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WO/2021/117521A1 |
A purpose of the present invention is to provide an adhesive composition which, even when containing neither formalin nor resorcinol, can have excellent adhesiveness. This adhesive composition is characterized by comprising a polypheno...
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WO/2021/117520A1 |
A purpose of the present invention is to provide a method for producing an adhesive composition, the method rendering excellent adhesiveness and production efficiency possible even when the adhesive composition contains neither formalin ...
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WO/2021/112091A1 |
The present invention addresses the problem of providing a rapidly curable resin composition that produces a low-modulus cured article. A resin composition according to the present invention includes: (A) a cyanate ester resin; (B) a c...
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WO/2021/112104A1 |
The problem addressed by the present invention is to provide a resin composition that can rapidly cure and that allows for the production of a low-elasticity cured product. The resin composition according to the present invention inclu...
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WO/2021/106848A1 |
[Problem] To provide an adhesive composition which has a high adhesion to a metal substrate and a resin substrate such as a liquid crystal polymer or syndiotactic polystyrene as well as to a conventional polyimide or polyester film, and ...
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WO/2021/084963A1 |
This adhesive agent composition for a wet-type friction member contains a resol-type phenol resin, a polyvinyl butylal, and a solvent, wherein the weight average molecular weight of the resol-type phenol resin is 1200-2000.
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WO/2021/079968A1 |
This adhesive agent composition contains a thermosetting adhesive agent component and metal particles. The adhesive agent component contains an epoxy resin, a phenol resin, and an elastomer. The metal particles are at least one of a silv...
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WO/2021/044915A1 |
A thermally conductive composition including metal-containing particles and a thermosetting component that includes at least one selected from the group consisting of polymers, oligomers, and monomers, the thermally conductive compositio...
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WO/2021/030252A1 |
The present disclosure relates to depolymerizable poly(aldehydes) and systems and methods of efficiently synthesizing the same. An exemplary method of making a polymer comprises continuously flowing a polymerization solution through at l...
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WO/2021/005266A1 |
The present invention concerns a resin composition comprising a resin containing a condensate of formaldehyde, lignin-comprising phenolic component and protein isolated from cereal grains and a process for the production of such composit...
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WO/2021/002248A1 |
Disclosed is an adhesive composition containing an epoxy resin, a curing agent, an elastomer, and a filler, wherein the elastomer comprises a polyurethane resin.
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WO/2021/002182A1 |
This copolymer latex for an adhesive contains a copolymer latex (A) and a copolymer latex (B). The copolymer latex (A) is an emulsion polymer of a monomer composition (a) containing 35-75% by mass of a butadiene monomer, 10-30% by mass o...
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WO/2021/002181A1 |
This copolymer latex for an adhesive and this adhesive composition contain a copolymer latex (A) and a copolymer latex (B). The copolymer latex (A) is an emulsion polymer of a monomer composition (a) containing 35-75% by mass of a butadi...
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WO/2020/194361A1 |
A binder for producing wood-based conglomerates without release of free formaldehyde, said binder having a total mass by weight, the total mass comprising a first quantity by weight of a compound selected from urea- formaldehyde or melam...
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WO/2020/137934A1 |
A film-like adhesive agent of one embodiment contains an acrylic resin (a), an epoxy compound (b1), and a phosphorus antioxidant (z). Before being heated at 260°C, this film-like adhesive agent has a linear transmittance of 90% or great...
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WO/2020/137944A1 |
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. When phosphorus concentration V1 is measured by performing X-ray photoelectron spectroscopy analysis on one surfa...
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WO/2020/129917A1 |
A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of tempora...
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WO/2020/109983A1 |
The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali and phenol. The lignin pre...
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WO/2020/103228A1 |
The present application relates to an adhesive composition, and an electronic product and preparation method therefor. The adhesive composition is prepared from the following raw materials in parts by weight: 20-40 parts of a thermosetti...
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WO/2020/072735A1 |
The present invention relates in part to a lignin composition and a method of fabricating a lignin composition. The invention also relates in part to a method of using a lignin composition to adsorb onto a petrochemical oil comprising th...
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WO/2020/053746A1 |
The present invention provides a hot-melt adhesive resin composition which can adhere upon short-time heating to exhibit high adhesion force and which is easy to store. More specifically, the present invention relates to a hot-melt adhes...
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WO/2020/053747A1 |
The present invention provides: a bus bar insulating film that is adhered through brief heating and exerts excellent adhesive power with respect to metal; and a bus bar equipped with such a film. More specifically, the present invention ...
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WO/2020/026757A1 |
Disclosed is an adhesive composition that contains an epoxy resin, a phenol resin, an elastomer, and a filler, in which the content of filler is 40-68 mass% in terms of the total amount of epoxy resin, phenol resin, elastomer, and filler...
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WO/2020/020807A1 |
The invention relates to adhesive mixtures which contain resorcin and/or resorcin ester, melamine-formaldehyde ether and sulphenamide derivatives and silicic acid, for their use in uncured rubbers, to the production thereof, to vulcanize...
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WO/2020/000583A1 |
The present invention relates to the technical field of adhesives, and in particular, to a lipid adhesive and a manufacturing method therefor. The lipid adhesive comprises the following ingredients: 50-80 parts of a mixed glue liquid, 1-...
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WO/2020/001140A1 |
A plant culture mat and a preparation method thereof. The plant culture mat consists of plant fibers and urea-formaldehyde glue. The plant fibers are bound by the urea-formaldehyde glue to form a plant fiber layer. The plant fibers have ...
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WO/2019/245337A1 |
One embodiment of the present invention provides a rubber-reinforced material which comprises a fibrous substrate, an adhesive layer disposed on the fibrous substrate, and a rubber compound layer disposed on the adhesive layer, and conta...
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WO/2019/202478A9 |
The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products.The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in ...
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WO/2019/229436A1 |
The present invention relates to specially formulated adhesives and methods for preparing such adhesives. The present invention also relates to composites and materials formed from such adhesives. More specifically, the present invention...
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WO/2019/207110A1 |
The invention relates to a method for the manufacture of mineral wool, comprising reacting an aqueous phenolformaldehyde resole with free formaldehyde with a first amount of urea, thereby preparing a prereact; contacting the prereact wit...
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WO/2019/202477A1 |
The present invention relates to a process for preparing a bonding resin, wherein a first resin prepared from lignin, formaldehyde and optionally phenol is mixed with a second resin prepared from lignin, formaldehyde and optionally pheno...
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WO/2019/202476A1 |
The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde and comprising a formaldehyde scavenger, is mixed with a resin prepared from phenol and formaldehyde ...
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WO/2019/202475A1 |
The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding ...
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WO/2019/185760A1 |
A method of manufacturing a wood board, comprising: - applying a binder composition, notably in the form of an aqueous solution, to loose wood matter to provide resinated loose wood matter, wherein the binder composition consists of a bi...
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WO/2019/185761A1 |
A method of manufacturing a composite product, comprising: - applying a binder composition, notably in the form of an aqueous solution, to non or loosely assembled matter to provide resinated matter, wherein the binder composition consis...
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WO/2019/180235A1 |
Monocomponent adhesive composition, comprising a formaldehyde-based resin and at least one compound selected from resorcinol, alkylresorcinol and/or tannin, which are not condensed with the resin. The monocomponent adhesive composition a...
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WO/2019/147717A1 |
Processes for manufacturing novolacs and resoles from lignin are disclosed. A phenol-aldehyde-lignin dispersion is formed which can then be used to make either a novolac or a resole, depending upon the catalysts used.
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WO/2019/125995A1 |
A phenolic resin composition is described comprising at least 50 wt.-% of phenolic resin; first polymerized units comprising a cationic group; and second polymerized units comprising an anionic group. The cationic groups are ionically bo...
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WO/2019/119559A1 |
A high-performance etherified bio-based resin, prepared by first using an amino resin and a hydroxyethyl cardanol ether as starting materials, and performing ether exchange under the action of a catalyst to obtain a high solid-content bi...
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WO/2019/104815A1 |
Provided is a method for preparing a furfural-modified lignin-based phenol formaldehyde resin adhesive, which is obtained by partially replacing phenol by means of reacting activated lignin prepared by using microbial fermentation with p...
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WO/2019/103133A1 |
Provided are an anionic aqueous dispersion exhibiting excellent oil resistance and heat resistance as a film, and a production method therefor. This anionic aqueous dispersion of chlorosulfonated polyethylene particles includes an aqueou...
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WO/2019/063915A1 |
The present invention relates to a process for manufacturing an aqueous adhesive composition in which the following is prepared: - a first phase by mixing at least one elastomer latex and at least one phosphate salt S1; - a second phase ...
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WO/2019/063914A1 |
The present invention relates to a process for electroplating an adhesive composition on at least one conductive element, in which: the conductive element is brought into contact with the adhesive composition comprising: - a phosphate sa...
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WO/2019/063913A1 |
The present invention relates to an adhesive composition comprising: - at least one phosphate salt chosen from sodium phosphate, potassium phosphate and the mixtures of these phosphates and, - at least one resin based on: at least one co...
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WO/2019/063916A1 |
The invention relates to a composite comprising: - at least one reinforcing element (10), - an adhesive layer (14) made from an adhesive composition, - an elastomeric bonding layer (16), - an elastomeric body. The adhesive composition co...
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WO/2019/063917A1 |
The invention relates to a composite comprising: - a reinforcing element (10), - an adhesive layer (14) made in an adhesive composition, - an elastomeric body made in an elastomeric matrix comprising an ethylene-alpha olefin elastomer an...
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WO/2019/039858A1 |
The present invention relates to an adhesive composition comprising a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive comprising the same, and to a manufacturing method therefor and, more specifically, to an adh...
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WO/2019/016636A1 |
The present invention relates to a liquid lignin composition, particularly useful in the manufacture of resins for products such as insulation, laminates and engineered wood products such as oriented strand boards (OSB).The liquid lignin...
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WO/2019/000643A1 |
The present invention relates to a starch emulsion-modified urea-formaldehyde resin adhesive. The starch emulsion-modified urea-formaldehyde resin adhesive is made from the following raw materials in parts by weight: 10 parts of a urea-f...
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WO/2018/229417A1 |
Metal or metal-plated reinforcement, at least the surface of which is at least partly made of metal, at least the metal portion being coated with a sulphur polybenzoxazine, the recurring units of which comprise at least one unit correspo...
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