SILICON ROD CUTTING PROCESS

WIPO Patent Application WO/2021/218656

A1

A silicon rod cutting process, comprising the following steps: squaring a silicon rod (1), cutting same into a central silicon block (21) extending in the same direction as the silicon rod, and four edge materials, and cutting the four edge materials into a first small silicon block (22), a second small silicon block (23) and a third small silicon block (24) extending in the same direction as the silicon rod, the cross-sectional length of the first small silicon block and the third small silicon block being half of the cross-sectional width of the central silicon block, and the cross-sectional length of the second small silicon block being the same as the cross-sectional width of the central silicon block; and slicing the central silicon block, the first small silicon block, the second small silicon block and the third small silicon block, the slice direction being parallel to the extending direction of the silicon rod. In this way, the length dimension of silicon slices obtained by slicing may not be limited by the diameter of the silicon rod, and rectangular silicon slices with a large length dimension are easily prepared; in addition, silicon slices of two width specifications can be cut, increasing the utilization rate of the silicon rod and reducing the production cost of the silicon slices.

CAO YUHONG (CN)
YUE WEIWEI (CN)
FU LIMING (CN)

PCT/CN2021/087696

November 04, 2021

April 16, 2021

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CHANGZHOU SHICHUANG ENERGY CO LTD (CN)

B28D5/00; H01L21/02

CN111361027A	2020-07-03
CN109747055A	2019-05-14
CN108068221A	2018-05-25
CN201824485U	2011-05-11
JP2014033022A	2014-02-20
JP2005014241A	2005-01-20

SUZHOU MAMBO PATENT AGENCY (GENERAL PARTNERSHIP) (CN)

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