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WO/2022/004558A1 |
The present invention addresses the problem of providing a heat conduction member that can improve the movement speed of working fluid in the liquid phase.　This heat conduction member comprises a container that has a hollow cavity, and...
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WO/2022/004617A1 |
This vapor chamber has a work fluid in an internal space that is formed between a first metal plate and a second metal plate, wherein the first metal plate comprises a plate section and a first peripheral edge wall which extends from the...
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WO/2022/004618A1 |
This vapor chamber has a working fluid in an internal space formed between a first metal sheet and a second metal sheet. The first metal sheet comprises a recessed channel and at least one projection. The recessed channel is provided on ...
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WO/2022/005556A1 |
A thermal management system for a computing device includes an immersion tank with a cooling fluid therein, a computing device positioned in the cooling fluid in the immersion tank, and a thermal block positioned in the cooling fluid in ...
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WO/2022/004616A1 |
A heat transfer device (1) comprises, in a container (2) having an interior space (S) in which a working fluid (F) is enclosed: an evaporation section (4) that causes the working fluid (F) to evaporate; a condensation section (5) that is...
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WO/2021/055758A9 |
Vehicle platforms and thermal management systems, subsystems, and components for use therewith are described. Thermal management architectures and systems incorporate thermal management cycles for one or more of drive train, energy stora...
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WO/2021/261552A1 |
This evaporator, which converts at least a part of a working fluid having a liquid phase into a gas by receiving heat from a heating element, comprises: a housing having therein an accommodation chamber for accommodating the working flui...
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WO/2021/255176A1 |
The invention relates to a heat pipe (1) having at least one working chamber (2) having at least one evaporator region (3) operatively connected to a heat source and at least one condenser region (4) operatively connected to a heat sink,...
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WO/2021/255966A1 |
This heat conduction member has: a housing having an internal space; a wick structure disposed in the space; and a hydraulic fluid accommodated in the space. The housing has: one or more metal sheets; and a joint portion for joining the ...
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WO/2021/255968A1 |
The casing of a heat conduction member has a plate-shaped first casing part and a plate-shaped second casing part. An internal space, in which a working medium is sealed and a wick structure is positioned, is positioned between the first...
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WO/2021/258028A1 |
Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior su...
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WO/2021/256328A1 |
This metal-resin complex has a space surrounded by a metal member and a resin member, and the resin member has one or more fragile parts.
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WO/2021/256126A1 |
A vapor chamber 1 comprises: a housing 10; an operating medium 20; and a plurality of porous bodies 30 that support the first inner wall surface 11a and the second inner wall surface 12a of the housing 10 from inside. The porous bodies 3...
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WO/2021/255967A1 |
A housing of a heat conducting member according to the present invention has a plate-shaped first housing part, a plate-shaped second housing part, and a joining part. An interior space, in which a wick structure is disposed, is disposed...
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WO/2021/253969A1 |
Disclosed are a power generation system and a power generation method, belonging to the technical field of energy sources. The power generation system comprises a steam device, a power generation device and a condensation device, wherein...
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WO/2021/248753A1 |
Disclosed is a packaging method for a high-temperature heat pipe, the method comprising the following steps: (1) performing shrinkage and necking treatment on two ends of a heat pipe (1) respectively to obtain a shrunken end and a necked...
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WO/2021/251769A1 |
Provided is a thermoelectric cooling device comprising: a thermoelectric module for cooling by applying electricity; a heat sink having a body, which has on one side a contact surface coming into contact with a heating side of the thermo...
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WO/2021/249970A1 |
The invention provides a vapor chamber assembly (1000) comprising two sections (1200) and one or more vapor chamber elements (100), wherein each section (1200) comprises at least part of the one or more vapor chamber elements (100), wher...
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WO/2021/244448A1 |
Disclosed in embodiments of the present application are a vapor chamber and an electronic device. The vapor chamber comprises: a first cover plate close to a heat source and a second cover plate away from the heat source; the first cover...
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WO/2021/246519A1 |
This vapor chamber has a working fluid in an internal space formed between a first metal sheet and a second metal sheet, wherein: the first metal sheet includes a recessed flow path, at least one protrusion, and at least one flow path gr...
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WO/2021/246462A1 |
This in-vehicle electronic device includes an electronic component (31) mounted between a roof plate (101) of a vehicle and a ceiling liner (102) of a cabin (100a), and a cooling unit (40) for cooling the electronic component (31). The c...
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WO/2021/240929A1 |
[Problem] To provide a heating appliance capable of quickly increasing the temperature in a room and limiting an operation sound generated in association with a heating operation to the least extent. [Solution] A heating appliance 10 has...
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WO/2021/233983A1 |
The application relates to a heat exchanger apparatus comprising: a channel for fluid flow extending between an inlet and an outlet; a porous layer dividing a first portion of the channel from a second portion of the channel, wherein the...
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WO/2021/235337A1 |
This intermediate-medium heat exchanger comprises: an intermediate-medium evaporator having a first chamber and a first heat transfer tube; a liquefied gas vaporizer having a second chamber and a second heat transfer tube; a first commun...
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WO/2021/232134A1 |
Disclosed is a heat pipe (100) for an electronic device. The heat pipe (100) comprises a body (102) having a generally planar, metallic structure. The body comprises a first module (102A) and a second module (102B) joined together to def...
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WO/2021/228590A1 |
The invention provides a vapor chamber element (1000), wherein the vapor chamber element (1000) comprises a first plate (110) and a second plate (120) with a chamber (100) in between, wherein the chamber (100) has a first height (H1), wh...
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WO/2021/229952A1 |
This heat exchanger is provided with a plurality of tubes (51, 52) and a plurality of tank parts (T21, T22). The plurality of tubes and the plurality of tank parts are connected to each other so that a heat medium flows in a closed loop....
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WO/2021/228576A1 |
The invention provides a vapor chamber element (1000) comprising a first part (1100), a second part (1200), and a third part (1300), wherein the second part (1200) and third part (1300) are associated to the first part (1100), wherein th...
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WO/2021/230525A1 |
The present invention relates to a highly efficient heat pipe cooling system comprising a first structure and a second structure which are provided on server racks so as to traverse between the two server racks, and are stacked verticall...
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WO/2021/229961A1 |
A vapor chamber (1) includes a housing (10), a hydraulic fluid (20), a microchannel (5), and a wick (4). The housing (10) includes an upper housing sheet (6) and a lower housing sheet (7) that face each other and are joined at an outer e...
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WO/2021/230526A1 |
The present invention relates to a high-efficiency cooling heat pipe, which absorbs the heat generated by a heating element in a non-contact state in order to cool the heating element, and comprises: a fluid pipe for accommodating workin...
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WO/2021/231873A1 |
A cooling system comprises an air cooled condensing unit (ACCU) having a condenser outlet and a condenser inlet, and a phase change composite thermal energy storage module (PCCTESM) having first and second fluid paths disposed therethrou...
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WO/2021/218141A1 |
An air-conditioner outdoor unit (1). The air-conditioner outdoor unit (1) comprises: a housing (100); a compressor (200), wherein the compressor (200) is mounted in the housing (100); a reservoir (300), wherein the reservoir (300) is mou...
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WO/2021/219332A1 |
A heat exchanger (12) comprising a primary side (20); a secondary side (22); at least one primary structure (26, 42, 50) on the primary side (20) defining at least one primary space (34, 46) on the primary side (20); and at least one sec...
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WO/2021/217789A1 |
The present invention provides a heat-superconducting heat dissipation plate, a heat dissipation device, and a 5G base station apparatus. A heat dissipation main pipeline, liquid descending pipelines, a heated-side communicating pipeline...
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WO/2021/219510A1 |
The present invention relates to a charger plug nozzle (100) for plugging into a battery charge socket. The charger plug nozzle (100) comprises an inner enclosure (103) enclosing at least one heat source, an outer enclosure (104) enclosi...
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WO/2021/213391A1 |
Provided in the embodiments of the present application are a vapor chamber (VC) and an electronic device. The vapor chamber comprises a housing having an accommodating cavity, wherein the accommodating cavity is internally provided with ...
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WO/2021/216538A1 |
A heat pipe is disclosed to include a container, a container lid which includes a groove defined therein, a wick, and an end plug operably coupled to the wick. The end plug includes a pin extending therefrom, and the groove of the contai...
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WO/2021/216532A1 |
A forming assembly configured to form a wick is disclosed. The forming assembly includes an expandable tube and a forming shell assembly. The expandable tube is hydraulically expandable to an expanded configuration. A wick mesh is config...
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WO/2021/216446A1 |
A forming assembly for forming a wick is disclosed. The forming assembly includes a tube inflatable to an inflated configuration. A wick mesh is configured to be wrapped about the tube. The forming assembly further includes a sheath posi...
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WO/2021/208070A1 |
The present invention relates to a laminated thin heat dissipation device, mainly comprising: an upper end plate, at least one first laminate, at least one second laminate, a lower end plate, and a working fluid. The first laminate and t...
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WO/2021/209172A1 |
The present invention discloses a scalable modular fluid separation system at least comprising: a) a subsea separator (102, 302, 402, 403) with an inlet for receiving well fluids from a separator inlet stream (104); b) a gas stream (105)...
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WO/2021/211119A1 |
The present disclosure describes heat conducting devices, methods of making heat conducting devices, and electronic devices that include the heat conducting devices. In one example, a heat conducting device can include a wall structure i...
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WO/2021/208730A1 |
The present application relates to the field of heat dissipation. Disclosed is a two-phase phase change heat dissipation device. The two-phase phase change heat dissipation device (400) comprises a sealing structure (1), a capillary stru...
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WO/2021/209256A1 |
The application relates to a charging apparatus for inductively charging a separate, mobile apparatus. The charging apparatus comprises a cooling system which is configured to enable additional phase change cooling of the mobile apparatu...
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WO/2021/208731A1 |
The present application relates to a vapor chamber and a manufacturing method therefor, a middle frame assembly and a manufacturing method therefor and an electronic device. The middle frame assembly comprises a middle frame, a connectin...
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WO/2021/206098A1 |
A copper paste for forming wick of a heat pipe, the copper paste containing copper particles, a thermally decomposable resin and a dispersion medium, the copper particles including a copper particle of a larger diameter having a volume-a...
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WO/2021/207345A1 |
A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to ...
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WO/2021/206733A1 |
The present disclosure describes thermal modules having solder-free thermal bonds, methods of forming the thermal modules, and electronic devices that include the thermal modules. In one example, a thermal module having a solder-free the...
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WO/2021/201382A1 |
Disclosed is a negative pressure air conditioning system for blocking an infectious disease, the system enabling, at normal times, a hospital room to be used as a general hospital room in which a general patient can receive hospital trea...
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