Title:
POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/052980
Kind Code:
A1
Abstract:
A work (1) is rotationally symmetric with respect to an axis (L0), and a section of a surface (5) thereof to be polished which is formed by cutting the surface (5) along a virtual plane containing the axis (L0) includes a circular arc (5a) which extends from the intersection with the axis (L0) toward one side of the axis (L0) over an angle exceeding 120°. When polishing the work (1) with a rotating brush (10), the work (1) is rotated around the axis (L0) and, simultaneously therewith, the rotating brush (10) is rotated and pressed against the surface (5) to be polished and is moved along the circular arc (5a) while the rotation axis (L1) of the rotating brush (10) is kept perpendicular to the contact surface of the surface (5) to be polished. The rotational direction (R2) of the rotating brush (10) is opposite to the rotational direction (R1) of the work (1) in the forward side along the moving direction (M1) of the rotating brush (10), when the surface (5) to be polished and the rotating brush (10) are viewed from the rotation axis (L1) direction along the rotation axis (L1).
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Inventors:
FUKUSHIMA KEISUKE (JP)
Application Number:
PCT/JP2022/033388
Publication Date:
March 14, 2024
Filing Date:
September 06, 2022
Export Citation:
Assignee:
XEBEC TECH CO LTD (JP)
TAIMEI CHEMICALS CO LTD (JP)
TAIMEI CHEMICALS CO LTD (JP)
International Classes:
B24B29/00; A61F2/30; B24B11/00; B24B29/04; B24B37/025
Foreign References:
| JPS62292357A | 1987-12-19 | |||
| JP2020183010A | 2020-11-12 | |||
| JP2019195860A | 2019-11-14 | |||
| JP2002263995A | 2002-09-17 | |||
| JP2008029700A | 2008-02-14 | |||
| CN113414717A | 2021-09-21 |
Attorney, Agent or Firm:
KAWAI Toru et al. (JP)
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