Title:
GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/085083
Kind Code:
A1
Abstract:
Provided is a glass substrate that suppresses cracking during laser processing. A glass substrate (10) has a mark (100) provided on the surface thereof, and has a parameter (y) as stipulated in formula (1) of less than 1.4.
Inventors:
KOBAYASHI YUHA (JP)
KATSUNO KAEDE (JP)
KATSUNO KAEDE (JP)
Application Number:
PCT/JP2023/037202
Publication Date:
April 25, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C03C23/00; C03C19/00; H01L21/02
Domestic Patent References:
| WO2019044148A1 | 2019-03-07 | |||
| WO2016136348A1 | 2016-09-01 |
Foreign References:
| JP2011251854A | 2011-12-15 | |||
| JP2016508954A | 2016-03-24 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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