Title:
VINYL COMPOUND, VINYL COMPOSITION, VINYL RESIN CURED PRODUCT, PREPREG, RESIN-ATTACHED FILM, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/085082
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel compound that can be used as a constituent material for printed wiring boards, has a low melting point and high solubility, and can be cured to provide a resin having high thermal conductivity and low dielectric loss. The present invention pertains to a vinyl compound represented by formula (1) or (2). (R is a (meth)acryloyl group or a vinylbenzyl group; A1 is a chain-like saturated aliphatic hydrocarbon group, or a group containing at least one selected from the group consisting of an aromatic group and a cycloalkane group; A2 is a group containing at least one selected from the group consisting of an aromatic group, a cycloalkane group, and a cycloalkene group; X1 is a single bond, an ester group, a carbonyl group, or an ether group; m is an integer of 3-6; and n is an integer of 1-20.)
Inventors:
SAKUGAWA NANASE (JP)
TANAKA DAIKI (JP)
TANAKA DAIKI (JP)
Application Number:
PCT/JP2023/037192
Publication Date:
April 25, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08F12/34; B32B27/30; C07C69/76; C08J5/24; H01B3/44
Domestic Patent References:
| WO2015080141A1 | 2015-06-04 |
Foreign References:
| JP7060181B1 | 2022-04-26 | |||
| US20160160008A1 | 2016-06-09 | |||
| JP5454749B1 | 2014-03-26 | |||
| JPH11124515A | 1999-05-11 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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