Title:
EXPANSION DEVICE AND DEVICE CHIP MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021153113
Kind Code:
A
Abstract:
To provide an expansion device which can inhibit damage of a device chip while inhibiting deterioration of transverse strength.SOLUTION: An expansion device expands an expand sheet 3 of a frame unit 1, where a wafer 2 having a modified layer formed along a division line is held at an opening 12 of an annular frame 4 by the expand sheet 3, in a surface direction. The expansion device includes: a frame holding part which holds the annular frame 4 of the frame unit 1; a chuck table having a holding surface which supports the wafer 2 through the expand sheet 3; an expansion drum which relatively separates the frame holding part and the chuck table in a direction orthogonal to the holding surface to expand the expand sheet 3; and a protection sheet peeling unit 170 which peels a protection sheet 15 adhered to a surface 5 of the wafer 2 before the expand sheet 3 is expanded by the expansion drum.SELECTED DRAWING: Figure 5
Inventors:
HIROZAWA SHUNICHIRO
Application Number:
JP2020052848A
Publication Date:
September 30, 2021
Filing Date:
March 24, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301
Attorney, Agent or Firm:
Sakai International Patent Office