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JP7147039B2 |
A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first o...
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JP2022134144A |
To provide a laminate that contains a transparent base material and has excellent transparency and also excellent impact resistance.Provided is a laminate in which, characterized, a transparent substrate, an adhesive layer and a semi-aro...
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JP7134291B2 |
A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups s...
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JP7125307B2 |
Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin moldi...
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JP2022117777A |
To provide a laminate in which an adhesion layer is formed on a base film, where the adhesion layer of the laminate is capable of being adhered to an adherend at low temperature, has excellent adhesiveness with various types of adherend,...
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JP7113049B2 |
An adhesive film can include a barrier layer and an adhesive layer. In an embodiment, the barrier layer can have a melting temperature of at least 230° C. and the adhesive layer having a melting temperature of no greater than 200° C. I...
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JP7096905B2 |
An electromagnetic shielding film comprising: a shielding film part provided with an adhesive layer, a shielding layer layered on the adhesive layer, and an insulating layer layered on the shielding layer; and a protective part comprisin...
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JP7078537B2 |
The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonp...
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JP2022062371A |
To provide a resin composition that has excellent oxygen barrier properties, and does not require a post-treatment step for a crosslinking reaction when forming a laminate.The inventive resin compositions include polycarboxylic acids cro...
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JP2022062460A |
To provide an oxygen barrier material that includes a polyaspartic acid resin derived from polyaspartic acid, a biodegradable material, wherein the oxygen barrier material has excellent oxygen barrier properties, and does not require a t...
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JP2022017243A |
To provide a label without a biodegradable mount and a tape composition.A label or a tape without a mount comprises a substantially biodegradable natural or synthetic fabric or non-woven fabric substrate impregnated with a mixture contai...
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JP2021193175A |
To provide a method for manufacturing a joined body which can obtain excellent adhesive strength and connection reliability, a joined body, and a conductive particle-containing hot-melt adhesive sheet.A method for manufacturing a joined ...
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JP2021191822A |
To provide a production method of a zygote capable of acquiring excellent adhesion strength and connection reliability, a zygote, and a conductive particle-containing hot melt adhesive sheet.There is provided a production method of a zyg...
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JP6969165B2 |
To provide an anisotropic conductive composition excellent in repairability by an alcoholic solvent.There is provided an anisotropic conductive composition containing polyamide and conductive particles, in which the polyamide contains a ...
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JP6970967B2 |
A laminated article in which an adhesive layer is provided to at least one surface of a resin film, wherein the laminated article is characterized in that the resin that constitutes the resin film is a semi-aromatic polyamide and/or poly...
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JP6968041B2 |
The present invention relates to a conductive adhesive having excellent embedding properties, heat resistance and adhesion. The pressed conductive adhesive comprises: a thermosetting resin; a conductive filler; and an organic phosphate, ...
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JP6955959B2 |
To provide an exfoliation preventive sheet for electromagnetic induction heating that allows quick adhesion, has excellent adhesive power, and can be made transparent after adhesion, an adhesion structure having the exfoliation preventiv...
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JP2021161387A |
To improve dielectric properties of an adhesive layer including a polyimide made from an aliphatic diamine and effectively reduce transmission loss of high frequency signals.A polyimide a) contains a dimer diamine composition-derived res...
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JP2021524456A |
Compound of formula (I) (R1Is an organic group with H or 1 to 100 C atoms, R2, R3Is H or an organic group having 1 to 100 C atoms, Z is a single bond or a divalent organic group having 1 to 100 C atoms, and A is an organic group having 1...
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JP6922248B2 |
To provide a conductive hot-melt adhesive composition that can bond adherends together strongly with high conductivity expressed.A hot-melt adhesive composition contains a thermoplastic resin and a conductive filler. The hot-melt adhesiv...
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JP6877422B2 |
Embodiments of this invention relate to a composition comprising of (A) an anhydride and/or carboxylic acid functionalized, chlorinated olefin-based polymer and/or (b) a styrene-based polymer and/or a functionalized styrene-based polymer...
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JP6873412B1 |
To provide a curable resin composition useful for imparting high adhesion and durability to a base material such as a metal. A curable resin composition is prepared by combining a polyamide resin (A) having an amino group, a blocked poly...
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JP6834946B2 |
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...
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JP2021014598A |
To provide water-dispersible polyamides having carboxylic acid groups.Water-dispersible polyamides having carboxylic acid groups are disclosed. These are made by reacting polycarboxylic acids or anhydrides thereof with an amine-containin...
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JP6793646B2 |
The present invention relates to a thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185°C, and at least one liquid polysiloxane compound which preferably has a viscosity...
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JPWO2019054391A1 |
Provided is an epoxy resin composition having excellent adhesiveness to copper and aluminum and further excellent flexibility in a low temperature environment. An epoxy resin composition containing (A) an epoxy resin and (B) a polyamide-...
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JP6786055B2 |
Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are eac...
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JP6769485B2 |
The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25° C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the...
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JP6758330B2 |
Creping adhesives can include one or more crosslinked resins having the chemical formula (O), (P), or (Q), where RX can be a crosslinking moiety, each RY can independently be a substituted or unsubstituted organic diyl moiety, and each A...
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JP6742249B2 |
and said semicrystalline polyamide having a Tm1 less than or equal to about 150° C., notably less than or equal to about 130° C., in particular less than or equal to about 120° C. and/or a Tg less than or equal to about 60° C., in pa...
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JP6731253B2 |
A linerless label or tape comprises a substantially biodegradable, natural or synthetic, woven or non-woven substrate impregnated with a formulation including at least 90 weight percent of a polyester amide segmented block copolymer. Thi...
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JP6727493B2 |
The invention relates to the use of a block copolymer comprising - at least one polyamide block and - at least one polyolefin block for giving, to the material made from metal to which it is applied, adhesion and anti-corrosion propertie...
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JP6725206B2 |
To provide an adhesive resin composition capable of being used as an adhesive good in adaptability to a fiber reinforced thermoplastic (FRTP) and capable of exhibiting sufficient adhesive strength to other adherend, an adhesive tape form...
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JP6706495B2 |
To provide an adhesive composition having transparency and excellent in adhesiveness to non-polar material and a polar material.The adhesive composition contains polyamide and an ethylene(meth)acrylic acid copolymer and having amine valu...
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JP6706995B2 |
To provide an insulating film for underfill which shows plasticity and fluidity in an early stage of a process for bonding a semiconductor chip to a substrate, and which still has superior storage stability over a long time even after ha...
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JP6687201B2 |
To provide a polyamide fiber, suitable as a hot-melt bonding fiber for a shoes material use, etc.The polyamide fiber comprises a copolymer polyamide obtained by block copolymerization of a polyalkylene glycol as a soft segment with a pol...
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JP6679957B2 |
To provide a binding agent having excellent stress relaxation without reducing physical properties such as thermal characteristics even when there are many metal particles in a major part of components in a paste and without reducing the...
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JP6680035B2 |
To provide a thermally conductive sheet having high thermal conductivity, heat resistance, moist heat resistance, and heat cycle resistance.The thermally conductive sheet contains: a specific polyamide (A) which is a polymer of a polybas...
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JP2020040327A |
To provide a joined body in which a joined member is at least one kind out of a metal member, a polyamide resin member and a polyolefin resin member, and a joint strength between the joined members is excellent.A joined body includes a f...
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JP6669943B2 |
The present invention pertains to a thermoplastic hot melt adhesive comprising a polymer in an amount of at least 50% by weight of the hot melt adhesive composition, wherein the polymer is a polyester which is a reaction product of a dic...
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JP6659542B2 |
A formulation useful as a creping adhesive formulation or Yankee dryer coating composition is described. Methods of creping using the formulation are also described.
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JP6648300B2 |
A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of...
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JP6629659B2 |
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JPWO2018105126A1 |
The composition contains metal particles capable of transitional liquid phase sintering and a thermoplastic resin having a thermal decomposition rate of 2.0% by mass or less measured under a thermogravimetric analyzer under a nitrogen st...
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JP2019172852A |
To provide a conductive adhesive sheet that can improve the electrical conduction between the ground circuit and the reinforcing board of a printed circuit board, and does not have a resin flow problem.Provided is a conductive adhesive s...
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JP2019528345A |
The adhesive film can include a barrier layer and an adhesive layer. In one embodiment, the barrier layer can have a melting temperature of at least 230 ° C and the adhesive layer can have a melting temperature of 200 ° C or less. In o...
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JP6561912B2 |
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JP6549247B2 |
The present invention relates to a power cable. More particularly, the present invention relates to a power cable which is, when compared to the existing power cables, lightweight and includes a watertight layer which improves a corrosio...
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JP2019119820A |
To provide an encapsulation film capable of encapsulating an electronic component by adding excellent followability to unevenness generated due to loading of the electronic component equipped with an electronic component loading substrat...
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JP2019519626A |
The present invention is an electroconductive hot melt adhesive or molding composition, wherein the composition is: a) polyamide, thermoplastic polyamide, copolyamide, polyolefin, poly (meth) acrylate, polystyrene, polyurethane, polyeste...
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