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WO/2022/148103A1 |
Disclosed is a prepolymer, and the preparation raw materials thereof comprise: (A) a compound with the structure as shown in formula (1), wherein R1, R2 and R3 in formula (1) are each independently selected from vinyl or epoxy groups; (B...
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WO/2022/140877A1 |
Disclosed are an addition-type silicone rubber having high adhesive strength and a preparation method therefor. On the basis of parts by weight, the addition-type silicone rubber is prepared from raw materials comprising the following co...
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WO/2022/145643A1 |
The present invention relates to silicone adhesive coating composition, and an adhesive film comprising same. The adhesive film is used in OLED manufacturing, does not experience changes in physical properties during processing, and exhi...
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WO/2022/142648A1 |
The present invention relates to an organic silicon prepolymer, an organic silicon modified epoxy resin, an adhesive, and a colloid and a preparation method therefor. The organic silicon modified epoxy resin is mainly prepared from the f...
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WO/2022/138341A1 |
[Problem] To provide: an integrated dicing die bonding sheet which has excellent storage stability and stress mitigating properties, which does not exhibit problems such as cracking, chipping, or chip fly-off during dicing, and which has...
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WO/2022/138345A1 |
[Problem] To provide: a composition that, even when the contained amount of a solvent is low, has viscosity allowing the composition to be applicable, that has excellent curability, and that provides a Si-based pressure-sensitive adhesiv...
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WO/2022/138627A1 |
Provided are: a curable polyorganosiloxane composition that contains (a) a polyorganosiloxane having, per molecule, 2 or more curable functional groups able to bring about an addition reaction, (b) a crosslinking agent having, per molecu...
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WO/2022/138348A1 |
[Problem] To provide a curable silicone composition for use in a release agent with which it is possible to form a release film that has low peel force from a silicone adhesive agent, particularly a silicone adhesive agent having a low s...
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WO/2022/138349A1 |
[Problem] To provide a curable silicone composition for a release agent that can form a release film in which, even when the film is thin, the release force is small from a silicone adhesive, particularly from a silicone adhesive having ...
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WO/2022/138336A1 |
[Problem] To provide a hot-melt curable silicone composition and applications therefor, said hot-melt curable silicone composition having excellent hot dispensing properties and storage stability, and being curable with an external energ...
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WO/2022/134197A1 |
The present invention relates to the technical field of display materials, and provides a screen protection film and a manufacturing method therefor. A base material layer of the screen protection film is a polyester film having retardat...
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WO/2022/138913A1 |
A pressure sensitive adhesive layer-forming organopolysiloxane composition according to the present invention is characterized by being curable by means of a hydrosilylation reaction, while being also characterized in that: 1% by mass or...
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WO/2022/133783A1 |
The composition includes a vinyl-substituted polysiloxane having at least two vinyl groups, a hydrosilylation catalyst, a hydrosilyl-substituted polysiloxane having at least two silicon-hydride groups, and a phosphorous-containing flame ...
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WO/2022/133794A1 |
A silicone composition comprising (A) an electrically conductive filler, (B) a polydiorganosiloxane polymer, (C) a polyorganohydrogensiloxane, (D) a hydrosilylation reaction catalyst, (E) a polymer additive, and optionally (F) a hydrosil...
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WO/2022/127252A1 |
Disclosed are a new protective film, a batch preparation method therefor and the use thereof in a fuel cell. The protective film sequentially comprises a release protective film, a low-viscosity silica gel layer, a high-viscosity silica ...
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WO/2022/131306A1 |
The purpose of the present invention is to provide a double-sided adhesive sheet for transfer, said double-sided adhesive sheet being not susceptible to a positional shift of an electronic component even if irradiated with ultraviolet li...
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WO/2022/129299A1 |
The invention relates to a curable composition comprising (i) humidity-curable prepolymer such as a humidity-curable polyurethane, silicone or polysulfone prepolymer; (ii) thermally conductive nano- filler selected from graphene, graphen...
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WO/2022/131305A1 |
The purpose of the present invention is to provide a double-sided adhesive sheet for transfer, said double-sided adhesive sheet being suitable for efficiently mounting a fine electronic component such as a semiconductor chip onto a mount...
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WO/2022/124060A1 |
The present invention is a silicone composite stain-resistant sheet comprising a base material layer and a silicone adhesive layer laminated on one surface of the base material layer, the silicone composite stain-resistant sheet being ch...
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WO/2022/119613A1 |
A silicone pressure sensitive adhesive composition contains an alkenyl-functional polydiorganosiloxane gum, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a migration reducing additive, a hydrosilylation reaction c...
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WO/2022/113437A1 |
The present invention provides: a room temperature curable organopolysiloxane composition which has curability equivalent to the curability of conventional dealcoholization type or deoximation type room temperature curable organopolysilo...
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WO/2022/108896A1 |
Two-part condensation curable silicone compositions and their applications which because of the incorporation of a new titanium-based reaction product as a catalyst is able to provide compositions having both improved stability in the pr...
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WO/2022/105646A1 |
The present disclosure relates to the technical field of photovoltaic potting. Disclosed are a potting adhesive and a preparation method therefor, for obtaining a low-cost potting adhesive having a high heat conductivity coefficient. The...
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WO/2022/098844A1 |
Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not li...
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WO/2022/090462A1 |
The invention relates to a reactive single-component adhesive composition which is liquid at room temperature and which has 3 wt.% to 90 wt.% of at least one alpha-silane-terminated organic polymer, 0 wt.% to 80 wt.% of at least one sili...
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WO/2022/075245A1 |
This perfluoropolyether-based adhesive composition contains: (A) a linear perfluoropolyether compound containing two or more alkenyl groups in one molecule and having a number average molecular weight of 2,000 or more and a mass reductio...
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WO/2022/076131A1 |
The present disclosure relates generally to radiation curable liquid optically clear adhesive compositions having dark cure and/or shadow cure ability. The adhesive compositions include hydrosilation catalyst selected from the group cons...
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WO/2022/066261A1 |
A curable silicone - (meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone - (meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone - (meth)acrylate press...
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WO/2022/057083A1 |
A high-thermal-conductivity self-leveling modified ceramic liquid potting material and a preparation method therefor. The potting material consists of a component A and a component B. The component A consists of the following components ...
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WO/2022/056948A1 |
A low dielectric constant OCA optical material and a preparation method. The material comprises a first release film layer, a first organic silicon material layer, a low-K thin film, a second organic silicon material layer, and a second ...
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WO/2022/052035A1 |
A hot-melt optical clear adhesive (OCA) film and a preparation method. The hot-melt OCA film is an optical grade material using a hot-melt resin and a silicone resin as a main body, wherein the hot-melt resin comprises a thermosetting re...
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WO/2022/048728A1 |
The invention relates to cross-linkable substances containing: (A) 100 parts by weight of compounds of formula Y - [ (CR12) b- SiRa (OR2) 3-a ] x (I); (B) 5 to 2000 parts by weight of silicone resins containing units of formula R3 C (R4O...
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WO/2022/051203A1 |
A composition contains a cluster organopolysiloxane having structure (I) where X = (aa) and R is independently in each occurrence selected from a group consisting of aryl groups and alkyl groups having from 2 to 6 carbons; R' and R" are ...
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WO/2022/051204A1 |
A composition contains an organopolysiloxane having the following average chemical structure: X3SiO-SiR2-R'-(R2SiO)x-R2Si-[Rb-(R2SiO)y-R2Si-Rb'-(R2SiO)z-R
2Si]m-R'-R2SiO-SiX3; where X is -OSiR2-R'-R2SiO-R2Si-R"-A; R is an alkyl group hav...
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WO/2022/051205A1 |
A curable organopolysiloxane composition contains: (A) 100 mass parts of a functional organopolysiloxane component having at least one radical curable group selected from an acrylate group and a methacrylate group and optionally one or m...
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WO/2022/044967A1 |
Provided is a polyorgano silsesquioxane with which a cured product having a high surface hardness and flexibility while also having a high heat resistance or the like can be formed, and which is suitable as a material for a hard coat fil...
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WO/2022/043285A1 |
The present invention concerns a siloxane compound, a method for its synthesis, its use as a component in an adhesive formulation and a kit-of-parts for said purpose.
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WO/2022/041180A1 |
A process for end-capping a dimethylsilanol terminated polydiorganosiloxane with one or more di, tri and/or tetra alkoxysilanes in the presence of a basic end-capping catalyst starting material; and subsequently adding an acidic stabiliz...
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WO/2022/044968A1 |
Provided is a polyorganosilsesquioxane with which it is possible to form a hard coating layer that is a cured article having a high surface curing degree and high bending resistance while having high heat resistance and which is suitable...
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WO/2022/044969A1 |
Provided is a polyorganosilsesquioxane which can give cured objects having the high heat resistance characteristic of polyorganosilsesquioxanes and having high surface hardness and flexing characteristics and which is suitable as a mater...
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WO/2022/039297A1 |
Disclosed are an organic-inorganic adhesive composition and a gas barrier film comprising same. The organic-inorganic adhesive composition comprises: a silane compound having at least one vinyl group, an acryloxy group, a methacryloxy gr...
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WO/2022/034141A1 |
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 5-methyl-3-heptanone oxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to si...
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WO/2022/036026A1 |
The present invention generally relates to methods for curing and/or manufacturing silicone-coated release liners used e.g., in the production of pressure sensitive, peel-and-stick labels. In particular, the present invention is directed...
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WO/2022/034137A1 |
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone for...
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WO/2022/034138A1 |
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime or 5-methyl-3-heptanone oxime which exhibits significantly improved early cracking behaviour and/or skin formation...
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WO/2022/030470A1 |
Provided is a room temperature curable resin composition containing a hydrolyzable organosilane compound as a chain length extender, which is quickly rubberized and develops moderate elongation due to the effect of extending chain length...
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WO/2022/024734A1 |
Provided is a composition which contains a highly industrially versatile alkenyl group-containing organopolysiloxane and an organopolysiloxane having a hydrolysable silyl group at both ends of the molecular chain as base polymers, in com...
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WO/2022/014626A1 |
The present invention provides a conductive adhesive composition which is able to achieve a good bonding strength, while achieving a good thickness between adherends in cases where the blending amount of a conductive powder is relatively...
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WO/2022/009759A1 |
A two-component type room temperature fast-curing organopolysiloxane composition which is a room temperature curing organopolysiloxane composition of a two-component and dealcohol type and which comprises, as curing agents, a first agent...
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WO/2022/009965A1 |
An adhesive provided herein is a silicone-based adhesive having an initial adhesive strength of 0.2-3 N/20 mm, and an adhesive strength of at most 4 N/20 mm after heating at 260ºC for 30 minutes. An adhesive tape provided herein compris...
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