| Document |
Document Title |
|
WO/1993/021233A2 |
Self-stabilized resin latexes are provided which contain carboxylate salts of post-chlorinated ethylene copolymers having chlorine contents of 20-60 weight percent. The ethylene copolymer salts are derived from ethylene/acrylic acid or e...
|
|
WO/1993/021260A2 |
Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on phenolic solids in sai...
|
|
WO/1993/019120A1 |
An aqueous phenol-formaldehyde resin solution with formaldehyde-phenol mol ratio in the range of 1.8 to 2.8, polymerization catalyst of 3 % to 9 % by weight, measured as NaOH equivalent, with less than 1 % by weight potassium hydroxide, ...
|
|
WO/1993/015160A1 |
An aqueous primer composition containing a polyvinyl alcohol-stabilized aqueous phenolic resin dispersion, a latex of a halogenated polyolefin, and a metal oxide. The phenolic resin dispersion is prepared by mixing (a) a pre-formed, soli...
|
|
WO/1993/012189A1 |
An aqueous adhesive composition containing a chlorosulfonated polyethylene latex, a polymaleimide compound, a nitroso compound and a metal oxide. The adhesive composition can be effectively utilized without a primer component and exhibit...
|
|
WO/1993/008223A1 |
One hundred percent thermosetting phenol/formaldehyde (P/F) resin and method of preparation thereof are disclosed. The resin comprises a molar ratio of F/P of about 1.2-1.7, has a softening point of about 80 °C and cures at temperature ...
|
|
WO/1992/018557A1 |
Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on the phenolic solids in...
|
|
WO/1991/017224A1 |
Adhesive compositions comprising an aqueous based adhesive and one or more hydrophilic hydrocarbon surfactant(s) or fluorochemical surfactants and methods for bonding porous materials are described which are particularly suitable for bon...
|
|
WO/1991/001341A1 |
A method and apparatus for producing water-soluble resin and a resin product made by that method, the method including the steps of supplying a volume of an acidic pyrolysis oil, raising the pH of the oil above 7.0 to partially polymeriz...
|
|
WO/1990/005154A1 |
Stable aqueous dispersions of formo-phenolic resols without solvent whose free formol content is less than 0.1 % are obtained by condensing formaldehyde and phenols in the presence of a catalyst, and by the formation of an aqueous in-sit...
|
|
WO/1989/000587A1 |
Urea-formaldehyde resins which may be cured to give products having a low total extractable formaldehyde content are prepared by the following process: i) aqueous 30-50 % formaldehyde and urea are mixed in a formaldehyde:urea molar ratio...
|
|
WO/1986/000915A1 |
A method of adhering together or cementing together two or more substrates, members or parts of a common member, comprises interposing between said substrates, members or parts and in contact therewith a liquid composition (hereinbelow r...
|
|
WO/1983/003835A1 |
Resin compositions for joining nylon pipes which comprises the reaction product of a resorcinol novolac and a polyamide homo-or co-polymer. The resin compositions are used in a 2 part system wherein curing agents selected from the group ...
|
|
WO/1983/003832A1 |
A resin useful in an adhesive for nylon is made by reaction of a phenol having a labile ring hydrogen (for example resorcinol) with a cyclic ketone for example cyclohexanone or a dialdehyde of at least 6 carbons. The obtained resin may b...
|
|
WO/1979/000977A1 |
A method for the manufacture of an adhesive product suitable for use in the manufacture of wood particle board and other wood products which adhesive product includes a large proportion of the spent liquor from the sulfite pulping of lig...
|
|
JP7477597B2 |
The present invention provides an adhesive composition containing: an acrylic rubber having at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, and an epoxy group; a silane coupling age...
|
|
JP2024057214A |
An object of the present invention is to provide an adhesive composition that has excellent handleability and high adhesive strength, and can therefore produce wood products or paper products that have excellent mechanical strength. An a...
|
|
JP7471879B2 |
The present invention provides a film adhesive capable of forming a dicing die bonding sheet by being laminated with a support sheet, and a dicing die bonding sheet having the film adhesive. The film adhesive of the present invention is ...
|
|
JP2024052040A |
The present invention provides a vulcanized adhesive composition that suppresses environmental pollution while maintaining conventional adhesive performance and is excellent in terms of health and safety in a workplace. A vulcanized adhe...
|
|
JP2024049808A |
[assignment] Thermosetting adhesive with excellent handling and workability that does not reduce adhesive strength even at high temperatures of 300°C for joining friction materials/metals, metals/metals, and metals/rubbers for automobil...
|
|
JP2024039980A |
[Problem] Before curing, the coating has excellent appearance and temporary fixation to the adherend at room temperature, and after curing, it has high adhesion to the adherend, and has excellent soldering heat resistance and moist heat ...
|
|
JP7453500B2 |
To provide a rubber composition for steel cord adhesion excellent in water-resistant adhesiveness, and a conveyor belt.The rubber composition for steel cord adhesion contains a rubber component containing at least a diene rubber, an orga...
|
|
JP2024511748A |
The phloroglucinol acetaldehyde resin has the formula (I) (wherein the number of phloroglucinol units is an integer from 2 to 20, and at least one of R1, R2, and R3 is a second combined with a phloroglucinol unit to form a methyl-substit...
|
|
JP2024510400A |
The invention provides an adhesive particularly suitable for joining metal to castable polyurethane, polyester and/or polyamide.
|
|
JP2024017315A |
The present invention provides a phenol resin composition that has both excellent water dilubility or water dispersibility and high heat resistance. A resin composition comprising a cashew-modified phenolic resin having a side chain cont...
|
|
JP7421498B2 |
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. When phosphorus concentration V1 is measured by performing X-ray photoelectron spectroscopy analysis on one surfa...
|
|
JP7421497B2 |
A film-like adhesive agent of one embodiment contains an acrylic resin (a), an epoxy compound (b1), and a phosphorus antioxidant (z). Before being heated at 260°C, this film-like adhesive agent has a linear transmittance of 90% or great...
|
|
JP2024008251A |
[Problems] A film adhesive that can produce semiconductor devices that are free from corrosion during long-term storage and have excellent reliability after IR reflow, and a sheet for semiconductor processing provided with the film adhes...
|
|
JP2024005501A |
The present invention provides a method for manufacturing a rubber-metal bonded body in which unvulcanized rubber and metal are bonded, with excellent workability. [Solution] A method for producing a rubber-metal bonded body in which unv...
|
|
JP7415198B2 |
This coating composition for an electrical steel sheet contains an epoxy resin, a phenolic curing agent (A) and one or more amine-based curing agents (B) selected from the group consisting of an aromatic amine and dicyandiamide, the amou...
|
|
JP2023176758A |
To provide an adhesive that can be used for bonding and separating by dielectric heating using microwave irradiation.The adhesive for microwave separation has an adhesive component that has a dielectric constant of 8.0 or more at 10 GHz....
|
|
JP2023172562A |
To provide an adhesive composition and a circuit connection material which can achieve both storage stability and peeling resistance under a high temperature and high humidity condition, and a connection body which prevent peeling on an ...
|
|
JP7380926B2 |
This film-like adhesive for semiconductors is provided with a first layer which comprises a first thermosetting adhesive containing a flux compound, and a second layer which is provided upon the first layer and comprises a second thermos...
|
|
JP7380565B2 |
Disclosed is an adhesive composition that contains an epoxy resin, a phenol resin, an elastomer, and a filler, in which the content of filler is 40-68 mass% in terms of the total amount of epoxy resin, phenol resin, elastomer, and filler...
|
|
JP7375249B1 |
An object of the present invention is to provide a conductive adhesive composition that can achieve good electrical properties including connection resistance without impairing conductivity even when the amount of silver powder blended i...
|
|
JP2023161359A |
To provide an emulsion type phenolic resin composition that can be used as an adhesive and has superior adhesive strength, and also yields a cured product thereof with improved water resistance.An emulsion type phenolic resin composition...
|
|
JP7372529B2 |
To provide a rubber composition for steel cord adhesion excellent in water-resistant adhesiveness, and a conveyor belt.The rubber composition for steel cord adhesion contains: a rubber component containing at least a diene rubber; a mixt...
|
|
JP7366940B2 |
A water-based primer composition including (a) a water-based primer component; and (b) a dye component wherein the dye is adapted for providing a visual indication of dryness during the drying process of the water-based primer compositio...
|
|
JP2023153489A |
To provide an adhesive composition for wet friction material that has excellent adhesive strength and improved heat resistance.An adhesive composition for wet friction material includes resol-type phenol resin, polyvinyl butyral, ferrate...
|
|
JP7360029B2 |
To provide a rubber composition for steel cord adhesion excellent in water-resistant adhesiveness, and a conveyor belt.The rubber composition for steel cord adhesion contains a rubber component containing at least a diene rubber, a mixtu...
|
|
JP7351439B1 |
An adhesive composition for wet friction materials containing a resol type phenolic resin, polyvinyl butyral, a carboxylic acid having 1 to 6 carbon atoms, and an alcohol solvent.
|
|
JP7342886B2 |
A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa·s or less at 120° C...
|
|
JP7324775B2 |
Disclosed is an aqueous adhesive composition which comprises an admixture of: (a) a first aqueous composition comprising, (i) one or more film forming polymers, (ii) one or more lower crystallinity polynitroso compounds, (iii) one or mor...
|
|
JP7321328B1 |
Kind Code: A1 A pressure-sensitive adhesive sheet is provided which adheres well to curved surfaces and does not peel off even when impact such as dropping is applied, and has excellent adhesion reliability. The pressure-sensitive adhesi...
|
|
JP7314377B2 |
To provide a hot-melt adhesive resin composition which is bonded by heating for a short time, can exhibit high adhesive force, and dispenses with a special storage condition.A hot-melt adhesive resin composition contains component (A), c...
|
|
JP7304752B2 |
This copolymer latex for an adhesive contains a copolymer latex (A) and a copolymer latex (B). The copolymer latex (A) is an emulsion polymer of a monomer composition (a) containing 35-75% by mass of a butadiene monomer, 10-30% by mass o...
|
|
JP7300472B2 |
To improve strength of a woody board without using MDI.According to a woody board made by molding an adhesive agent additive material into a plate shape, the material in which an adhesive agent for bonding woody constituent materials to ...
|
|
JP7298613B2 |
A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition h...
|
|
JP2023524637A |
The disclosed materials and methods can be used in applications such as temporary bonding and release of semiconductor and display substrates. These materials have sufficiently low melt rheology to be used as adhesive layers and can be c...
|
|
JP7270720B2 |
The present invention relates to adhesive mixtures containing resorcinol and/or resorcinol esters, melamine formaldehyde ethers and sulfenamide derivatives and also silica for use in rubbers, to the production thereof, to vulcanizates an...
|
