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WO/2023/182033A1 |
A vapor chamber (1) that is one embodiment of this thermal diffusion device comprises: a housing (10) that has a first inner wall surface (11a) and a second inner wall surface (12a) facing each other in a thickness direction (Z) and that...
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WO/2023/182029A1 |
A vapor chamber (1), which is one embodiment of a heat diffusing device, comprises a housing (10) having a first inner surface (11a) and a second inner surface (12a) that face one another in a thickness direction (Z) and having an intern...
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WO/2023/174882A1 |
The invention relates to a vapor chamber (1), comprising walls sealing off an interior space of the vapor chamber from surroundings, said walls including at least an evaporator wall (3) and a condenser wall (4). In order to obtain a reli...
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WO/2023/173471A1 |
Provided are a combined evaporator vapor chamber and a machining method therefor. The vapor chamber comprises an upper cover plate (1), a lower cover plate (2), an evaporator (3), a capillary structure and a support structure (5), wherei...
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WO/2023/174462A1 |
The invention relates to a device for cooling the lower layers of the atmosphere, which comprises a support tube sleeve (1 ) filled with a buoyant carrier gas, wherein in the support tube sleeve (1 ) is arranged in parallel at least one ...
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WO/2023/172223A1 |
The present invention is related with improvement of heat transfer performance of a plug-in unit by implementing phase change mechanism into the cover/frame (definitions are taken from family of ANSI/VITA standards e.g.). Especially for ...
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WO/2023/171408A1 |
A thermal diffusion device (1A) comprises a casing (10), partition walls (30) provided to a first inner surface (10a) of the casing (10), and wicks (40). Inner edges (15) of the casing (10) include a first inner edge portion (15a) and a ...
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WO/2023/167086A1 |
Provided are a cooling device and a cooler that is capable of causing boiling at a low superheat by suppressing an increase in a boiling starting point. The cooler uses a boiling method for cooling a heating element, and comprises: a con...
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WO/2023/167087A1 |
Provided are a cooling member having a favorable cooling effect, a cooler, a cooling device, and a cooling member manufacturing method. The cooling member comprises integrally formed electrolytic metal foils constituted by a double-layer...
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WO/2023/159966A1 |
The present application discloses a heat dissipation module and a heat dissipation device. The heat dissipation module (100) comprises a heat dissipation fin bodies (110) and at least two loop channels (121) arranged on the heat dissipat...
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WO/2023/160109A1 |
Provided in the embodiments of the present application are a heat dissipation device and an electronic apparatus. The heat dissipation device comprises a housing and a fluid working medium, wherein the housing internally comprises evapor...
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WO/2023/161494A1 |
The present invention relates to a heater module comprising: a heat exchanger including: a first volume comprising a nano-fluid; and a second volume surrounding the first volume and in thermal communication with the first volume for a se...
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WO/2023/160393A1 |
A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surfa...
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WO/2023/163200A1 |
Provided is a vapor chamber that not only has resistance to pressure from the external environment but is also highly resistant to pressure from within the vapor chamber.　The vapor chamber comprises: a container in which a hollow porti...
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WO/2023/162468A1 |
Provided is a heat transport device that can prevent dry-out of working fluid in an evaporation unit even under a use condition in which a heat-generating body having a large volume of heat generated is thermally connected, or under a us...
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WO/2023/157536A1 |
In order to provide a self-regenerating bridge-type heat pipe capable of effectively transporting heat while keeping a filling ratio of a working fluid low, in an aluminum self-regenerating bridge-type heat pipe according to the present ...
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WO/2023/155098A1 |
Disclosed in the present application is a drying apparatus. The drying apparatus comprises a drying frame; vapor chambers, arranged on the drying frame; a PTC heater, arranged on the drying frame, attached to the lower ends of the vapor ...
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WO/2023/155895A1 |
The present application provides a heat pipe capable of preventing freezing and expanding. The heat pipe comprises a pipe body provided with a closed chamber; a heat transfer medium and a capillary structure are provided inside the close...
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WO/2023/158368A1 |
In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The du...
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WO/2023/156976A1 |
An evaporator assembly (2) including at. least one compensation chamber (10) and at least one capillary pump (11) comprising a primary wick (15), the evaporator assembly (2) including a secondary wick (16) extending through the at least ...
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WO/2023/153530A1 |
According to the present invention, by inserting a capillary to which wicks are attached into a conventional vertical heat pipe, the force that pulls up a refrigerant increases due to capillary action by the wicks provided inside, and sp...
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WO/2023/149069A1 |
The present invention provides: a clad plate which is formed of a copper layer and a stainless steel layer, wherein the total content ratio of the constituent elements of the stainless steel layer within the copper layer after being held...
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WO/2023/145397A1 |
A thermal diffusion device 1 comprising : a housing 10 that has a first inner wall surface 11a and a second inner wall surface 12a facing one another in the thickness direction Z; a working medium 20 that is enclosed in an internal space...
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WO/2023/144551A1 |
Attachment device comprising: (a) a housing (12), the housing having: (i) a through bore, the through bore being configured to allow a fluid conduit (16) to pass therethrough, and (ii) an at least one heat source member (20a) receiving s...
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WO/2023/145396A1 |
A thermal diffusion device 1 comprising : a housing 10 that has a first inner wall surface 11a and a second inner wall surface 12a facing one another in the thickness direction Z; a working medium 20 that is enclosed in an internal space...
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WO/2023/140158A1 |
A temperature control device according to the present disclosure is provided with: a pair of metal plates; a resin flow path wall part sandwiched between the pair of metal plates; and a resin fixing part for fixing one of the pair of met...
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WO/2023/139989A1 |
This cooling device comprises a cooling tank portion (10), a liquid storage tank portion (20), and a partition member (30) that partitions the cooling tank portion (10) and the liquid storage tank portion (20). The cooling tank portion (...
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WO/2023/137236A1 |
A passive hybrid heat transfer system for cooling a heat source, such as an integrated circuit, includes a thermosiphon heat transfer subsystem that operates in combination with a supplemental heat transfer subsystem to transfer heat awa...
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WO/2023/134815A1 |
The invention relates to a cooling body (1) for an electronic component (100), wherein the cooling body (1) has an air heat exchanger (2) with a plurality of fins (3, 4) which delimit air guiding channels (5) through the air heat exchang...
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WO/2023/134141A1 |
A computing device and a cold plate thereof. A cover plate of the cold plate and a heat exchange core enclose to form a cooling cavity on a liquid cooling side; the heat exchange core is adapted to and exchanges heat with a heat generati...
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WO/2023/137153A1 |
A radiative heatsink (800)) includes a cold plate (806), a radiator (880) mounted to the cold plate (806) and a thermal compound (882) located between and coupling a heat source (830) to the cold plate (806). The thermal compound (882) c...
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WO/2023/136123A1 |
This outdoor unit (1) for an air conditioner comprises: a housing (2) in which a discharge port (8) and intake ports (4, 6) are formed; a fan (13) which is located within the housing (2) and generates an air flow in an air flow path that...
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WO/2023/128110A1 |
The present invention relates to a complex thermal environment control device and, more specifically, to a complex thermal environment control device which has a compact and simple structure, can effectively perform a humidity control ac...
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WO/2023/121994A1 |
A geothermal heat extractor includes a heat transfer fluid and a heat transfer fluid supply conduit. The heat transfer fluid is maintained in the supply conduit in a liquid state at a pressure above its saturation pressure. The geotherma...
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WO/2023/118405A1 |
The invention relates to a cooling device (1) for cooling components (101), comprising a base region (2) which can be heat-conductingly connected to a component (101) to be cooled, a deflecting region (3), an intermediate region (4) betw...
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WO/2023/111016A1 |
The present invention provides a superconducting cable system suitable for use over long distances and adapted to achieve improved heat absorption through the use of the latent heat of vaporisation of a liquid cryogen, the system includi...
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WO/2023/113924A1 |
A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink...
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WO/2023/112616A1 |
A vapor chamber 1, which is one embodiment of this thermal diffusion device, is provided with a casing 10, a working medium 20, a rail-shaped partition wall 30, and a wick 40. A liquid flow passage 50 of the working medium 20 is formed i...
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WO/2023/111195A1 |
A fastening apparatus for a cleaning device based on introducing high-amplitude pressure waves by means of a hollow-cylindrical nozzle (19) into a boiler to be cleaned through an opening in the boiler wall (20) has a cleaning device hous...
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WO/2023/103438A1 |
The present invention relates to the technical field of wicks. Disclosed in the present invention are a method for preparing a wick, and a heat pipe comprising the wick. The method comprises the steps of preparing a skeleton: performing ...
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WO/2023/106647A1 |
According to the present invention, provided is a heat pipe heat exchanger, comprising: a high temperature unit having a high temperature chamber in which a high temperature fluid flows in and out; a low temperature unit having a low tem...
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WO/2023/107034A1 |
The invention relates to at least one heat exchanger (D) comprising at least one body (1) in which only a first fluid circulates and has at least one inlet section (1a) and at least one outlet section (1b). The novelty of the invention i...
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WO/2023/106285A1 |
This vapor chamber comprises a body sheet and a first sheet laminated onto the body sheet. The body sheet includes: a vapor flow passage section through which vapor of a working fluid passes; and a liquid flow passage section which commu...
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WO/2023/106646A1 |
The present invention provides a heat pipe manufacturing method comprising: an injecting step of injecting working fluid into a heat pipe; a heating step of heating the heat pipe; a removing step of removing non-condensable gas dissolved...
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WO/2023/106384A1 |
A vapor chamber metal plate according to the present disclosure is used in order to manufacture a sheet that covers a space provided in an intermediate sheet of a vapor chamber in which a working fluid is enclosed. The vapor chamber meta...
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WO/2023/107618A1 |
A passive vortex formed or induced from a temperature difference across a cavity or void aggregates and supports a horizontal flow over the top of the cavity. A cavity of a suitable depth and width exhibits a small difference in temperat...
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WO/2023/101718A1 |
An energy storage system includes at least one heterogeneous pressure media and interactive actuation module ("module"), a liquid source, a pump, a converter, a first pipeline, and a second pipeline. The module includes a first container...
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WO/2023/093125A1 |
The present application relates to the technical field of vapor chambers, and in particular to a vapor chamber comprising a microstructure layer, a circuit module, an electronic device, and a vapor chamber forming method. The vapor chamb...
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WO/2023/094779A1 |
Disclosed is a device for generating electrical energy, comprising: a first loop for circulating a first two-phase element and comprising at least one first evaporating structure (2) fluidly connected to a first condensing structure (3);...
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WO/2023/096688A1 |
A vapor chamber includes a main body, a first vertical structure, and an enhanced boiling surface. The main body has a first surface and defines a first portion of an interior volume. The first vertical structure protrudes transverse to ...
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