Title:
POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENTS AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/053390
Kind Code:
A1
Abstract:
The present invention provides: a polishing agent which is capable of polishing a surface to be polished, the surface containing a resin, highly flat at a high rate; an additive solution for polishing agents; and a polishing method. This polishing agent is used for the purpose of polishing a surface to be polished, the surface containing a resin, and contains abrasive grains, a water-soluble nitrogen-containing compound and water; and the water-soluble nitrogen-containing compound contains a compound represented by one of formulae (1) to (3) or a salt thereof. (The symbols are as defined in the description.)
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Inventors:
NAKASHIMA HIDEKI (JP)
KATO TOMOO (JP)
AKAJI MASATOSHI (JP)
OKAMURA YUZO (JP)
IWAMOTO HIROAKI (JP)
KATO TOMOO (JP)
AKAJI MASATOSHI (JP)
OKAMURA YUZO (JP)
IWAMOTO HIROAKI (JP)
Application Number:
PCT/JP2023/030140
Publication Date:
March 14, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C09K3/14; B24B37/00; B24B37/015; B24B53/017; C09G1/02; H01L21/304
Domestic Patent References:
| WO2020262628A1 | 2020-12-30 |
Foreign References:
| JP2017190413A | 2017-10-19 | |||
| JP2016537438A | 2016-12-01 | |||
| JP2016154208A | 2016-08-25 |
Other References:
KIM, H. ET AL.: "Effect of Chemicals and Slurry Particles on Chemical Mechanical Polishing of Polyimide", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 39, 2000, pages 1085 - 1090, XP001048257, DOI: 10.1143/JJAP.39.1085
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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