To provide a metal ingot polishing device which makes metal wires hardly come out from a metal brush and prevents the metal brush from making belt shaped stripes on the surface of the metal ingot to be polished.

In the metal ingot device comprising a polishing machine frame 11, a polishing plate 20 which a metal brush 25 is planted on and mounted on the polishing machine frame 11 detachably, and a polishing frame drive mechanism 17, which is built in the polishing machine frame 11 and rotates the polishing plate 20 at speeds ranging from 100 to 150 rpm, and the metal brush 25 is formed by such a way that wire bundles 25a folded in a U-shaped by bundling 30 to 60 metal wires of 0.2 to 0.5 mm in diameter are planted at a plurality of places on the surface of the polishing plate 20 with height of 15 to 50 mm.