herein provide a calibration port for multiple RF lines and an electronic apparatus including same. According to the various embodiments disclosed herein, a calibration connector for multiple RF lines may be...
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WO/2022/222099A1 |
A radio frequency bridge probe, comprising: a microwave transmission structure (1) and two probe assemblies (2) that are respectively and symmetrically connected to both ends of the microwave transmission structure (1). The two probe ass...
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WO/2022/225186A1 |
The present invention relates to a current measuring device comprising: a plurality of unit modules which are provided with mutually different grounds and are connected in series; a power unit which supplies high-voltage DC or AC power t...
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WO/2022/222833A1 |
Provided is a circuit component recognition method. The method comprises the steps of: S1, presetting a first-level recognition unit inside a component, wherein the first-level recognition unit is used for recognizing an input end and an...
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WO/2022/225249A1 |
Disclosed is a probe contact for electrical connection between a first terminal and a second terminal. The probe contact includes a stationary plunger which comprises a first main body having a first end to come into contact with the fir...
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WO/2022/224438A1 |
[Problem] The purpose of the present invention is to provide a probe card repair method for repairing a probe card in which a defect has occurred in an alignment symbol or a peripheral region thereof by using a high-reflection chip for a...
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WO/2022/220484A1 |
The present invention relates to a molded article for a semiconductor device test socket comprising a polyimide resin and a method for manufacturing same, characterized in that excellent mechanical properties, surface resistance stabilit...
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WO/2022/221628A1 |
This invention provides a system and a method for individually probing optical information and electrical information of LED chips, wherein the optical information is probed by using contactless photoluminescence(PL) measurement, and the...
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