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WO/2023/156271A1 |
Apparatuses and test cards for testing photonic integrated circuits, corresponding systems, and photonic integrated circuits are provided. In this case, a test card (24) is imaged by way of an optical unit (20) onto a photonic integrated...
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WO/2023/154488A1 |
A test fixture for coupling a Device Under Test (DUT) to a measurement instrument includes a device interface board, which may be a solderless, press-fit board, for electrically connecting to one or more DUTs, a power delivery section el...
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WO/2023/154684A1 |
Detecting power at a detachable case of a mobile device may include identifying a first electrical connection at the detachable case. The first electrical connection may include the detachable case receiving power from a wireless chargin...
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WO/2023/154329A1 |
A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and dow...
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WO/2023/153556A1 |
The present invention relates to a probe head for testing semiconductor elements, the central technical feature being a preload-type probe head comprising: a probe having a stopper; and a block having a coupling hole into which the probe...
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WO/2023/153703A1 |
The present invention relates to an electrically conductive contact pin comprising: a first connection part; a second connection part; a support part extending in the longitudinal direction; an elastic part, which is connected to at leas...
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WO/2023/150615A2 |
A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe inclu...
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WO/2023/149913A1 |
A burn-in board for testing the operational integrity of memory devices includes local heating elements for each memory device under test. Each socket on the burn-in board may include a pair of opposed latch heads which move between open...
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WO/2023/143013A1 |
A sampling apparatus (100), a battery, and an electrical device. The sampling apparatus (100) comprises a sampling circuit board (110), the sampling circuit board (110) has a first sampling line (111) and a second sampling line (112), an...
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WO/2023/140655A1 |
The present invention provides an electrically conductive contact pin which improves the reliability of a test for a subject, and is prevented from departure from a guide plate.
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WO/2023/139953A1 |
This probe comprises a main body portion and a spring portion having a larger electrical resistivity and modulus of elasticity than the main body portion, the main body portion and the spring portion being connected in parallel. The main...
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WO/2023/140617A1 |
The present invention provides an electro-conductive contact pin and an inspection device having improved inspection reliability with respect to an object to be inspected. In addition, the present invention provides an electro-conductive...
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WO/2023/141051A1 |
An example probe for a test system includes a conductor to carry direct current (DC) signals between a DC testing resource and a signal trace on the test system, where the signal trace is for carrying the DC signals and alternating curre...
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WO/2023/140648A1 |
A pogo pin according to the present invention is a pogo pin which establishes an electrical connection by means of a first probe and a second probe and is variable in length with compressive elasticity. In the first probe (10), a cylinde...
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WO/2023/139478A1 |
A flexible printed circuit flex-PCB sensor (100, 100') comprising: - a sheet of electronically printable flexible material (102); - a plurality of sensor cells (14, 16,..., 18) printed on said sheet (102) and each comprising at least one...
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WO/2023/135889A1 |
This probe card comprises: a probe guide that holds a probe; and a probe substrate laminated on the probe guide. The probe substrate has a first surface facing a tester head, and a second surface facing the probe guide, and is provided w...
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WO/2023/136439A1 |
The present invention relates to a test pin for inspecting the presence of an electrical defect in a semiconductor and a camera module, the test pin comprising: a top plunger which is in contact with an object to be inspected to transmit...
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WO/2023/137100A1 |
The invention is a test system for testing silicon wafers or packaged devices. The system includes a tester having multiple testing stacks that each hold a vertical stack of test engines, data buffers, pin drivers, and other resources, w...
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WO/2023/131025A1 |
A battery test assembly (10), a battery (20), a charging assembly (60) and an electric device (70). The battery test assembly (10) comprises: a positive electrode probe (11), wherein a first end (11a) of the positive electrode probe (11)...
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WO/2023/128428A1 |
The present invention relates to a test socket used to measure electrical characteristics of an electrical device. The present invention provides a test socket for signal loss protection, wherein the test socket is disposed between facin...
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WO/2023/127394A1 |
This method for producing an electrocast tube includes a core material preparation step (S1), an electroconductive layer formation step (S3), a support layer formation step (S5), a support-layer-equipped core material cutting step (S7), ...
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WO/2023/126239A1 |
It is herein described a contact probe (20) having a first end portion (20A) which ends with a contact tip (21A) configured to abut onto a contact pad (51A) of a device under test (51) and a second end portion (20B) which ends with a con...
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WO/2023/118856A1 |
Apparatus is described including a DC electrical meter (62). The DC electrical meter (62) includes a current sensor (1), or the DC electrical meter (62) is connected to the current sensor (1). The current sensor (1) includes a busbar con...
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WO/2023/117084A1 |
A microwave antenna probe (100) is presented for controlling an antenna patch (142) connected to a microwave transmission line (141) which are attached on a printed circuit board (140). The microwave antenna probe comprises: a metal body...
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WO/2023/117251A1 |
The invention relates to a method for analysing the state of an electrical operating means (2) of a system (1) for supplying energy, wherein the electrical operating means (2) has a housing (3) comprising an insulating liquid (4), and th...
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WO/2023/117188A1 |
An electronics test bench system (100) comprising: a frame (101) and a top plate (102) removably coupled to the frame (101) with a hinged connection (103), the top plate (102) configured to receive a device under test, DUT, thereon and t...
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WO/2023/118894A1 |
The invention provides a signal conditioning stage for a photonic current or voltage transducer (1) which comprises a number of burden resistors and a number of switches in parallel with the burden resistors, the switches operable to sho...
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WO/2023/115379A1 |
An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal....
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WO/2023/119897A1 |
Provided is a probe head comprising a probe and an insulating support in which a tapered hole for supporting a plurality of portions of the probe is provided.
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WO/2023/116942A1 |
The invention relates to an accelerated electrified aging test apparatus for an electronic device. The accelerated electrified aging test apparatus comprises a box body, a test cabin and a humidification apparatus. Access terminals are a...
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WO/2023/109771A1 |
A probe apparatus, and a superconducting qubit junction resistance measurement method and system. The probe apparatus is used for measuring a superconducting quantum chip (4) and comprises a probe group, a probe control mechanism (2) and...
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WO/2023/113179A1 |
The present invention relates to a contact device and a character measurer comprising same, the contact device having an operation, such as rotation, added thereto so that all surfaces of the contact device of the character measurer, whi...
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WO/2023/110973A1 |
The present invention proposes a voltage converter (1) having a switching arm (2) comprising busbars (6, 7, 8) connecting it to an electrical network and to a rotating electric machine (15). The converter comprises a current-measuring de...
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WO/2023/112315A1 |
There is a need to increase the connection strength of a base body (9) of a connection device (6) for connecting a plurality of plate-like members stacked on one another. A probe card substrate connection base (100) is characterized by...
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WO/2023/113213A1 |
The present invention provides a rubber socket for testing a semiconductor element, and a conductive member for the rubber socket, the rubber socket comprising: a main body formed of an insulation material; and a plurality of electricity...
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WO/2023/110715A2 |
The current sensing system (2) comprises a busbar (9) connected in a current path between a power supply (3) and a load (5). The busbar (9) comprises a temperature dependent resistance with a specific temperature coefficient. An amplifie...
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WO/2023/113214A1 |
The present invention provides a method for manufacturing a conductive member for a rubber socket, comprising the steps of: preparing a first substrate having a first groove; filling the first groove with a ferromagnetic material and a d...
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WO/2023/109772A1 |
Disclosed in the present application are a quantum chip nondestructive testing probe device and a quantum chip nondestructive testing probe station. The probe device comprises a probe and a probe control mechanism, wherein the probe cont...
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WO/2023/112116A1 |
In a cleaning sheet (100) in which a cleaning layer (20) is bound to a surface of a base material sheet (10), there has been a problem that, in temperature conditions at which the cleaning sheet is used, warping occurs due to thermal def...
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WO/2023/106732A1 |
A probe member for inspection according to an embodiment of the present invention comprises a body unit having a pillar shape, and a plurality of contact protrusions provided on the body unit configured as a cross-sectional area of the p...
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WO/2023/103199A1 |
An electrical contact probe apparatus, comprising a fixing plate (4), wherein a plurality of mounting holes (5) are formed in the fixing plate (4); each of probes (1) comprises a needle rod (14), and a protrusion (12) and an axial annula...
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WO/2023/106762A1 |
The present invention provides an electrically conductive contact pin for a Kelvin test and a test device comprising same, which can cope with the narrower pitch between electrodes of a semiconductor device.
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WO/2023/105553A1 |
[Problem] One objective of the present invention is to provide a probe card with which contact failures do not readily occur. Another objective of the present invention is to provide a probe card having good high-frequency characteristic...
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WO/2023/098830A1 |
A line fault detection apparatus, comprising a housing (1000), a fault detection device (2000), a heat dissipation device (3000) and an air flow exhaust device (4000), wherein the housing (1000) has an inner cavity, a support plate (1100...
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WO/2023/101224A1 |
The present invention provides a rubber socket for testing a semiconductor element and a manufacturing method thereof, the rubber socket comprising: a body having a plurality of through-holes formed to extend therethrough in the height d...
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WO/2023/098119A1 |
Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring pla...
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WO/2023/100708A1 |
This probe substrate 17 is used in a probe card 11. The probe card 11 is provided with a main substrate part 12 having a circuit substrate 12a, and a support member 14 connected to the main substrate part 12. The probe substrate 17 compr...
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WO/2023/096237A1 |
A probe card according to various embodiments of the present invention comprises: a probe pin; and a guide part in which the probe pin is disposed. The probe pin may comprise: a body part; a first extension part extending toward one side...
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WO/2023/096242A1 |
A probe card according to various embodiments of the present disclosure may comprise: a probe pin; and a guide part which is disposed at the outer edge of the circumference of the probe pin and comprises a guide opening into which one en...
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WO/2023/092921A1 |
An apparatus and method for measuring the performance of a finished product of an aircraft wiring harness (6) on the basis of de-embedding technology. The measurement apparatus comprises a left fixture (1) and a right fixture (2), wherei...
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