Title:
RELEASE FILM, RESIN COMPOSITION, MANUFACTURING METHOD OF RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/053391
Kind Code:
A1
Abstract:
A release film comprising: a laminated film in which a first coating layer B1 containing a polyester resin containing an inorganic pigment, a void-containing layer A containing voids therein, and a second coating layer B2 containing a polyester resin containing an inorganic pigment are laminated in this order; and a release layer C on at least one side of the laminated film, wherein the void-containing layer A is made of a composition containing a polyester resin, a polyolefin resin, and a silicone resin, and has an apparent density of 0.80 g/cm3 or more and 1.20 g/cm3 or less.
Inventors:
NISHIO SHOTARO (JP)
SHIMIZU AKIRA (JP)
SHIMIZU AKIRA (JP)
Application Number:
PCT/JP2023/030143
Publication Date:
March 14, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B5/18; C09D183/04
Foreign References:
| JP2000313175A | 2000-11-14 | |||
| JP2003105115A | 2003-04-09 | |||
| JP2001347609A | 2001-12-18 | |||
| JPH10286923A | 1998-10-27 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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