CLAD PLATE AND CASE USING CLAD PLATE

Title:

CLAD PLATE AND CASE USING CLAD PLATE

Document Type and Number:

WIPO Patent Application WO/2023/149069

Kind Code:

A1

Abstract:

The present invention provides: a clad plate which is formed of a copper layer and a stainless steel layer, wherein the total content ratio of the constituent elements of the stainless steel layer within the copper layer after being held at 950°C for one minute has a specific distribution morphology, and the constituent elements of the stainless steel layer are not likely to be enriched in the surface of the copper layer even if exposed to high temperatures of 650°C to 950°C; and a case which uses this clad plate. The present invention provides: a clad plate which is obtained by bonding a copper layer that has a thickness of at least 10 µm to a stainless steel layer that has a thickness of at least 15 µm, with a diffusion bonding layer being interposed therebetween, wherein if the copper layer is separated and flattened after a heat treatment, in which the clad plate is held at 950°C for one minute, so as to obtain a copper piece, and the total content ratio of Ni, Cr, Fe and Mn is obtained by performing a GD-OES analysis from a randomly selected separation surface of the copper piece in the thickness direction, the total content ratio is 2% by mass or less at a depth of 5 µm from the separation surface of the copper piece; and a case which uses this clad plate.

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Inventors:

YAGI NORITOMO (JP)
TONOGI TATSUYA (JP)
KATO KENICHI (JP)

Application Number:

PCT/JP2022/044775

Publication Date:

August 10, 2023

Filing Date:

December 05, 2022

Export Citation:

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Assignee:

PROTERIAL LTD (JP)

International Classes:

B23K20/00; B32B15/01; B32B15/18; B32B15/20; F28D15/02; F28F21/08

Domestic Patent References:

WO2018220891A1

2018-12-06

Foreign References:

JPH05318145A	1993-12-03
JP2021154335A	2021-10-07
JP2020023183A	2020-02-13

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