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JP2017088732A |
To provide an adhesive composition for the lamination of semiconductors that quickly solidifies by heating and drying, has no adhesiveness in a distribution process, and quickly cures at such a temperature that reduces damage to semicond...
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JP6133542B2 |
To provide a film-shaped adhesive with which a semiconductor element can be mounted with a wire embedding structure and without being damaged, by reducing a gap on an adhesive surface produced in press bonding at the time of sealing.A fi...
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JP6127389B2 |
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JP2017071668A |
To provide an adhesive for metal having improved adhesion to metal.An adhesive for metal comprises (A) component: a metal resin composite material that is a complex of a metal particle (a1) and phenolic resin (a2) and has a metal atom-ox...
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JP2017071562A |
To provide an antibacterial composition having improved antibacterial effect.A antibacterial composition comprises a metal resin composite material that is a complex of a metal particle (a1) and phenolic resin (a2) and has a metal atom-o...
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JP6113530B2 |
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JP6091295B2 |
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JP6093639B2 |
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JP6084633B2 |
A two-component curable adhesive or sealant composition is provided. The first component may comprise a mixture of at least one polyol selected from the group comprising a polyester polyol, a polyester-polycarbonate copolymer polyol, and...
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JP6071120B2 |
The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.
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JP6061091B2 |
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JP6053617B2 |
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JP6049055B2 |
The present invention relates to: an optical member which is obtained by bonding two or more optical bases with use of a cured product of an ultraviolet curable resin composition that is characterized by containing (A) a novolac compound...
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JP6043696B2 |
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JP6044820B2 |
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JP6038217B2 |
The present invention relates to a film for a tire inner liner including: a base film layer including polyamide-based resin and a copolymer including polyamide-based segments and polyether-based segments; and an adhesive layer including ...
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JP6040751B2 |
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JP6040737B2 |
To provide an adhesive film capable of improving the reliability of a solder joint part.An adhesive film 10 is used when circuit members, in each of which a circuit is formed, are connected electrically to each other and has a base mater...
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JP6034925B2 |
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JP6031264B2 |
The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive...
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JP6032039B2 |
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JP2016536763A |
Structure and a manufacturing method of an ACF array which are transferred by the micro cavity array of the form and shape where especially un-random particles were decided beforehand, and size. This manufacturing method includes the flu...
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JP6030061B2 |
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JP6025313B2 |
Adhesion promoter comprises at least one carbodiimide compound, which is surface-deactivated by reacting with at least one amine. Adhesion promoter comprises at least one carbodiimide compound of formula (R11-(N=C=N-R) m-R22) (I), which ...
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JP2016190968A |
To provide a resol type phenolic resin for a friction material capable of achieving a high adhesive strength in a short adhesion time, and to provide a method for producing the same.A resol resin which is a resol type phenolic resin used...
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JP2016188344A |
To form unevenness having a high roughed effect and a random pattern on a release surface of a release film with an easy method.A release film 10 is a release film having a substrate 11, a resin layer 12 provided on the substrate 11, and...
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JP2016533000A |
In particular, a method of providing an outer casing on an elongated article such as a wire or cable room, including a textile support and a curable adhesive applied on at least one surface of the support. The adhesive tape is spirally g...
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JP6008680B2 |
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JP5998805B2 |
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JP5990825B2 |
An aqueous adhesive composition includes: a phenol/aldehyde resin; and an unsaturated elastomer latex. The phenol/aldehyde resin is based on at least: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including...
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JP5990824B2 |
An aqueous adhesive composition includes: a phenol/aldehyde resin and an unsaturated elastomer latex. The phenol/aldehyde resin is based on: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including at least ...
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JP5983614B2 |
An adhesive composition containing a latex of highly saturated nitrile rubber (A) which has ±,²-ethylenically unsaturated nitrile monomer units 10 to 55 wt%, conjugated diene monomer units 25 to 89 wt%, and ±,²-ethylenically unsatura...
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JP2016157781A |
To provide a conductive adhesive sheet which imparts electromagnetic wave shield effect reliably to a printed wiring board, while achieving excellent storage stability, tack-free, low resin flow, and flexibility simultaneously.A conducti...
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JP2016153453A |
To provide an adhesive for laminate steel sheet used for an adhesive for film of inner and outer surfaces of a body or a cover of laminate type beverage can, food can or the like and having reduced generation of fume during heat hardenin...
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JP5979237B2 |
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JP5976326B2 |
The purpose of the present invention is to provide a semiconductor device manufacturing method, whereby cutting reliability of an adhesive film can be improved and debris contamination due to the adhesive film can be suppressed. Provided...
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JP5966069B2 |
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JP5963027B2 |
To provide an industrially useful pressure-sensitive adhesive sheet that can be used to adhere various adherends and achieves both of superior peel adhesion force and superior push strength.The pressure-sensitive adhesive sheet has a pre...
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JP5953328B2 |
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JP5952078B2 |
Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting...
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JP5950127B2 |
To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excelle...
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JP2016125042A |
To provide an adhesive composition having excellent B stage stability and C stage curability, a light control panel comprising the same, a method for producing the same, and an optical imaging device.An adhesive composition comprises pol...
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JP5942382B2 |
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JP5942421B2 |
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JP5938857B2 |
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JP2016108364A |
To provide an anionic aqueous dispersion of α-olefin-vinyl acetate-based elastomer particles having excellent storage stability and oil resistance to a molded product and further to provide a method for producing the aqueous dispersion,...
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JP5928556B2 |
This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this co...
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JP5924410B2 |
An aqueous adhesive composition includes: a phenol/aldehyde resin; and an unsaturated elastomer latex. The phenol/aldehyde resin is based on at least: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including...
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JP5928770B2 |
To provide a resin composition which is excellent in e.g. adhesiveness to polyester film and the like and with which an adhesive layer, a heat sealing agent layer, and a coated film can be formed which do not cause the degradation of the...
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JP5924145B2 |
To provide a film-like adhesive capable of improving connection reliability in connection between a semiconductor element and a support member.A film-like adhesive 1 includes: a thermosetting component containing (a1) at least either of ...
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