Title:
MOLDING METHOD AND DIE
Document Type and Number:
WIPO Patent Application WO/2023/286285
Kind Code:
A1
Abstract:
Provided are a molding method and a die which can further reduce the distance between an inclined portion of a base material and a sealing material when molding the sealing material on the base material having the inclined portion. The molding method comprises: a pre-molding step for injecting, in a cavity plate 510 having a groove 562 into which a rubber material 150 is injected, the rubber material 150 into the groove 562 at a temperature at which the rubber material 150 is not vulcanized; and a vulcanization molding step for interposing a base material 300 between a die 520 and the cavity plate 510 in which the rubber material 150 is injected into the groove 562, and molding the rubber material 150 on the base material 300 as a sealing material 172 at a temperature at which the rubber material 150 is vulcanized. The cavity plate 510 has: a space forming part 564 for generating a space Sp with an inclined portion 304 of the base material 300 when a flat surface 302 and a flat surface 306 of the base material 300 are pressed in the vulcanization molding step; and a coupling groove coupling the groove 562 and the space forming part 564. The groove 562 of the cavity plate 510 is provided in the vicinity of the space forming part 564.
Inventors:
NISHIMURO MAKIYA (JP)
HIRAYAMA KOUJI (JP)
HIRAYAMA KOUJI (JP)
Application Number:
PCT/JP2021/026894
Publication Date:
January 19, 2023
Filing Date:
July 16, 2021
Export Citation:
Assignee:
KOKOKU INTECH CO LTD (JP)
International Classes:
B29C69/02; B29C45/17; F16J15/10
Foreign References:
| JP2016091726A | 2016-05-23 | |||
| JP2013181551A | 2013-09-12 | |||
| JP2004225721A | 2004-08-12 |
Attorney, Agent or Firm:
KAJI Toshikazu et al. (JP)
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