Title:
BASE FILM FOR SEMICONDUCTOR MANUFACTURING TAPE
Document Type and Number:
WIPO Patent Application WO/2024/084863
Kind Code:
A1
Abstract:
A base material film (1) for a semiconductor manufacturing tape has at least a functional layer (2). The functional layer contains a 1-butene homopolymer, a pentene copolymer, and an olefin-based elastomer. The content of the pentene copolymer relative to the entirety of the functional layer is more than 0 mass% and less than 50 mass%, and the content of the olefin-based elastomer relative to the entirety of the functional layer is more than 0 mass% and less than 50 mass%.
Inventors:
ISHIMOTO TAKAYUKI (JP)
TSUMORI CHIAKI (JP)
OSHIMA HIROYUKI (JP)
TSUMORI CHIAKI (JP)
OSHIMA HIROYUKI (JP)
Application Number:
PCT/JP2023/033227
Publication Date:
April 25, 2024
Filing Date:
September 12, 2023
Export Citation:
Assignee:
C I TAKIRON CORP (JP)
International Classes:
H01L21/301; B32B27/32
Domestic Patent References:
| WO2022091714A1 | 2022-05-05 |
Foreign References:
| JP2009094127A | 2009-04-30 | |||
| JP2017036353A | 2017-02-16 | |||
| JPH07233354A | 1995-09-05 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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