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JP2014181882A |
To suppress the intrusion of an unnecessary component into a treatment space.In a heat treatment device 10, the circumference of a treatment tank 20 which performs heat treatment to an object 72 to be treated in an inert gas atmosphere, ...
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JP5596286B2 |
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JP5569999B2 |
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JP5567812B2 |
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JP5559105B2 |
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JP5559972B2 |
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JP5553127B2 |
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JP5550924B2 |
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JP5538740B2 |
A heat treatment device (10) comprises: a furnace (12), a circulation fan (22), a heat resistant filter (14), and a hot air distributing plate (16). The hot air distributing plate (16) is arranged between the heat resistant filter (14) a...
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JP5536360B2 |
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JP2014115021A |
To provide a capacitor chip vacuum sintering furnace which can accurately grasp an internal temperature of a tray.The capacitor chip vacuum sintering furnace comprises: a sintering chamber 1 having a sintering gate 10 at its bottom and p...
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JP5533597B2 |
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JP5532016B2 |
The disclosed heat-treatment furnace, used in a semiconductor-substrate heat-treatment step, is characterized by the provision of a cylindrical core, both ends of which have openings sized so as to allow insertion and removal of semicond...
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JP5517382B1 |
There is provided a method for heat treatment, a heat treatment apparatus, and a heat treatment system capable of performing highly precise and efficient control of heat treatment such as a bright treatment of materials to be treated wit...
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JP5509591B2 |
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JP2014098497A |
To provide a technique capable of uniting the security of heat transfer to material to be heated upon heat treatment and the security of fluidity of the material to be heated in a furnace, in a heat treatment device which performs the he...
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JP2014098538A |
To provide apparatus and methods for melting materials while controlling uniformity and temperature of the melt, and for containing the molten materials within a melt zone during melting without using a gate for physical blocking.An appa...
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JP5506187B2 |
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JP5496963B2 |
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JP5492540B2 |
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JP5491000B2 |
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JP2014081096A |
To provide a compact vacuum heating furnace capable of performing processing of vacuum drying of moisture content, a solvent and the like included in various samples (materials) by heating the various samples (materials) with low power c...
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JP2014074566A |
To provide a heat treat furnace of steel that utilizes metamorphic gas generated by combustion of a gas burner as in-furnace atmosphere gas without using inactive gas such as nitrogen gas or argon gas, and further does not adversely affe...
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JP5479951B2 |
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JP5477955B2 |
A heat treatment apparatus capable of achieving high-accuracy processing and high safety and a method of manufacturing a substrate are provided. The heat treatment apparatus 10 includes a reaction tube 42 for processing a substrate, a ma...
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JP3190016U |
To provide a drum can heating device having a small energy loss and being easily attached and detached. A tubular outer shell member 101, 111 having an opening / closing portion 18 for storing and detaching a standing drum can is in cont...
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JP5450331B2 |
Uniform short wave IR heating equipment for glasses and/or glass-ceramics, including an arrangement for indirect incidence of most of the IR radiation, is new. Equipment for uniformly heating (semi-)transparent glasses and/or glass-ceram...
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JP5452987B2 |
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JP2014048034A |
To effectively utilize a heating chamber by heating each processing object in a manner conforming to a processing temperature and procedure of the processing object, and shortening a waiting time period until heating to the processing ob...
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JP5436429B2 |
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JP5433664B2 |
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JP5429500B2 |
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JP5424896B2 |
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JP5412047B2 |
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JP5411268B2 |
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JP5411230B2 |
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JP2014024740A |
To provide: a ceramic sintered body that is excellent in corrosion resistance against an alkaline composition of compositions composing a positive electrode material of a lithium ion secondary battery and thermal shock resistance; a memb...
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JP5407153B2 |
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JP5393166B2 |
A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and ...
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JP5390094B2 |
Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer...
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JP5374061B2 |
To provide a batch-type firing furnace for electronic components for firing the electronic components which emits binder gas during firing, and its furnace pressure control method. A ceiling part 2 of a firing furnace body 1 is provided ...
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JP5374897B2 |
To provide a thermal treatment system capable of preventing temperature change of treated objects during storage in a conveyance furnace and obtaining high-quality treated objects and successfully used for thermal treatment of multiple t...
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JP2013545067A |
The subject innovation relates to a multi-deck chamber furnace for heating up workpieces comprising a furnace housing having at least two horizontal furnace chambers that are arranged vertically one above the other, whereby each furnace ...
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JP2013248597A |
To provide an excellent low-oxygen atmosphere apparatus in which an atmosphere of low oxygen concentration can be achieved even without raising the temperature in the apparatus to the predetermined temperature by a heating means.The low-...
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JP2013204917A |
To provide a heat treatment device capable of suitably preventing ignition of a flammable material extracted from a workpiece W even while adopting a compact and inexpensive configuration.A heat treatment device includes a treatment cham...
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JP2013201032A |
To provide a heating device which can perform heating by multiple heating means and which can achieve a compact structure.A heating device 10 comprises: an induction heating coil 16 provided opposite to a heating object loading region 28...
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JP5291354B2 |
To provide a novel gas nitriding furnace and gas soft nitriding furnace capable of preventing generation of solid matter caused by outflowing of treatment gas. The gas nitriding furnace 100 includes a standby chamber 30 for passage and s...
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JP5265475B2 |
To provide a one chamber type vacuum furnace securing cleanliness of the atmosphere in a heating chamber even in a sintering process after a degreasing process, improving durability of the heating chamber itself, and uniformly cooling a ...
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JP2013137131A |
To compactly design a height dimension of an in-field heat treatment device using a non-coolant-type superconductive magnet.A height dimension of an in-field heat treatment device using a non-coolant-type superconductive magnet is compac...
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JP2013138058A |
To provide an in-magnetic field heat treatment apparatus which inhibits quench from occurring immediately after a refrigeration machine stops and makes contamination of a clean room caused by a refrigerant gas unlikely to occur.A superco...
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