Title:
ELECTRONIC DEVICE COMPRISING HOUSING, AND METHOD AND APPARATUS FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/063542
Kind Code:
A1
Abstract:
An electronic device comprising a housing is disclosed. The electronic device according to various embodiments of the present invention comprises a housing, wherein the housing may comprise: a substrate layer which has a 3D shape including at least one protrusion; and a film layer which is disposed on a surface of the substrate layer, facing the outside of the electronic device, and has a higher hardness than the substrate layer, and the hard film layer may comprise a first optical pattern formed on a first surface facing a first direction which is the inward direction of the electronic device.
Inventors:
HWANG HANGYU (KR)
KIM CHANGSU (KR)
NA SANGSIK (KR)
KIM CHANGSU (KR)
NA SANGSIK (KR)
Application Number:
PCT/KR2023/014304
Publication Date:
March 28, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/00; B29C45/00; B29C45/14; B29C45/37; B29D11/00; B32B7/023; B32B27/08; B29L31/34
Foreign References:
| KR102086794B1 | 2020-04-14 | |||
| KR20220002197A | 2022-01-06 | |||
| KR20140142635A | 2014-12-12 | |||
| KR101481228B1 | 2015-01-09 | |||
| KR20220023510A | 2022-03-02 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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