| Document |
Document Title |
|
JP2016210880A |
To provide a hot-melt adhesive sheet that can easily and assuredly form a coating structure excellent in adhesion when coating a plurality of electric wires by using a heat shrinkable tube.A hot-melt adhesive sheet according to one embod...
|
|
JP6030061B2 |
|
|
JP2016536431A |
[Subject] The constituent which can be used as a plasticizer which does not contain phthalate for prescription of the material used for a construction material and automobile sections, such as mastic, plastisol, or adhesives of a certain...
|
|
JP2016188275A |
To provide a hot-melt adhesive composition having sufficient adhesive force to a substrate such as an IC card substrate, and capable of maintaining adhesive strength even in a high temperature environment or in a wet heat environment; an...
|
|
JP2016528311A |
The present invention relates to the use of an organic filler as an additive for a coating or sealing composition, wherein at least 20% by weight of the organic filler is composed of an organic polymer and the organic filler comprises. I...
|
|
JP2016157781A |
To provide a conductive adhesive sheet which imparts electromagnetic wave shield effect reliably to a printed wiring board, while achieving excellent storage stability, tack-free, low resin flow, and flexibility simultaneously.A conducti...
|
|
JP2016125042A |
To provide an adhesive composition having excellent B stage stability and C stage curability, a light control panel comprising the same, a method for producing the same, and an optical imaging device.An adhesive composition comprises pol...
|
|
JP5947134B2 |
To provide an adhesive composition and a film shape adhesive agent that can combine adhesiveness, and an indispensable property for an adhesive agent for a flexible printed wiring board of flow and heat resistance, adhesive force or the ...
|
|
JP5929419B2 |
To provide an adhesive composition which has adhesive force required when it is pasted on an adhered material, even in a high temperature environment of about 200°C, and decreases its adhesive force when it is heated at a prescribed tem...
|
|
JP5928556B2 |
This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this co...
|
|
JP5916634B2 |
Two-component epoxy resin composition comprises: an epoxy resin component (K1) comprising at least one epoxy resin (A) with an average of more than one epoxide group per molecule; and a curing component (K2) comprising an amino group ter...
|
|
JP5909779B2 |
|
|
JP2016511782A |
Polyamide in which the present invention has a 5000g/mol * 100000g/mol molecular weight, It is a hot melt constituent containing the block co-polymer which comprises at least two blocks as a reaction product with the denaturation Ole Fin...
|
|
JP2016510270A |
The present invention relates to a hybrid structural member comprising at least one fiber composite material as material B and at least one material A. The material A is selected from off-the-shelf products made from plastics, metals, ce...
|
|
JP5891644B2 |
|
|
JP5892996B2 |
Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bond...
|
|
JP5886134B2 |
The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relat...
|
|
JP5880546B2 |
The purpose of the present invention is to provide a reinforcing material equipped with a cohesive/adhesive layer, which has a proper initial adhesion force to an adherend, such as an electrolyte membrane, a catalyst layer and a gas diff...
|
|
JP5882319B2 |
The invention relates to a hotmelt adhesive including a hotmelt adhesive mixture, the mixture having a 15-85% by weight of a first polyester-based hotmelt adhesive and a 15-85% by weight of a second, polyamide-based hotmelt adhesive.
|
|
JP5867508B2 |
|
|
JP5854504B2 |
The invention concerns a process for preparing a ribbon of reinforcement strands or filaments associated on each of its faces with a polymeric binder, said ribbon having a given width substantially constant over its entire length, in whi...
|
|
JP5846290B2 |
This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure...
|
|
JP5838674B2 |
A film-like anisotropic conductive adhesive, which has connection reliability and repairability, and does not lose adhesive strength even if the heating temperature is reduced during bonding, is provided. Said adhesive contains (A) a phe...
|
|
JP2015232108A |
To provide an adhesive resin composition capable of being used as an adhesive good in adaptability to a fiber reinforced thermoplastic (FRTP) and capable of exhibiting sufficient adhesive strength to other adherend, an adhesive tape form...
|
|
JP5835231B2 |
A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between ...
|
|
JP5831027B2 |
|
|
JP5825503B2 |
|
|
JP2015533862A |
It has at least two epoxy groups per molecule and has a number average molecular weight (M) of 150-5000 g / mol.NComponent A containing epoxide with), containing a primary amine group, with a number average molecular weight (M) of less t...
|
|
JP2015199793A |
To provide a pressure-sensitive adhesive having excellent heat resistance and releasability even when exposed to a high temperature environment.The pressure-sensitive adhesive comprises a condensation resin having a polyoxyalkanediyl gro...
|
|
JP2015193683A |
To provide a thermosetting adhesive composition having superior temporary sticking property, and a thermosetting adhesive sheet.(Meta) acrylic polymer (A) whose glass transformation temperature is 5°C or higher, liquid epoxy resin (B), ...
|
|
JP2015529696A |
The present invention is the use of thermoplastic starch in the production of adhesive ultrathin waterproof breathable films, wherein the thermoplastic starch is hydrophilic TPE and is at least 10% by weight based on the weight of the TP...
|
|
JP5776621B2 |
|
|
JP5773992B2 |
A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in ve...
|
|
JP5770734B2 |
Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an a...
|
|
JP5764497B2 |
|
|
JP2015136811A |
To provide: a laminate member in which a concrete, and a various member such as concrete, polyester-based member, vinyl chloride-based member, epoxy-based member, woody member, gypsum board and glass, are firmly bonded, and that can be e...
|
|
JP5751284B2 |
An adhesive sheet comprising a base 3 and an adhesive resin layer 4 formed on one side of the base 3, wherein the adhesive resin layer 4 has a glass transition temperature of 170-200° C. and a post-curing elastic modulus of 100-500 MPa.
|
|
JP5742933B2 |
|
|
JP5738274B2 |
Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy...
|
|
JP5737512B2 |
|
|
JP5732047B2 |
|
|
JP2015514826A |
Molecular weight of 10,000-250,000 g / mol (MW) At least one polyamide 20-90% by weight; at least one organic or inorganic salt 1-25% by weight; a melt adhesive containing an additional 0-60% by weight, said adhesive being 100 ° C. A me...
|
|
JP2015514149A |
The present invention relates to epoxy adhesives. Epoxy-based adhesives having a low modulus of elasticity and a high vitrification temperature at the same time are provided. Such adhesives are useful in the manufacture of large machines...
|
|
JP5711713B2 |
Provided is a thermally restorable article which has a good filling property when thermally shrunk to improve adhesiveness with a base to be treated, and in which the variation in the thickness of an adhesive layer during extrusion moldi...
|
|
JP2015074706A |
To provide an adhesive resin composition and an adhesive material which are excellent in adhesiveness to a glass plate or adhesiveness.There is provided an adhesive resin composition which comprises: a condensation resin having a structu...
|
|
JP5688323B2 |
To provide: a solar cell back sheet adhesive that causes less deterioration of adhesive force even under high moisture by capturing carboxylic acid generated by hydrolysis of resin constituting the adhesive, and by suppressing a decrease...
|
|
JP5675975B2 |
Provided is an adhesive composition which is free from halogens and has improved adhesiveness and improved long-term reliability compared with the conventional adhesive compositions. The adhesive composition comprises, per 100 parts by w...
|
|
JP2015034249A |
To provide an adhesive composition for an electronic component forming an adhesive layer excellent in adhesive durability at high temperature and insulation durability at high temperature under high moisture and having reduced warpage.Pr...
|
|
JP2015034986A |
To provide a film-like positive type photosensitive adhesive composition that can exhibit adequate flowability in the connection of semiconductor chips with each other or the connection of a semiconductor chip with a supporting member fo...
|
|
JP5664525B2 |
The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a...
|
