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WO/2014/103552A1 |
The purpose of the present invention is to provide a liquid epoxy resin composition which exhibits good fluidity even if an inorganic filler is contained therein and has a long pot life by being suppressed in increase in viscosity during...
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WO/2014/104630A1 |
The present invention relates to a film for an inner liner and to a method for manufacturing same, wherein the film comprises: a base film layer including a polyamide-based resin, a specific copolymer, and a polymer crystallization retar...
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WO/2014/103569A1 |
Provided are: a conductive resin paste which has a low silver content and can be cured at a lower temperature in a shorter time than conventional resin pastes, while having a low resistance, high adhesion and excellent storage stability ...
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WO/2014/055463A1 |
Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound. ...
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WO/2014/051149A1 |
[Problem] To provide a conductive adhesive which is provided with heat resistance against heat treatments that are performed within the temperature range of 200-300°C, while having a curing temperature that is lower than the upper tempe...
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WO/2014/024471A1 |
The present invention relates to: an optical member which is obtained by bonding two or more optical bases with use of a cured product of an ultraviolet curable resin composition that is characterized by containing (A) a novolac compound...
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WO/2014/014881A1 |
A composition and method of using the composition are described. The composition is useful for quickly bonding chlorinated polyvinylchloride during installation and repair operations. Embodiments of the composition include at least one v...
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WO/2014/008947A1 |
The invention concerns an adhesive system comprising: (a) a resin component comprising a melamine-urea-formaldehyde resin in which the amount of melamine expressed as M/(M+U) is from 26 to 99 wt% and the F/NH2 molar ratio is from 0.6 to ...
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WO/2013/187244A1 |
Provided are: a temporary adhesive for semiconductor device production, which is capable of temporarily supporting a member to be processed (such as a semiconductor wafer) easily and reliably when the member to be processed is mechanical...
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WO/2013/179498A1 |
[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cuttin...
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WO/2013/163242A1 |
Composite products made with binder compositions that include one or more tannins, one or more multifunctional aldehydes, and one or more Lewis acids and methods for making same. The method can include contacting a plurality of substrate...
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WO/2013/163245A1 |
Composite products and methods for making same are provided. The composite product can include a plurality of substrates and an at least partially cured binder composition. The binder composition, prior to curing, can include one or more...
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WO/2013/150085A1 |
The invention relates to amino plastic particles, which are made of at least one amino plastic, wherein the particles have a specific surface area of 1 to 500 m2/g and an average particle diameter of 5 to 500 µm. The invention further r...
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WO/2013/144453A1 |
The present invention relates to a method for producing a binder composition, wherein the method comprises the following steps: (i) forming an aqueous composition comprising reactant components including lignin molecules of 11 –60 lign...
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WO/2013/144454A1 |
The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps: a) forming, under heating at a temperature of 30 - 70 °C, an aqueous dispersion comprising alkali and l...
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WO/2013/133275A1 |
This adhesive sheet is formed of a resin composition that contains (A) a high molecular weight component, (B1) a thermosetting component that has a softening point of less than 50°C, (B2) a thermosetting component that has a softening p...
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WO/2013/110738A1 |
The present invention relates to novel formulations for adhesive compositions and to adhesive compositions, especially for a hybrid adhesive comprising at least one mixture of an amino resin and at least one polyether, and to the combina...
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WO/2013/111775A1 |
The purpose of the present invention is to provide a semiconductor device manufacturing method, whereby cutting reliability of an adhesive film can be improved and debris contamination due to the adhesive film can be suppressed. Provided...
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WO/2013/103116A1 |
The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion propertie...
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WO/2013/021869A9 |
To provide: a novel cyanic acid ester compound which has relatively low viscosity, excellent solubility in solvents and excellent handleability, and is capable of providing a cured product that has low dielectric constant, low dielectric...
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WO/2013/073380A1 |
The purpose of the present invention is to provide a thermosetting adhesive sheet which exhibits excellent adhesiveness and excellent heat resistance after exposure to humidity and heat even in cases where the curing time is short, while...
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WO/2013/031862A1 |
The present invention relates to 1) an adhesive agent containing a specific vinyl chloride homopolymer latex, 2) an adhesive agent containing a specific vinyl chloride/carbonic acid vinyl ester copolymer latex, 3) an adhesive agent conta...
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WO/2013/031801A1 |
Provided is an adhesive composition which has from 10 to 55 wt% of α,β-ethylenically unsaturated nitrile monomer units, from 25 to 89 wt% of conjugated diene monomer units and from 1 to 20 wt% of α,β-ethylenically unsaturated dicarbo...
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WO/2013/027156A1 |
Provided is methods for preparing condensation resins from urea, formaldehyde, and CH-acidic aldehydes, condensation resins obtained according to the methods, and uses of condensation resins in pigment preparations.
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WO/2013/021936A1 |
Disclosed is a conductive adhesive tape winding unit with which it is possible for blocking to not occur and furthermore for there to be little variability in the connection reliability of circuit connection units that can be obtained th...
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WO/2013/017423A1 |
The invention relates to an aqueous adhesive composition comprising at least A) a phenol-aldehyde resin and B) an unsaturated elastomer latex, characterised in that the phenol-aldehyde resin is based on at least an aromatic polyaldehyde ...
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WO/2013/017421A1 |
The present invention relates to an aqueous adhesive composition, comprising at least A) a phenol-aldehyde resin and B) an unsaturated elastomer latex, characterised in that the base of the phenol-aldehyde consists of at least: an aromat...
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WO/2013/017422A1 |
The invention relates to an aqueous adhesive composition comprising at least A) a phenol-aldehyde resin and B) an unsaturated elastomer latex, characterised in that the phenol-aldehyde resin is based on at least an aromatic polyaldehyde ...
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WO/2013/010932A1 |
The invention concerns an adhesive system comprising (a) a resin component comprising a urea based amino resin having an F/NH2 ratio from 0.3 to 0.65; (b) a hardener component comprising at least one acid, acid generating salt or acidic ...
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WO/2013/008757A1 |
The invention provides a dicing-tape-integrated adhesive sheet that has excellent handling properties, and can connect terminals of opposing members while simultaneously sealing gaps between members. This dicing-tape-integrated adhesive ...
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WO/2013/002001A1 |
The purpose of the present invention is to provide a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure ...
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WO/2012/141020A1 |
Provided is a chlorosulfonated polyethylene latex which is safe to the human body and the environment, and which is used as a latex element of a resorcinol-formalin-latex adhesive. This chlorosulfonated polyethylene latex includes an aqu...
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WO/2012/140380A1 |
The present invention relates to a sizing composition containing a thermosetting resin and an aldehyde-amine resin modified by an alcohol as a fire retardant. The invention also relates to fire-resistant thermal and/or acoustic insulatio...
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WO/2012/136894A1 |
The invention relates to a method for producing a binder composition, wherein the method comprises the following steps: (i) forming an aqueous composition comprising reactant components including lignin, a polymerizable substance and a c...
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WO/2012/134454A1 |
Disclosed herein is a process to produce a laminate comprises coating at least an outer surface of a dynamically vulcanized alloy film with an adhesive composition to produce the laminate, wherein the adhesive layer has a thickness of le...
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WO/2012/131110A2 |
The invention relates to process of manufacture of wood products such as plywood and form pressed panels with improved production efficiency where an adhesive system (adhesive and hardener) is used together with a separate application ha...
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WO/2012/113058A1 |
Disclosed herein are method to modify the lignin with particular fungal species, and procedure to synthesize phenolic adhesives with the modified lignin as raw materials, and the adhesives compositions and methods for making adhesive com...
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WO/2012/112240A1 |
This invention relates to improved adhesion compositions and textile materials and articles treated therewith. The improved adhesion composition comprises a non-crosslinked resorcinol-formaldehyde and/or resorcinol-furfural condensate (o...
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WO/2012/106808A1 |
Phenol-formaldehyde and lignin-phenol formaldehyde adhesive polymers with improved properties are disclosed, as well as the method of production therein. The method comprises providing at least one phenolic compound at least one formalde...
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WO/2012/056629A1 |
A resin composition characterized in containing, with respect to (A) 100 parts by mass of a phenol resin having a dicyclopentadiene backbone, at least (B) 33.3-800 parts by mass of a side chain epoxy-modified silicone resin and (C) 0.17-...
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WO/2012/055791A1 |
The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, a...
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WO/2012/048611A1 |
Disclosed are an ultra-low formaldehyde releasing urea-formaldehyde resin with a new structure and a preparation method therefore. The ultra-low formaldehyde releasing urea-formaldehyde resin comprises formaldehyde, urea, a long-chain po...
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WO/2012/046761A1 |
The present invention relates to: a binder for use in the production of an inorganic fiber product, which comprises a phenolic resin and a sugar; a binder for use in the production of an inorganic fiber product, which comprises a first p...
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WO/2012/043922A1 |
The present invention relates to an adhesive composition and film for preparing a semiconductor, and more specifically, an adhesive composition for preparing a semiconductor which comprises an acrylic resin containing acrylonitrile, a mi...
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WO/2012/025699A1 |
The present invention relates to a liquid phenolic resin intended to be a component of a sizing composition for mineral fibers, which consists essentially of phenol-formaldehyde and phenol-formaldehyde-glycine condensates. The invention ...
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WO/2012/005806A2 |
We disclose methods and compositions for preparation of stimuli-responsive plastics that are capable of responding to chemical and/or physical signals in their environment. In one embodiment the plastics consist of patterned mixtures of ...
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WO/2012/001154A1 |
The present invention relates to an environmentally sound method for the production of urea-melamine-formaldehyde resin characterized by the stagewise condensation of formaldehyde with urea and the subsequent co-condensation of the obtai...
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WO/2012/002750A2 |
The present invention relates to a film for a tire inner liner comprising: a base film comprising a copolymer or a mixture of a polyamide-based resin and a polyether-based resin; and an adhesive layer comprising a resorcinol-formalin-lat...
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WO/2011/152101A1 |
Provided is an adhesive composition that can strongly adhere a tire and a thermoplastic resin or a thermoplastic elastomer obtained by dispersing an elastomer component into a thermoplastic resin, said adhesive composition being obtained...
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WO/2011/138858A1 |
Disclosed is a method for producing plywood wherein an adhesive composition for plywood formed by adding 1 - 15 parts by mass of acacia bark powder, 25 - 70 parts by mass of an inorganic filler, and 10 - 50 parts by mass of water to 100 ...
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