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WO/2021/249733A1 |
The invention relates to a method for separating a plurality of slices by means of a wire saw, wherein a wire grating (2) is tensioned in a plane between two wire-guiding rollers (1), wherein each of the two wire-guiding rollers (1) is m...
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WO/2021/249719A1 |
The invention relates to a method for separating a plurality of slices from workpieces (4) by means of a wire saw, wherein the wire saw comprises a wire grating (2) formed by moving wire sections of a saw wire (3) and a control device (1...
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WO/2021/251015A1 |
This glass plate manufacturing device includes a support device that comprises a plurality of supporting members disposed along the up/down direction. When the up/down direction distance between the support member located at the top and ...
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WO/2021/249735A1 |
The invention relates to a method for separating a plurality of slices from workpieces (4) by means of a wire saw, wherein the wire grating (2) is tensioned in a plane between two wire-guiding rollers (1), wherein each of the two wire-gu...
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WO/2021/249781A1 |
The invention relates to a method for separating a plurality of slices from workpieces (4) by means of a wire saw, wherein a wire grating (2) is tensioned in a plane between two wire-guiding rollers (1), wherein each of the two wire-guid...
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WO/2021/250975A1 |
An apparatus for manufacturing a glass sheet is provided with a cutting device 1 for cutting a glass ribbon GR that is delivered downward in the vertical attitude to form a glass sheet GS. The cutting device 1 is equipped with a cutting ...
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WO/2021/246573A1 |
The present invention provides an ASC process automation device including: a loading part into which an ingot having been subjected to a wire sawing is input; a kerosene cleaning part for cleaning the ingot with kerosene; a precleaning p...
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WO/2021/240322A1 |
The present invention relates to a method for producing a structural element by joining together at least two separately produced parts (A1), (A2), (A3), (B1), (B2); (C1), (C2), (D), whereof at least one part (A1), (A2), (A3); (C1), (C2)...
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WO/2021/226410A1 |
One variation of a method includes: ingesting an air sample captured during an air capture period at a target location for collection of a first mixture including carbon dioxide and a first concentration of impurities; conveying the firs...
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WO/2021/218656A1 |
A silicon rod cutting process, comprising the following steps: squaring a silicon rod (1), cutting same into a central silicon block (21) extending in the same direction as the silicon rod, and four edge materials, and cutting the four e...
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WO/2021/221378A1 |
The present invention relates to a ceramic cutting method and equipment, which is provided with a configuration comprising: a beam irradiation unit for irradiating a beam of a wavelength that is absorbed by a pattern formed on an upper s...
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WO/2021/219900A1 |
A manual ceramic cutter with an adjustable set-square, having a set-square (1) installed at one of the longitudinal extremities of a base (2) for supporting the ceramic items to be cut, and a manually-operated cutting head (3) installed ...
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WO/2021/212960A1 |
A control system and working method of a computer panel saw. A computer panel saw comprises a programmable logic controller, a data bus connected to the programmable logic controller, and a work clamp feeding device control unit, a press...
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WO/2021/208365A1 |
A method for preparing a large-size single crystal, belonging to the field of semiconductor material preparation, and particularly relating to a method for preparing a large-size single crystal from a plurality of small-size single cryst...
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WO/2021/209980A1 |
A method of making wave energy capture means in a cliff. At least two pairs of holes (2, 2, 3, 3) are drilled in a cliff 1 which emerge from its face in a pattern which enables an oscillating water column (OWC) chamber 5 to be excised. A...
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WO/2021/208440A1 |
An edge-removing machining method for a wafer chip, and a scribing machine using same. Said method comprises: defining the backside outer edge of a wafer chip (4) as a wafer chip outer edge ring (4b) to be removed; calculating and genera...
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WO/2021/209651A1 |
Disclosed is a manual ceramics cutter with detachable accessories, comprising: a base (1) for supporting a ceramic piece to be cut; a manually actuatable cutting head (2); guides (3) for moving the cutting head; and at least one detachab...
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WO/2021/204496A1 |
The invention relates to a process for manufacturing a ceramic bending mold (K) for glass panes, comprising the following process steps: (A) determining a shape (K') of the bending mold (K) that includes a contact surface (F-K); (B) prov...
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WO/2021/203179A1 |
The invention relates to the use of a diamond wire machine for cutting underwater rocks, installed on a platform that is onshore, floating or standing on the bottom, located on the bed of rivers, lakes and seas. The special underwater cu...
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WO/2021/204765A1 |
This disclosure relates to a disk cutter (100) for a cutting assembly of a rock excavation machine. The disk cutter comprising a cutter body (102) including at least one light-weighting aperture (110).
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WO/2021/206610A1 |
A drilling machine (120) for a core drill (100), the drilling machine comprises a motor arranged to power a spindle, the spindle comprising a drill bit interface (121 ) arranged to hold a drill bit (110) and to rotate the drill bit (110)...
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WO/2021/200513A1 |
A glass blank material manufacturing method comprising a rotation step and a slicing step. In the rotation step, a support rod and a workpiece are rotated together. In the slicing step, each of a plurality of wires that are stretched in ...
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WO/2021/196640A1 |
An indexing device applied to a bench saw, comprising an elongated positioning plate (4), a vertical positioning plate (3), an indexing disc seat (13), a backing plate (1), an indexing ruler (10), a long bolt (8), a positioning pad (6), ...
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WO/2021/199791A1 |
This boring device according to one embodiment is characterized by comprising: a blade tip; a drive device for rotationally driving the blade tip; a supply flow path for supplying cooling liquid to the blade tip; and a tube pump for feed...
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WO/2021/190529A1 |
Disclosed are a PCD cutter (10) for realizing machining by means of milling instead of grinding, and a preparation method therefor. The number of blades (1) of the PCD cutter (10) is 10-100, the blades (1) are distributed on a cutter hea...
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WO/2021/190528A1 |
A machining method for milling machining on a hard brittle material using a multi-blade super hard tool, comprising the following steps: S1. clamping a material to be machined onto a machine tool; S2. mounting a multi-blade super hard to...
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WO/2021/190393A1 |
A pile head annular cutting device, comprising a track arranged on a pile head and coaxial with the pile head, an electric saw mounting base slidably arranged on the track, an electric saw support rotationally arranged on the electric sa...
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WO/2021/184473A1 |
Disclosed is a manual cutting machine. The manual cutting machine comprises a guide rail seat (1), suction pads (2) and a manual cutting device (3), with the suction pads being fixed to two ends of one side of the guide rail seat, and th...
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WO/2021/184583A1 |
A cutting and polishing integrated apparatus for crystal processing, which comprises a rack (1). A cutting frame (2) is disposed on the rack (1); a lifting plate (3) is disposed on the cutting frame (2), and a first lifting cylinder (4) ...
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WO/2021/180247A1 |
A method for cutting a silicon rod, in which a silicon rod is cut into silicon wafers, and comprising a slicing step. The silicon rod is a single crystal silicon rod having a crystal orientation of 100, the slicing direction forms an ang...
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WO/2021/182213A1 |
A tip saw (1) is used in cutting. The tip saw (1) has a disc-shaped base metal (2) and a plurality of cutting tips (10) that are bonded to the outer circumference of the base metal (2). The pitches (11) of the plurality of cutting tips (...
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WO/2021/180248A1 |
A preparation method for a single crystal silicon wafer (3) having a non-100 crystal orientation, comprising the following steps: cutting an oblique quadrangular prism-shaped silicon block (2) from a single crystal silicon rod (1), the b...
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WO/2021/182095A1 |
After a glass plate G having a scribe line S formed thereon is placed on a placement table 10 and the glass plate G is positioned such that the scribe line S is located in a bending stress imparting part 15 of the placement table 10, whe...
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WO/2021/176526A1 |
Provided is a laser cleaving method which, in processing of sapphire having a thickness of not less than several millimeters, reduces working time etc. and achieves high-quality parting. A laser light source 103 emits a laser beam 3 at a...
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WO/2021/175655A1 |
The present invention relates to a method for determining a recommendation of a gear to be engaged for a core-drilling apparatus. According to the proposed method, for example, a drop in speed of a core-drill bit of the core-drilling app...
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WO/2021/177558A1 |
The present invention relates to an apparatus for punching an anchor bolt insertion hole, wherein the apparatus enables punching work for forming the anchor bolt insertion hole, of which the bottom side is wider than an inlet, on a panel...
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WO/2021/168528A1 |
A dual platform bed system with associated machine for transferring material sheets from one platform bed to another, and associated methods for both transferring and processing sheets on either or both platforms. Placing the platform be...
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WO/2021/171278A1 |
A workpiece platform (1) for a disc saw apparatus (2) comprises a workpiece receiving surface and a main channel (15) extending Into the workpiece platform (1) from the workpiece receiving surface (7) for releasabiy engaging a residue co...
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WO/2021/169479A1 |
A four-corner positioning and cutting device, comprising an electric control unit, a belt conveyor (100), four-corner film cutting mechanisms (200), and a photoelectric detection switch (500). The four-corner film cutting mechanism (200)...
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WO/2021/169460A1 |
A sheet material compositing production line, comprising: a feeding system, a front sheet material turning device (108) connected to the feeding system to turn a sheet material so that the sheet material has the front surface facing up, ...
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WO/2021/162603A1 |
A method of manufacturing a chain link (8) of an abrasion cutting chain comprises: providing a metal blank with outer contours of the chain link (8) and rivet holes (14); and providing a ring (15) of a seal material by injection-molding ...
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WO/2021/160504A1 |
The invention relates to a device for covering a cut gap which can be produced by a machine tool. The device can be connected to a dust suctioning device so that the dust produced while working with the machine tool can be removed from t...
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WO/2021/160902A1 |
A locking mechanism for the folding chassis of electric cutting machines. The chassis (1) comprises: a supporting base (11), a tilting arm (12), and an end arm (13) bearing wheels (14) that are collapsible with respect to a principal arm...
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WO/2021/160393A1 |
A tool for breaking rocks comprising a tool head (4) supported by a guide means (2) to be linearly displaceable with respect to the guide means between a retracted position and an extended position, a distal end of said tool head extendi...
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WO/2021/156167A1 |
The invention relates to an installation device for carrying out installation steps on a wall and to a method for exchanging a tool held by an installation apparatus. The installation device comprises an installation apparatus (10), whic...
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WO/2021/151695A1 |
The invention relates to a method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes that are divided into initial cuts and first and second subsequent cuts, the wire saw compris...
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WO/2021/153846A1 |
Provided is a wire sawing device comprising an ingot temperature controller, the wire sawing device comprising: a chamber; an ingot clamp supporting an ingot inside the chamber; a first roller and a second roller; a wire which is wound a...
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WO/2021/153265A1 |
This device for manufacturing thinned wafers is capable of subjecting a thinned wafer to various processes while preventing damage to the thinned wafer, and comprises: a separating means 10 which forms a weakness layer WL on a semiconduc...
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WO/2021/153264A1 |
This device for manufacturing a thinned wafer can convey a thinned wafer in a manner that does not damage the wafer and can execute various types of steps, the device comprising: a base material supporting means 10 for supporting a semic...
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WO/2021/155179A1 |
A se!f-propelled roadway maintenance machine (20) has an operator's station (36) located on a front portion of the machine's chassis (24) and including a forward-facing operator's seat (40). A driven implement, such as a crack routing cu...
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