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WO/2022/138295A1 |
This multilayer body contains: a first metal layer that contains copper; and a second metal layer that contains nickel, while being directly superposed on the first metal layer. The full width at half maximum of the X-ray diffraction pea...
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WO/2022/138513A1 |
The purpose of the present invention is to provide a surface-treated copper foil (1) with which it is possible to reduce peeling from a substrate and to form a fine-pitched circuit pattern. This surface-treated copper foil (1) has a copp...
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WO/2022/129238A1 |
The present invention provides an aqueous composition comprising tin ions, optionally alloy metal ions selected from silver, indium, and bismuth ions and at least one additive of formula L1a(L1a) or of formula L1b L1b wherein RL1 is, for...
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WO/2022/126432A1 |
A metal material and a fabrication method therefor. The present fabrication method uses a pulse current for the electrodeposition of metal ions in nano holes of a hole template so as to improve the electrochemical activity of an obtained...
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WO/2022/131386A1 |
The present invention relates to a solution for electroplating iron, comprising: iron ions comprising first iron ions and second iron ions; a complexing agent; and unavoidable impurities, wherein the amount of second iron ions among the ...
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WO/2022/128608A1 |
Disclosed is a method for depositing a bronze alloy on a printed circuit (5). Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, af...
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WO/2022/129916A1 |
The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of ...
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WO/2022/129230A1 |
The invention relates to a method for joining nanolaminates by means of electrodeposition, the nanolaminate being constructed of at least two layers containing different metals or metal alloys and having a joining point in which multiple...
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WO/2022/130897A1 |
Provided are: a method that is for forming a metal body and that is capable of quickly forming a metal body in which the occurrence of whiskers due to external stress is inhibited; a metal body; and a mating-connection terminal comprisin...
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WO/2022/123681A1 |
The present invention achieves a substrate holder with high substrate holding reliability. According to the present invention, a plating module includes a plating tank for containing a plating solution, a substrate holder 440 for holdi...
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WO/2022/124825A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for manufacturing same, and methods for manufacturing the steel sheets. The steel sheet for plati...
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WO/2022/123648A1 |
Provided is technology that is capable of suppressing a degradation in wafer plating quality due to process gas retained on the bottom surface of a diaphragm. A plating apparatus 1000 comprises: a plating bath 10 in which an anode 11 i...
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WO/2022/125831A1 |
A method and an electrocatalytic electrode for electrochemically reducing carbon dioxide to methanol are provided. An exemplary electrocatalytic electrode includes copper (I) oxide crystals electrodeposited over an atomically smooth copp...
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WO/2022/118431A1 |
Provided is a plating apparatus that is capable of shielding specified portions of a wafer at a prescribed timing. The plating apparatus comprises: a plating bath 410 for accommodating a plating solution; an anode 430 disposed in the p...
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WO/2022/116509A1 |
Disclosed are a device and method for preventing a conductive roller from being plated with copper, belonging to the technical field of the manufacturing of electroplated copper films. The conductive roller and an electroplating anode ar...
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WO/2022/116454A1 |
Provided in the present application is a method for reducing the discharge of a gantry line tank liquid in circuit board electroplating, comprising the steps: placing a circuit board into a medicine liquid tank to perform an immersion el...
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WO/2022/113806A1 |
The present invention provides a roughened copper foil which has excellent adhesion to a resin, and is capable of producing a printed wiring board that has little transmission loss, while being not susceptible to the occurrence of a shor...
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WO/2022/110845A1 |
Embodiments of the present application provide an electroplating method and an electroplating device. The electroplating method comprises: before a wafer is placed in an electroplating solution to perform an electroplating process on sam...
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WO/2022/111210A1 |
The present invention discloses a plating apparatus. The plating apparatus comprises a multiple electrodes. The multiple electrodes include a main electrode and at least two second electrodes. The main electrode and the at least two seco...
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WO/2022/107551A1 |
Provided in a jet-type plating device is a plating process that sufficiently achieves the benefits of an insoluble anode. The present invention is a plating device comprising a plating tank that has an opening, a liquid feed tube, an ins...
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WO/2022/108841A1 |
Exemplary methods of electroplating may include forming a first mask layer on a semiconductor substrate. The methods may include forming a seed layer overlying the first mask layer. The methods may include forming a second mask layer ove...
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WO/2022/102119A1 |
The present invention improves, in each part of a plate, the accuracy of porosity and/or the degree of freedom in adjusting porosity. This plate is disposed between a substrate and an anode in a plating tank, the plate comprising a hol...
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WO/2022/101474A1 |
The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper a...
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WO/2022/096800A1 |
The main conductive member (38) disclosed is intended to be incorporated in an electric machine and comprises a first active portion (32), intended to be received in an internal space delimited by a yoke of the electric machine, and a pa...
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WO/2022/089232A1 |
Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper el...
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WO/2022/082933A1 |
A production method for an ultrathin high-strength electronic copper foil, comprising the following steps: preparing an electrolyte, adding a mixed additive, manufacturing an isolation layer by using a copper foil having the thickness of...
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WO/2022/086891A1 |
Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty c...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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WO/2022/080191A1 |
This tin or tin alloy plating solution at least contains (A) a first tin compound, (B) an acid or salt thereof selected from an organic acid and an inorganic acid, and (C) a surfactant. The plating solution contains polypropylene glycol ...
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WO/2022/081080A1 |
A wire comprising a silver-based wire core having a double-layer coating comprised of a 1 to 100 nm thick inner layer of palladium or nickel and an adjacent 1 to 250 nm thick outer layer of gold, wherein the wire exhibits at least one of...
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WO/2022/074221A1 |
The invention relates to a process for fabricating a 3D–NAND flash memory comprising a first step of electrodepositing an alloy of copper and of a dopant metal selected from manganese and zinc followed by a second step of annealing the...
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WO/2022/072390A1 |
A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during...
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WO/2022/069829A1 |
An aspect of the invention relates to a method for manufacturing a conductor of a winding of a coil, comprising: a step (E1, E1') of manufacturing a heat-sink preform comprising a phase-change material, a step (E2, E2', E2") of depositin...
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WO/2022/061948A1 |
The present invention relates to an insoluble anode methyl sulfonic acid coating low-lead content tin plate production method. The method comprises the following steps: step 1: an alkaline washing process section, first performing electr...
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WO/2022/057335A1 |
Provided are a device and a method for air leakage detection and a wafer electroplating method. Before performing a wafer electroplating process, an airtightness state of a reaction chamber in a wafer electroplating equipment is pre-test...
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WO/2022/057703A1 |
A diamond drill bit production electroplating device, comprising a bottom plate, an outer barrel being provided on the bottom plate, and an electroplating barrel being provided within the outer barrel; a circular first rotary disc which ...
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WO/2022/054953A1 |
The present invention provides: a plated material which has low insertion force (low friction) and durability at high temperatures; and an electronic component. A plated material which is provided with: a base plating layer that is compo...
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WO/2022/054873A1 |
The present invention discloses a method for producing a wiring board, said method comprising: a step wherein the surface of a metal layer that is exposed in an opening is pretreated by being brought into contact with a pretreatment liqu...
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WO/2022/050001A1 |
The purpose of the present invention is to provide a copper foil, with which a wiring board capable of exhibiting both RF characteristics and a high peeling strength can be fabricated using a resin base material made of LCP. The copper f...
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WO/2022/041533A1 |
Disclosed in the present invention is a production method for a high heat-resistant electrodeposited copper foil, comprising the following steps: raw foil manufacturing, pickling and water washing, primary coarsening and water washing, s...
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WO/2022/044451A1 |
Provided is a shock absorber, and a manufacturing method thereof, in which trivalent chromium is used and in which both a high degree of hardness and low friction are achieved at a high level without utilizing hexavalent chromium that ca...
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WO/2022/039060A1 |
Provided is a plating device for producing a highly precise plating layer. This plating device (10) is provided with a plating vessel (9), cathodes (1a to 1f), a holding mechanism (2), an anode (3), and a rotation mechanism (4). In the p...
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WO/2022/033990A1 |
The invention comprises a process for the galvanic nickel plating of a fin wall (FW), which has at least one wall part (FW') which is formed from a number of tubes R1, R2, …, R5) running alongside one another in a longitudinal directio...
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WO/2022/030644A1 |
[Problem] To provide: a copper-clad layered body which, when applied to a flexible circuit board, is capable of suppressing transmission loss and achieving good volume resistivity and high adhesion between a low-dielectric resin film and...
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WO/2022/028072A1 |
Provided is a housing structure, a preparation method therefor, and an electronic device. The housing structure comprises an appearance effect layer, a metal layer, a connecting layer and a non-metal layer, which are arranged in a lamina...
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WO/2022/032048A1 |
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer...
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WO/2022/030645A1 |
[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible...
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WO/2022/018896A1 |
This terminal material for connectors comprises: a substrate having at least a surface made of copper or a copper alloy; and a silver-nickel-potassium alloy plating layer formed on at least a portion of the substrate, wherein the silver-...
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WO/2022/019059A1 |
[Problem] To provide a sliding member comprising an overlay capable of realizing good fatigue resistance while preventing peeling between layers. [Solution] A sliding member comprising an overlay formed by a Bi-Sb alloy plating film, whe...
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WO/2021/245766A9 |
The present invention provides technology for improving the filling properties of micropores in intermittent electroplating. This intermittent electroplating method is for performing intermittent electroplating of a plated object havin...
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