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Title:
METHOD FOR MANUFACTURING MULTI-LAYER CIRCUIT BOARD BY LASER-GUIDED ELECTRICAL PATTERNS AND ELECTRICAL INTERCONNECTION OF DIFFERENT SURFACES
Document Type and Number:
WIPO Patent Application WO/2024/045411
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a multi-layer circuit board by laser-guided electrical patterns and electrical interconnection of different surfaces, comprising: first manufacturing conductive patterns on all surfaces with laser, laminating, pasting a solder mask, and drilling on an assembly site, so as to manufacture a mask pattern with metalized physical holes and an electrical interconnection channel between conductive layers on all the surfaces. By means of inserted element pins, interconnects, conductive materials added in the holes and the remelting effect caused by welding heat, connection between the conductive layers on all the surfaces and welding installation of elements are achieved at a time. According to the present invention, a finer circuit can be manufactured, and processes, equipment and materials required by hole metallization, pattern transfer, etching, film removal, solder resist pattern transfer and coating of protective and solderable materials can be omitted. Moreover, the present invention is suitable for large-batch production of various circuit boards, and is also suitable for small-batch and multi-variety production of circuit board samples.

Inventors:
HU HONGYU (CN)
YU YUEXIN (CN)
Application Number:
PCT/CN2022/138332
Publication Date:
March 07, 2024
Filing Date:
December 12, 2022
Export Citation:
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Assignee:
DCT CO LTD (CN)
International Classes:
H05K3/46; B23K26/14; B23K26/16; B23K26/382; B23K26/70; H05K3/00; H05K3/02; H05K3/34; H05K3/40; B23K101/36
Foreign References:
CN115397137A2022-11-25
JPH11298144A1999-10-29
JPH09246724A1997-09-19
CN101296583A2008-10-29
JPH09172261A1997-06-30
Attorney, Agent or Firm:
TIANJIN WISELY INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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