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WO/2024/050576A1 |
The invention relates to a lateral wall (1) for a drawer comprising at least one support profile (2) and at least one retaining device (3, 18) for connecting the lateral wall (1) to a drawer rear wall or a drawer front wall, wherein the ...
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WO/2024/052137A1 |
The invention relates to a method and a device for processing a material by means of laser pulses of a pulsed laser, wherein the laser pulses are introduced into the material in order to process the material, wherein the laser pulses (30...
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WO/2024/052811A1 |
A method for a laser polishing of a workpiece's surface carrying at least one micro-structure having a determined shape. The workpiece's surface and the micro-structure are made from a same determined material and the laser polishing met...
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WO/2024/050577A1 |
The invention relates to a method for producing a side wall (1) for a drawer, comprising at least one carrier profile (2), which consists at least in some sections of a metal material, and at least one hollow profile (3), which consists ...
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WO/2024/053744A1 |
This film removal method is for removing, from an electric wire having a core wire and an insulating film made of an organic polymer material, the insulating film through irradiation with laser light. The insulating film is removed from ...
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WO/2024/052177A1 |
The present invention relates to a method for producing dimples (2) on the surface of a transparent material (1) using laser pulses of a short-pulse laser, in which method at least one dimple (2) is produced by means of a single laser pu...
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WO/2024/052178A1 |
The invention relates to a transparent component (1) with a functionalised surface, wherein the surface has dimples (2) and is thereby functionalised, wherein the functionalisation of the surface is an anti-glare functionalisation and th...
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WO/2024/052138A1 |
The invention relates to a transparent component (1) with a functionalised surface, wherein the surface has dimples (2) and laser-induced periodic surface structures (3), and is functionalised by the dimples (2) and the laser-induced per...
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WO/2024/053238A1 |
This edible body perforating method is for forming, in the surface of the edible body, a release hole for releasing, to the outside, an active ingredient housed in the edible body, said method comprising a laser irradiation step for form...
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WO/2024/051969A1 |
The invention relates to a method (100) for producing an impeller (10) of a flow machine, comprising a main body (11) and at least one impeller blade (12), wherein the main body (11) and the impeller blade (12) are connected in an integr...
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WO/2024/052655A1 |
A method of manufacturing a component (5) for use in a high temperature environment, the method comprises the sequential steps of: i) providing a first substrate (10) comprising a body having a surface, ii) securing a bonding material (1...
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WO/2024/053481A1 |
In the present invention, a support member (30) is provided to a robot arm (11). The support member (30) has a first support part (31), a second support part (32), and a rotating part (36). The first support part (31) supports a linear m...
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WO/2024/052998A1 |
The present invention is a laser oscillator having a function for monitoring the output of a laser beam emitted from a laser oscillation source, and comprises an excitation light source that outputs an excitation light to the laser oscil...
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WO/2024/053160A1 |
Provided are: a laser welding method to prevent cracks and obtain welded joints having excellent weld metal toughness; and a laser welded joint. This laser welding method comprises: butting steel material members together; coating the su...
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WO/2024/052612A1 |
The invention relates to a method for treating a sealing membrane (2) for a tank that is intended to contain gas in the liquid state, which method uses a treatment tool (72) mounted on a movable device (70), the treatment method comprisi...
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WO/2024/045907A1 |
A cooling structural body, comprising a cooling assembly (1), a mounting assembly (2) and a nozzle unit (3), wherein a cooling channel (4) is provided in the cooling assembly (1), and is provided with an input port (41) and an output por...
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WO/2024/047433A1 |
A method for gripping and moving worked pieces (51) obtained by cutting and/or punching at least one sheet metal (50) and arranged on a work surface (110) by means of a gripping and moving system (100) provided with a detection apparatus...
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WO/2024/045411A1 |
The present invention relates to a method for manufacturing a multi-layer circuit board by laser-guided electrical patterns and electrical interconnection of different surfaces, comprising: first manufacturing conductive patterns on all ...
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WO/2024/048107A1 |
A boiling cooler (100) comprises: a boiling unit (10) that boils a refrigerant (5) through heat-exchange with a heating element (HS); and a condensing unit (20) that condenses the refrigerant vaporized by the boiling unit and returns the...
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WO/2024/047257A1 |
The present invention relates to an optoelectronic component, comprising a substrate, in particular a cover layer, an optoelectronically active layer and a contacting layer, its outer and/or inner surface having a structured region with ...
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WO/2024/046001A1 |
A worktable for cutting a monocrystalline silicon wafer include a worktable (1), a control panel (2) is fixedly mounted on an outer wall of the worktable (1), a recess (3) is formed on an upper surface of the worktable (1), a rotatable t...
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WO/2024/046813A1 |
In the machining head, a cutting gas, as first gas stream, and a laser beam are directed at a component to be cut through a nozzle arranged in the direction of the component. The cutting-gas feed is, at least in the region of the nozzle ...
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WO/2024/049328A1 |
The invention relates to the field of laser engineering and glass cutting technology. Glass is cut using oblique focused radiation from a pulsed laser. Multi-layered glass is cut in this way. A sheet of glass lies on a table substrate or...
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WO/2024/046736A1 |
The present invention relates to a laminated glass pane (I) at least containing: an outer glass pane (1) with the outer face (1a) and the inner face (1b); an inner glass pane (2) with the outer face (2a) and the inner face (2b); and a po...
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WO/2024/048469A1 |
In order to prevent the configuration of a laser irradiation unit from becoming complicated due to measures against scattering material generated during surface processing with laser light, a collection device 20 for laser processing com...
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WO/2024/049703A1 |
The disclosure generally relates to laser power control. An example method includes obtaining data regarding laser output and input applicable to a CO2 laser generating system, and using the obtained data to generate an estimated corresp...
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WO/2024/047750A1 |
A processing system equipped with a partition device for demarcating a processing space, a first device for performing a first operation for changing the shape of an object by processing the object, which is housed in the processing spac...
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WO/2024/046975A1 |
This disclosure presents a cylindrical secondary cell (1) comprising a cylindrical enclosure (2) comprising a first enclosure end (2a), a second enclosure end (2b) and an enclosure sidewall (2c) extending between the enclosure ends (2a, ...
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WO/2024/049127A1 |
The present invention relates to a reference point marking apparatus for marking a reference point of a pattern electrode in which a coating part and a non-coating part are repeatedly arranged in the longitudinal direction. The pattern e...
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WO/2024/049149A1 |
Proposed is a deburring apparatus and method for an electrode plate of a secondary battery. The deburring apparatus includes a laser emitter configured to emit a laser beam with respect to an electrode including a terminal that is convey...
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WO/2024/049128A1 |
The present invention relates to a marking device for marking a reference point on a multi-lane electrode having multiple electrode lanes arranged along the width direction. The marking device comprises: a first marker for marking a refe...
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WO/2024/047256A1 |
The present invention relates to the field of substrate patterning with periodic dot patterns in the micrometer or submicrometer range, in particular a patterned substrate and a method for patterning surfaces of a transparent substrate b...
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WO/2024/043187A1 |
This hearth component is provided with an in-incinerator exposed surface that is exposed to the inside of an incinerator. The in-incinerator exposed surface comprises a front surface and an upper surface, and at least the front surface i...
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WO/2024/041903A1 |
The present invention relates to a laser system for laser machining a workpiece (104) using an interference pattern (124), comprising: at least one laser beam source (106) for providing a plurality of coherent laser beams (112); an ampli...
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WO/2024/041823A1 |
The invention relates to a method for monitoring a process of cutting a workpiece (12) with a laser beam (14), wherein the workpiece (12) is cut through from a top side (20a) to its underside (20b) located on the opposite side from the t...
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WO/2024/040994A1 |
A fully automatic welding apparatus for a steel barrel. The apparatus comprises a welding mechanism (3), and a roll, which has a first end (03) to be welded, and a second end (04) to be welded, wherein the welding mechanism comprises a p...
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WO/2024/042887A1 |
This glass sheet production method includes a cutting step in which laser light L is radiated along a closed-loop-shaped planned cut line CL provided on a glass sheet MG to cut the glass sheet MG, and a separating step in which a cut por...
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WO/2024/042729A1 |
The purpose of the present disclosure is to mitigate the burden on a user who, whenever a processing machine is used, selectively executes a switching program corresponding to the type of the processing machine. A laser processing cont...
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WO/2024/043220A1 |
The present invention is for making a hole that is formed in a surface opposite to an irradiated surface of an irradiation target approach perfect circularity. An irradiation target according to the present invention comprises a first ...
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WO/2024/043672A1 |
The present invention relates to a laser processing apparatus for forming a ring beam with uniform energy distribution and outputting a laser beam with a long depth of focus and a small focal point. The laser processing apparatus compris...
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WO/2024/042681A1 |
A machining system SYS is capable of machining an object W by irradiating the object with an energy beam EL, and comprises: an emission optical system 130 that can emit the energy beam; a plurality of irradiation optical systems 135 that...
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WO/2024/041741A1 |
The invention relates to a laser machining device and a method for machining a workpiece (105) which is equipped with a first pattern (104). The method comprises the following steps: sensing the first pattern (104) and then providing sen...
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WO/2024/040810A1 |
The present application relates to the technical field of welding. Disclosed is an ultrasonic vibration-based auxiliary welding device, comprising a vibration table and an ultrasonic vibration mechanism, wherein the ultrasonic vibration ...
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WO/2024/041899A1 |
The invention relates to a manufacturing device (1) for the additive manufacturing of components (3) from a powder material, comprising: - a beam-generating device (5), which is designed to generate an energy beam (7) having a beam profi...
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WO/2024/037828A1 |
The invention relates to a method for calibrating a measurement scanner on a laser-working optical unit of a laser working device, wherein, by means of a measurement beam, a measurement scan of a test body is created, and the measurement...
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WO/2024/037804A1 |
The invention relates to a cleaning device (10) for removing impurities (12) from a bar-shaped structure (14), having a drive unit (16) and two roughing discs (18a, 18b) which can be driven to rotate about a common axis of rotation (20),...
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WO/2024/037783A1 |
The invention relates to an operating method for a laser tool (10), wherein a laser beam (16) is deflected by means of a scanning optical unit (26) and exits through a protective glass (32), around which a plurality of scattered-light se...
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WO/2024/039975A1 |
In various embodiments, laser systems and processing techniques utilize multiple laser beams having different wavelengths coupled into optical fibers in which one region thereof is composed of doped or undoped low-OH fused silica, and an...
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WO/2024/039266A2 |
The proposed invention relates to a method and device for the controlled separation (cutting) of hard transparent and semi-transparent brittle materials, including tempered and superhard materials, using a process of laser filamentation ...
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WO/2024/009287A9 |
According to embodiments, provided is an apparatus for manufacturing a secondary battery. The apparatus comprises: a masking jig which is configured to secure an electrode lead and a bus bar and includes first to fourth inner walls defin...
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