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Title:
ADHESIVE SHEET AND PEELING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/063129
Kind Code:
A1
Abstract:
The present invention enables an object held by an adhesive sheet to be picked up using a milder operation.　This adhesive sheet comprises: a base material; and an adhesive layer that has protrusions/recessions on the front surface thereof. The adhesive layer includes a base portion and a projection section provided on the base portion, and satisfies relational expression (1), the base portion being formed from a portion extending in the thickness direction of the adhesive layer from a recess section at which the thickness of the adhesive layer is at a minimum to the surface on the opposite side from the front surface on which the protrusions/recesses are provided. Relational expression (1): 0.25

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Inventors:
NISHIJIMA KENTA (JP)
ONISHI GO (JP)
SUEYOSHI HARUKI (JP)
KATO TOMOFUMI (JP)
SUGINO TAKASHI (JP)
MASUMOTO MUTSUMI (JP)
Application Number:
PCT/JP2023/034250
Publication Date:
March 28, 2024
Filing Date:
September 21, 2023
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; B32B3/30; B32B7/06; B32B27/00; B32B27/30; C09J4/02; C09J5/00; C09J7/24; C09J7/38; C09J133/00; C09J201/00; H01L21/56; H01L21/683
Domestic Patent References:
WO2019216262A12019-11-14
WO2020196758A12020-10-01
WO2019172220A12019-09-12
Foreign References:
JP2003336018A2003-11-28
JP2020061529A2020-04-16
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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