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WO/2023/074049A1 |
This cooling device (100) comprises a tank (1), a pump (2), an evaporator (3), and a condenser (4). In a gas phase portion (1a) of the tank, filler gas (6) is sealed, and a volume change unit (7) that adjusts the evaporation temperature ...
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WO/2023/074645A1 |
A thermal diffusion device 1a comprises: a casing 10 having a first inner wall surface 10a and a second inner wall surface 10b facing each other in a thickness direction T; a working medium 20 enclosed in an internal space of the casing ...
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WO/2023/066754A1 |
The invention essentially consists of a heat pipe with re-entrant grooves, having specific designs whereby the internal cross-section is differentiated according to the different heat pipe zones (evaporator, adiabatic zone, condenser), i...
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WO/2023/066753A1 |
The invention essentially consists of a heat pipe with re-entrant grooves, in which the connection channels between the liquid channels and vapour channel are open more widely in the condenser than in the other zones of the heat pipe (ev...
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WO/2023/066755A1 |
The invention essentially consists of a heat pipe with re-entrant grooves, having thicker walls between liquid channels in the evaporator and, advantageously, in the condenser, unlike in the heat pipes of the prior art which have the sam...
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WO/2023/057730A1 |
Disclosed is a two-phase heat-transfer device, said device comprising a closed cavity comprising at least one evaporation zone (20) subjected to heat exchange with at least one heat source and at least one condensation zone (30) subjecte...
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WO/2023/059124A1 |
The present invention relates to a metal-graphene composite structure heat pipe, having a high heat dissipation effect by forming a metal-graphene composite structure by forming a porous metal-graphene composite and covering the surface ...
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WO/2023/059125A1 |
The present invention relates to a method for manufacturing a metal-graphene composite structure heat spreader having a high heat dissipation effect by forming a metal-graphene composite structure by forming a porous metal-graphene compo...
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WO/2023/058595A1 |
This thermal diffusion device 1 comprises a housing 10, a working medium 20 enclosed within an interior space in the housing 10, and a wick 30 positioned within the interior space in the housing 10. The interior space in the housing 10 h...
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WO/2023/054692A1 |
A body sheet of a vapor chamber according to the present invention includes a plurality of first land portions. A first sheet outer surface of a first sheet includes a first junction region that overlaps a first land portion and a first ...
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WO/2023/052151A1 |
The invention relates to a mount (1), having a first surface (11) for connection to a heat source (3) and a second surface (12) for connection to a heat sink (4). To improve thermal conductivity in an electrically insulating mount, accor...
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WO/2023/047985A1 |
The present invention has a groove formed by connecting a plurality of groove elements in a row on the surface of a substrate. Each of the groove elements comprises: a first groove region; a conical groove region having a conical shape; ...
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WO/2023/045429A1 |
The present application discloses a heat dissipation device. The heat dissipation device comprises: a seat assembly, a liquid inlet cavity being disposed inside the seat assembly, and the liquid inlet cavity being configured to accommoda...
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WO/2023/042880A1 |
A boiling-type cooling device (100) comprises: a boiling unit (10) which includes an accommodation space (11) for accommodating a refrigerant (1), a refrigerant gas exit (12), and a refrigerant liquid entrance (13); and a compression uni...
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WO/2023/042215A1 |
The present invention discloses a cooling system (4) for outrunner brushless DC motor (1) which includes a radial heat transfer element (41) having a plurality of fins (413) on its outer surface where the radial heat transfer element (41...
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WO/2023/035574A1 |
Embodiments of the present application relate to the technical field of heat management, and discloses a loop heat pipe-based heat dissipation device. The heat dissipation device comprises a capillary pump (110), a vapor chamber (120), a...
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WO/2023/037887A1 |
This loop heat pipe 1A comprises: a vaporizer 100; a condenser 400; a steam pipe 300 in which one end is connected to the vaporizer 100 and the other end is connected to the condenser 400; a liquid tube 200 in which one end is connected ...
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WO/2023/035294A1 |
A bionic sweat gland and bionic skin (7). The bionic sweat gland comprises a casing (1) and a porous medium (3). The casing (1) is internally provided with a heat dissipation tube. The heat dissipation tube is filled with the porous medi...
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WO/2023/038415A1 |
The present invention relates to a vapor chamber and a method for manufacturing same. Specially, the vapor chamber comprises: a chamber body plate having one side disposed to be in contact with the heating surface of a heating element, a...
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WO/2023/034516A1 |
Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermal...
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WO/2023/031936A1 |
A device and system for solar water heating that comprises a water heating panel with improved heat transfer. The water heating panel comprises a pipe distributer and a manifold having two separate portions comprising an inlet portion an...
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WO/2023/026896A1 |
A thermal diffusion device 1 comprises a housing 10, a working medium 20 enclosed in an interior space of the housing 10, and a wick 30 that is disposed in the interior space of the housing 10 and forms at least a part of the surface of ...
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WO/2023/021772A1 |
This temperature measuring device comprises a heat pipe including a container inside which a working fluid is sealed, a temperature sensor for detecting a temperature of the heat pipe, and a wire portion connected to the temperature sens...
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WO/2023/021953A1 |
A thermal diffusion device (1a) includes a housing (10) which includes a first inner wall surface (10a) and a second inner wall surface (10b) that oppose each other in a thickness direction (T), and in which an internal space is provided...
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WO/2023/020682A1 |
A heat pipe for electronic components includes a hollow structure having an evaporation section, a condensation section, and a flexible transport section formed between the evaporation section and the condensation section, where a vapor ...
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WO/2023/022211A1 |
Provided is a heat sink that has excellent thermal connectivity to a heat generation body to be cooled, and exhibits a superior heat transfer amount when transferring heat of the heat generation body, even when other components are dispo...
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WO/2023/022545A1 |
In a waste cold/warm heat recycling heat exchange device of the present invention, a refrigerant circulates in a closed loop between an evaporator (10) and a condenser (20), a digital sensor (45) for detecting the internal refrigerant pr...
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WO/2023/015741A1 |
An atomized base material, comprising a loose layer and a compact layer, wherein a surface of the loose layer is a seepage surface, a surface of the compact layer is an atomized surface, a plurality of pore structures are formed in the l...
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WO/2023/018590A1 |
A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly r...
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WO/2023/014306A1 |
The invention relates of a wireless sensor system without battery or with rechargeable battery that can be used on steam traps, heat exchangers, pump, cooling tower, discharge valve and similar industrial systems (A) in different industr...
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WO/2023/011780A1 |
A method for testing a two-phase cooling device (20) is provided. The cooling device (20) has a housing (22) surrounding a cavity (24) and a cooling medium (32) within the cavity (24). The method comprises: controlling a temperature of a...
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WO/2023/014594A1 |
A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, a heat exchanger, and a flow control valve controlling the flow of the primary cooling medium into the evaporator. When a secondary cooli...
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WO/2023/006181A1 |
A heat spreading device for a heat source (1) comprising a planar substrate (2) with an embedded pulsating heat pipe (6) at least partially filled with a two-phase working fluid (12) arranged to move between an evaporator portion (3) and...
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WO/2023/006216A1 |
Electric drive arrangement for a vehicle, comprising a housing, an electric machine with a stator connected to the housing and a rotor with a rotor shaft rotatably supported in the housing, a transmission to transmit a rotary movement fr...
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WO/2023/006217A1 |
Electric drive for a motor vehicle, comprising a housing assembly with an inner casing portion and an outer casing portion forming a casing cooling structure through which a water based coolant is made to flow; an electric machine with a...
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WO/2023/000072A1 |
A heat dissipating element (102) for a notebook computer liquid cooling system. The heat dissipating element includes an inlet (104) arranged in a lower corner (106) of a screen section (108) of the notebook computer and configured to re...
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WO/2023/003018A1 |
The wick sheet (30) for a vapor chamber (1) is provided with multiple steam passages (51) through which the steam (2a) of a working fluid flows, and multiple liquid flow paths (60) through which the liquid (2b) of the working fluid flows...
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WO/2023/285784A1 |
A cooling system (100) for removing heat from a heat source (1000) fluid cooling circuit (1100). The cooling system (100) comprises a first fluid manifold (200) for flow of a heat transfer fluid, the first fluid manifold (200) comprising...
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WO/2023/286591A1 |
Provided is a heat storage heat exchanger that is capable of maintaining the temperature of a hot medium for a long period of time, and has a compact structure. This heat storage heat exchanger 1 is for heating or cooling a hot medium ...
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WO/2023/286577A1 |
A vapor chamber (thermal diffusion device) (1a) comprises: a liquid transport part (LP); an evaporation part (EP) which, in a planar view from the thickness direction (T), is connected to one end of the liquid transport part (LP); a hous...
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WO/2023/284315A1 |
A vapor chamber, a manufacturing method for a vapor chamber, and an electronic device. The vapor chamber comprises a first cover plate (100), a second cover plate (200), and a copper plate (300), wherein the first cover plate (100) compr...
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WO/2023/279757A1 |
A heat dissipation apparatus and an electronic device, comprising an evaporator (100), a condenser (300), a steam pipeline (200), and a return pipeline (400). The steam pipeline (200) is communicated with the evaporator (100) and the con...
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WO/2023/280494A1 |
A two-phase cooling device (20) for cooling an electronic component is provided. The two-phase cooling device (20) comprises: a housing (22) surrounding a cavity (24), which has a top region (28) and a bottom region (30), with the bottom...
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WO/2023/283486A1 |
Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the secon...
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WO/2023/276939A1 |
The present invention provides a heat sink that has greater cooling effects and a simpler structure. According to the present invention, a thermal device heat sink comprises a metal cylindrical member, a heat-radiating fin, and a metal...
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WO/2023/276940A1 |
The present invention addresses the problem of providing a heat sink: which is used for cooling a thermal device formed from a semiconductor or the like; and which is suitable for cooling the thermal device formed from a semiconductor or...
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WO/2023/274767A1 |
The invention relates to a device for dissipating heat from electronic components in an electronics housing, in particular electronic components on a printed circuit board in an electronics housing. The invention for the first time provi...
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WO/2023/274868A1 |
The present invention relates to an electric vehicle charging connector (10) comprising contact elements (26). The contact elements (26) are electrically connected to a cable (22), wherein the contact elements (26) comprise a block porti...
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WO/2022/270047A1 |
This cooling device for cooling a heat-generating element comprises: a substrate having a trench; a plate material provided on the substrate so as to close off the trench; a capillary structure part provided in a space formed by the plat...
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WO/2022/267967A1 |
A heat pipe heat transfer apparatus and an air conditioner. The heat pipe heat transfer apparatus comprises: a gravity heat exchange unit (1), a power heat exchange unit (2), and a working medium transmission assembly (3); the gravity he...
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