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Title:
BASE FILM FOR SEMICONDUCTOR MANUFACTURING TAPE
Document Type and Number:
WIPO Patent Application WO/2024/084864
Kind Code:
A1
Abstract:
A base material film (1) for a semiconductor manufacturing tape has at least a functional layer (2). The functional layer (2) contains at least a 1-butene homopolymer and a pentene copolymer. The ratio of stress (at 5% elongation) to stress (at 40% elongation) is less than 1.05, stress (at 20% elongation) is 6.5 MPa to 20 MPa inclusive, and the stress relaxation rate is 25% or more.

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Inventors:
ISHIMOTO TAKAYUKI (JP)
TSUMORI CHIAKI (JP)
OSHIMA HIROYUKI (JP)
Application Number:
PCT/JP2023/033228
Publication Date:
April 25, 2024
Filing Date:
September 12, 2023
Export Citation:
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Assignee:
C I TAKIRON CORP (JP)
International Classes:
H01L21/301; B32B7/022; B32B27/00; B32B27/32
Foreign References:
JP2015096580A2015-05-21
JP2012222002A2012-11-12
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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