Title:
MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/286286
Kind Code:
A1
Abstract:
Providing is a molding method by which, when molding a seal material in a direction intersecting depressions and protrusions in a substrate, it is possible to reduce damage and deformation of the substrate. The present invention includes, with respect to a cavity plate 410 having a groove 462 in which a rubber material is injected, the following: a pre-molding step for injecting the rubber material, at a temperature at which the rubber material does not crosslink, into the groove 462; and a vulcanization molding step for molding the rubber material, at a temperature at which the rubber material crosslinks, as a sealing material 172 on a substrate 300, the substrate 300 being interposed between the cavity plate 410 having the groove 462 in which the rubber material has been injected and a mold 420. When the mold 420 is seen from the cross-section at a position separated by a predetermined distance in a X direction that is substantially orthogonal to a Y direction in which the sealing material extends from the position in which the sealing material 172 is molded, at least a surface 422, which opposes recesses 334 and protrusions 332 of the substrate 300, is a flat surface.
Inventors:
MORI KEISUKE (JP)
HIRAYAMA KOUJI (JP)
HIRAYAMA KOUJI (JP)
Application Number:
PCT/JP2021/026895
Publication Date:
January 19, 2023
Filing Date:
July 16, 2021
Export Citation:
Assignee:
KOKOKU INTECH CO LTD (JP)
International Classes:
B29C69/02; F16J15/10
Domestic Patent References:
| WO2017002579A1 | 2017-01-05 |
Foreign References:
| JP2011144852A | 2011-07-28 | |||
| JP2005047262A | 2005-02-24 | |||
| JP2004225721A | 2004-08-12 |
Attorney, Agent or Firm:
KAJI Toshikazu et al. (JP)
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