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WO/2022/002606A1 |
The invention relates to a bi-functionalized polysiloxane brush copolymer comprising at least one hydroxyl-terminated polyalkyleneglycol side chain and at least one onium-functionalized side chain as defined herein, and a method for prep...
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WO/2022/005244A1 |
The present application provides an adhesive and a liquid crystal cell comprising same, wherein the adhesive is advantageous in implementation as a flexible device due to a cell gap being properly maintained and excellent adhesion betwee...
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WO/2022/005890A1 |
A functional laminated glass article includes: a backer substrate; a flexible glass substrate comprising a thickness of no greater than 300 μm, and laminated to the backer substrate with an adhesive; a plurality of conductive traces dis...
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WO/2022/006486A1 |
Two-part silane modified polymer/free radically curable adhesive systems demonstrating improved strength and percent elongation are provided.
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WO/2021/262830A1 |
There is provided curable silicone elastomer compositions having enhanced adhesive properties with respect to a wide variety of substrates. The curable silicone elastomer compositions described herein are provided with a phenylmethylpoly...
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WO/2021/262497A1 |
A curable silicone rubber composition of the type referred to in industry as "self-adhesive" or as having "selective adhesion" (hereafter referred to as "curable self-adhesive silicone rubber compositions"). The curable self-adhesive sil...
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WO/2021/262828A1 |
This disclosure describes inflatable articles such as airbags for inflatable safety devices for a vehicle passenger-protecting system, a process for manufacturing said inflatable articles, hydrosilylation curable silicone elastomer compo...
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WO/2021/256386A1 |
Provided is a laminate characterized by comprising a semiconductor substrate, a support substrate that transmits ultraviolet rays, and an adhesive layer and a release layer that are provided between the semiconductor substrate and the su...
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WO/2021/257762A1 |
A patient monitoring sensor having a communication interface, through which the patient monitoring sensor can communicate with a monitor is provided. The patient monitoring sensor includes a light-emitting diode (LED) communicatively cou...
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WO/2021/251533A1 |
The present invention relates to a highly heat-dissipating composition using a mixture filler and a preparation method therefor, wherein the heat-dissipating composition comprises: a filler containing two or more of expanded graphite, ca...
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WO/2021/251018A1 |
The present invention is a temporarily bonding method for bonding, to a support body via a temporary bonding layer, a wafer comprising a first principal surface including a circuit and a second principal surface that is to be processed a...
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WO/2021/247210A1 |
An epoxy-curable silicone release coating composition and methods for its preparation and use are provided. The composition contains an inhibited Lewis acid catalyst. Releasing the Lewis acid catalyst from the inhibitor allows the Lewis ...
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WO/2021/246680A1 |
The present invention relates to an adhesive tape for a semiconductor package manufacturing process, which is attached to a lower surface of a semiconductor package having a plurality of protruding electrodes formed thereon, the adhesive...
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WO/2021/237499A1 |
A method for preparing a curable silicone pressure sensitive adhesive emulsion includes preparing a dispersion of benzoyl peroxide and a phenoxy-functional alcohol and thereafter combining the dispersion with the other starting materials...
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WO/2021/236229A1 |
A UV curable silicone adhesive composition and method for its preparation are provided. The UV curable silicone adhesive composition is useful in electronic device fabrication for adhering components such as fingerprint sensors to substr...
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WO/2021/229944A1 |
The present invention is a photocurable silicone composition characterized by containing: (A) an organopolysiloxane that has in the molecule thereof at least one specific structure including a (meth)acryl group; (B) an organohydrogenpoly...
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WO/2021/225673A1 |
A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acrylox...
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WO/2021/225675A1 |
A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acrylox...
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WO/2021/225163A1 |
An objective of the present invention is to provide an adhesive composition that enables an adherend to be easily removed even after having spent an extended length of time at 250°C or higher, or having undergone a high-temperature mach...
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WO/2021/220929A1 |
The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin compositio...
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WO/2021/216220A1 |
A polydiorganosiloxane having a silicon bonded poly(meth)acrylate polymer or copolymer is useful in a polyorganosiloxane hybrid pressure sensitive adhesive composition that cures to form a polyorganosiloxane hybrid pressure sensitive adh...
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WO/2021/215081A1 |
The present invention is a silicone composite stain-resistant sheet characterized by comprising a base material layer, and layered on one surface of the base material layer, a silicone adhesive layer having a hardness of 5 or less as mea...
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WO/2021/213114A1 |
An anti-fingerprint TPU protective film for a 3D curved screen, the film comprising a low-adhesion protective film, an anti-fingerprint UV hardening coating formed by coating an anti-fingerprint UV hardening coating, an optical hard TPU ...
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WO/2021/213662A1 |
The invention relates to transparent silicone compositions comprising as special UV blocker and its use in optical bonding outdoor applications.
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WO/2021/210587A1 |
A polyfunctional compound represented by formula (1). (In the formula, X represents a carbon atom or a C1-20 n-valent linking group, Ar represents an arylene group, R1 each independently represent a divalent group including a polymer blo...
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WO/2021/210273A1 |
The present invention relates to a self-adhesive millable silicone rubber composition containing: (A) 100 parts by mass of organopolysiloxane which has, in one molecule, at least two alkenyl groups bonded to silicon atoms, and has an ave...
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WO/2021/200643A1 |
[Problem] To provide a hot-melt curable silicone composition that is curable at a low temperature of 100 °C or lower and is excellent in storage stability and that forms, through curing, a relatively hard cured product having less surfa...
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WO/2021/199355A1 |
Disclosed are: a resin composition that comprises an alkenyl group-containing silicone raw rubber, an MQ resin, a crosslinking agent, a platinum catalyst and an organic peroxide, that has a gel fraction of 45-60% after crosslinking, and ...
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WO/2021/200089A1 |
This ultraviolet-curable silicone adhesive composition comprises: (A) an organopolysiloxane having two specific (meth)acryloyloxy-containing groups in one molecule; (B) an organopolysiloxane resin having a specific (meth)acryloyloxy-cont...
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WO/2021/199710A1 |
Provided is a foam composite in which the rate of dimensional change upon exposure to high temperature is very low. This foam composite includes a foam layer and a silicone-based adhesive layer formed from a silicone-based adhesive, wh...
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WO/2021/187328A1 |
The protective cover member provided by the present invention is arranged on a surface of an object that has an opening, the surface being provided to the object, wherein the member is configured from a laminate including a protective fi...
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WO/2021/168954A1 |
Provided are an encapsulation fluorescent glue layer and a manufacturing method therefor, and a quantum dot backlight source. The quantum dot backlight source comprises a substrate, a light-emitting chip and an encapsulation fluorescent ...
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WO/2021/171734A1 |
This pressure-sensitive silicone adhesive composition comprises (A) an organopolysiloxane having two or more alkenyl-group-containing organic groups in the molecule and containing alkenyl groups in an amount of 0.0002-0.05 mol per 100 g ...
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WO/2021/172066A1 |
A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chai...
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WO/2021/168056A1 |
A photocurable silicone composition, a method of forming a coating from such compositions, and an article comprising a coating formed from such compositions and/or methods are shown and described herein. The photocurable silicone composi...
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WO/2021/166905A1 |
A multilayer object comprising a first base, which comprises a semiconductor substrate, a second base, which comprises a light-transmitting supporting substrate, and an adhesive layer and a release layer which are disposed between the fi...
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WO/2021/157191A1 |
An addition-curing silicone pressure-sensitive adhesive composition which contains no noncrosslinking organpolysiloxane resin and comprises 100 parts by mass of (A) an organopolysiloxane having, in the molecule, at least two alkenyl grou...
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WO/2021/158745A1 |
A curable silicone adhesive having improved elongation-at-break and adhesive properties to various substrates, in particular synthetic textiles used in the manufacture of air bags, to be used, for example, as a joint sealer. These silico...
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WO/2021/156055A1 |
The invention relates to a two-component silicone composition, consisting of a component A that comprises at least one hydroxyl-group terminated polydiorganosiloxane P; between 0.05 and 5.0 wt.% water, relative to component A; and a comp...
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WO/2021/154961A1 |
The present invention relates to an article useful for circular economy which comprises of a substrate S in contact with a cured silicone elastomer Z which is peelable with clean-releasing properties and which can be easily removed by hu...
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WO/2021/150364A1 |
A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO1/2], [(OZ)qSiO(4-q)/2] and at least one of [(OZ)t REPSiO(3-t)/2] and [(OZ)d RREPSiO(2-d)/2]; where: each R i...
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WO/2021/149431A1 |
This thermally conductive silicone adhesive composition comprises: (A) an organopolysiloxane which has an alkenyl group and does not have an organoxysilyl group; (B) an organopolysiloxane blocked with trialkoxysilyl groups at both termin...
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WO/2021/142752A1 |
Disclosed in the present invention is an organic silicon resin conductive adhesive, comprising, on the basis of a total of 100 parts by weight, the following components in parts by weight: 40-84 parts of conductive particles, 10-25 parts...
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WO/2021/145382A1 |
This pressure-sensitive adhesive tape comprises a substrate and a pressure-sensitive adhesive layer disposed on one surface of the substrate. This pressure-sensitive adhesive tape satisfies the relationship Y≤4.5X-22.5, where X (unit: ...
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WO/2021/142653A1 |
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The prot...
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WO/2021/143311A1 |
Provided are a dual-layer polysiloxane supramolecular elastomer dressing based on an ionic hydrogen bond, and a method for preparation thereof. The method comprises: reacting amino silicone oil with maleic anhydride to obtain carboxyl si...
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WO/2021/140751A1 |
A structure (1) has an aluminum substrate (111), and an adhesive layer (12) comprising an adhesive resin adhering to the surface of the aluminum substrate (111). The adhesive layer (12) comprises: a hard layer (121) contacting the adhesi...
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WO/2021/135380A1 |
Provided are a graphene hydrogel and a method for preparation thereof, the starting material formulation of said graphene hydrogel including the following components in parts by weight: 10-50 parts of vinyl-terminated polydimethylsiloxan...
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WO/2021/135377A1 |
A graphene UV pressure-sensitive adhesive and a preparation method therefor. The graphene UV pressure-sensitive adhesive has a formula comprising the following raw materials: aromatic carbamate acrylate, aliphatic carbamate acrylate, pol...
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WO/2021/138151A1 |
A pressure sensitive adhesive (PSA) composition comprises (A) a silicate resin that is a liquid at 25 °C in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated...
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