Title:
LASER CLEAVING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/176526
Kind Code:
A1
Abstract:
Provided is a laser cleaving method which, in processing of sapphire having a thickness of not less than several millimeters, reduces working time etc. and achieves high-quality parting. A laser light source 103 emits a laser beam 3 at a wavelength for which a sapphire plate 1 has a light absorbance of not less than 1% but less than 50%, and thermal stress which has been generated by the emission of the laser beam 3 is used to carry out cleavage by causing a crack to develop inside the sapphire plate 1, starting from a minute defect that is provided in the sapphire plate 1. The laser light source 103 emits a laser beam 3 which has a laser output power of not less than 60 W.
Inventors:
FURUMOTO TATSUAKI (JP)
OCHI YUZO (JP)
OCHI YUZO (JP)
Application Number:
PCT/JP2020/008713
Publication Date:
September 10, 2021
Filing Date:
March 02, 2020
Export Citation:
Assignee:
SHINKOSHA KK (JP)
UNIV NAT CORP KANAZAWA (JP)
UNIV NAT CORP KANAZAWA (JP)
International Classes:
B28D5/00; B23K26/50; B23K26/60; B26F3/06
Domestic Patent References:
| WO2010098186A1 | 2010-09-02 |
Foreign References:
| JP2010089144A | 2010-04-22 | |||
| JP2019042925A | 2019-03-22 | |||
| JP2007301631A | 2007-11-22 | |||
| JP2011011972A | 2011-01-20 |
Attorney, Agent or Firm:
FUKUDA Shinichi et al. (JP)
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