Title:
MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/286287
Kind Code:
A1
Abstract:
Provided is a molding method with which it is possible to reduce contamination of a substrate by an adhesive or a tackifier. A molding method for molding a sealing material 172 onto a substrate 140, the molding method being provided with: a preliminary molding step in which in a cavity plate 160 having grooves 162 for injecting a rubber material 150 thereinto, the rubber material 150 is injected into the grooves 162 at a temperature at which the rubber material 150 does not crosslink; an application step for applying an adhesive or a tackifier 600 onto the surface of the rubber material 150 injected into the grooves 162 of the cavity plate 160; and a vulcanization molding step for sandwiching a substrate 140 between a second mold 222 and the cavity plate 160 in which the adhesive or the tackifier 600 has been applied to the surface of the rubber material 150, and molding, at a temperature at which the rubber material 150 crosslinks, the rubber material 150 as a sealing material 172 onto the substrate 140 with the adhesive 600 interposed therebetween.
Inventors:
MITSUTAKE YUKI (JP)
HIRAYAMA KOUJI (JP)
HIRAYAMA KOUJI (JP)
Application Number:
PCT/JP2021/026896
Publication Date:
January 19, 2023
Filing Date:
July 16, 2021
Export Citation:
Assignee:
KOKOKU INTECH CO LTD (JP)
International Classes:
B29C65/48; B29C45/02; B29C69/02; F16J15/10
Foreign References:
| JP2004225721A | 2004-08-12 | |||
| JP2013181551A | 2013-09-12 | |||
| JPH0493227A | 1992-03-26 | |||
| JP2007292274A | 2007-11-08 | |||
| JP2004225721A | 2004-08-12 |
Attorney, Agent or Firm:
KAJI Toshikazu et al. (JP)
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