| Document |
Document Title |
|
WO/2014/054409A1 |
Provided is a thermally restorable article, which has good embeddability during heat-shrinking and is capable of improving adhesion to the substrate being processed, and which is capable of reducing variations in the thickness of the adh...
|
|
WO/2014/053786A1 |
The invention relates to a polyamide composition which is thermo-adhesive on an acrylonitrile-based elastomer substrate, characterized in that it comprises from 10 mol% to 100 mol% of tertiary amide functions, relative to the total numbe...
|
|
WO/2014/003895A1 |
A linerless label or tape comprises a substantially biodegradable, natural or synthetic, woven or non-woven substrate impregnated with a formulation including at least 90 weight percent of a polyester amide segmented block copolymer. Thi...
|
|
WO/2013/176295A1 |
The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relat...
|
|
WO/2013/174530A1 |
The invention relates to a method and to a device for establishing a thread connection by means of joining, wherein at least two ends (1) of at least two interconnectable threads (F) are arranged in overlapping manner in a chamber (3.1) ...
|
|
WO/2013/135677A1 |
A hotmelt adhesive comprising - 20 to 90% by weight of at least one polyamide having a molecular weight (MW) of 10 000 to 250 000 g/mol, - 1 to 25% by weight of at least one organic or inorganic salt, - 0 to 60% by weight of further addi...
|
|
WO/2013/133041A1 |
This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure...
|
|
WO/2013/133145A1 |
The present invention provides a copolymer polyether polyamide resin composition for coating or impregnation of a woven-knit fabric that comprises 0.4 to 10 parts by mass of a hindered phenol antioxidant having intramolecular amide bonds...
|
|
WO/2013/079680A1 |
An aqueous binder composition comprises: (1) a water-soluble binder component obtainable by reacting at least one alkanolamine with at least one polycarboxylic acid or anhydride and, optionally, treating the reaction product with a base;...
|
|
WO/2013/057432A1 |
The present invention relates to a sizing composition containing a thermosetting resin and an amine-carboxylic acid resin as fire retardant. The preparation of said amine-carboxylic acid resin does not involve formaldehyde. The invention...
|
|
WO/2013/047378A1 |
Provided is a resin composition which is usable in adhesives for films or coatings for films to be used in the inner and outer faces of the body and lid of laminated type beverage cans and food cans, has particularly excellent curability...
|
|
WO/2013/038840A1 |
A film-like anisotropic conductive adhesive, which has connection reliability and repairability, and does not lose adhesive strength even if the heating temperature is reduced during bonding, is provided. Said adhesive contains (A) a phe...
|
|
WO/2012/164836A1 |
Provided is an adhesive composition which is free from halogens and has improved adhesiveness and improved long-term reliability compared with the conventional adhesive compositions. The adhesive composition comprises, per 100 parts by w...
|
|
WO/2012/141271A1 |
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...
|
|
WO/2012/141267A1 |
A pressure-sensitive adhesive that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers including t...
|
|
WO/2012/141167A1 |
The purpose of the present invention is to provide a reinforcing material equipped with a cohesive/adhesive layer, which has a proper initial adhesion force to an object of interest, such as an electrolytic film, a catalyst layer and a g...
|
|
WO/2012/141266A1 |
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...
|
|
WO/2012/113619A1 |
A process to bond flat substrates with adhesives wherein (i) a solution of an adhesive is applied to a substrate, (ii) the adhesive forms a layer on the substrate by evaporation of the solvents, (iii) the adhesive layer is activated by h...
|
|
WO/2012/096136A1 |
The purpose of the present invention is to provide: a resin composition (preferably an adhesive composition) which comprises a polyether polyamide elastomer and which can adhere strongly to a polyimide resin, preferably by simple and eas...
|
|
WO/2012/096206A1 |
Provided is a process for producing a polymer member having a portion in which an immiscible substance is localized, wherein the process enables the ease of product designing for the purpose of obtaining a desired polymer member. This pr...
|
|
WO/2012/076763A1 |
The invention relates to a two-phase polymer blend, comprising: (a) a polyamide having a melting point at most equal to 210°C, (b) a polyolefin modified by grafting of carboxyl functions, the rheological behaviour of which in the melt s...
|
|
WO/2012/064126A2 |
The present invention relates to a medical adhesive composition, and more specifically, to a medical adhesive composition comprising: poly-γ-glutamic acid or a salt thereof; and a sugar or a sugar alcohol. The medical adhesive compositi...
|
|
WO/2012/028229A1 |
The invention relates to an adhesive compound for a hot-sealing insert, to an insert that is equipped with said adhesive compound, and to a method for fixing the insert. The adhesive compound consists of a thermoplastic hot-melt adhesive...
|
|
WO/2012/013650A1 |
The invention relates to a hotmelt adhesive comprising a hotmelt adhesive mixture, the mixture comprising a. 15-85% by weight of a first, polyester-based hotmelt adhesive, b. 15-85% by weight of a second, polyamide-based hotmelt adhesive.
|
|
WO/2012/011265A1 |
Disclosed is an adhesive agent composition that does not use halogens, has excellent adhesive strength, long-term reliability, and workability, and is suitable for use in anisotropic conductive paste favorably used in connecting substrat...
|
|
WO/2011/114665A1 |
Disclosed is a heat-resistant adhesive comprising: a phenolic hydroxyl group-containing aromatic polyamide resin (A) having a structure represented by formula (1), wherein m and n each represent an average and satisfy the relationship: 0...
|
|
WO/2011/109646A1 |
A hot melt adhesive composition and use thereof for solar panel assembly. The adhesive composition includes a thermoplastic component having a softening point of at least 1200C and selected from the group consisting of thermoplastic elas...
|
|
WO/2011/096467A1 |
A resin-part-attached glass (20) comprising a glass (11), a polyamide primer film (12) attached to the glass (11), a cyanoacrylic adhesive agent (16) applied onto the polyamide primer film (12), and a resin part (14) attached to the cyan...
|
|
WO/2011/077979A1 |
An anisotropic conductive adhesive is a material which comprises a highly insulating adhesive and electroconductive particles uniformly dispersed therein, and such a material is used in electronic components for the purpose of electrical...
|
|
WO/2011/068984A2 |
Fiberglass mats, binder compositions, and methods for making the same are provided. In at least one specific embodiment, the fiberglass mat can include a plurality of glass fibers and a binder composition that includes a copolymer and on...
|
|
WO/2011/062850A2 |
The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention ar...
|
|
WO/2011/040415A1 |
Disclosed is a multilayer resin sheet comprising a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent, and an inorganic filler, and an insulating adhesive layer provided on at least one surface of the resin...
|
|
WO/2011/039948A1 |
An adhesive resin composition for silicon wafers which, when in a cured state, exhibits excellent adhesiveness to silicon wafers, characterized by comprising an epoxy resin and a compound having a urea structure in such amounts that the ...
|
|
WO/2011/040416A1 |
Disclosed is a resin composition comprising an epoxy resin monomer having a mesogenic skeleton, a novolak resin containing a compound having a structural unit represented by general formula (I), and an inorganic filler. The resin composi...
|
|
WO/2010/136241A1 |
A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in ve...
|
|
WO/2010/129199A2 |
A water-soluble pressure sensitive adhesive comprises a homogeneous blend comprising (a) a polymer selected from the group consisting of N-vinyl caprolactam homopolymers, N-vinyl pyrrolidone copolymers, and mixtures thereof and (b) a non...
|
|
WO/2010/098154A1 |
Provided are adhesive resin compositions that are halogen-free, have excellent adhesiveness, solder heat resistance and flame resistance, and excellent flow characteristics, and laminates and flexible printed wiring boards using the same...
|
|
WO/2010/098155A1 |
Provided are adhesive compositions that are halogen-free and have satisfactory flame resistance without loss of adhesiveness or solder heat resistance, and laminates and flexible printed wiring boards using same. The adhesive resin compo...
|
|
WO/2010/084722A1 |
Disclosed is an adhesive composition which has excellent adhesion strength, heat resistance and workability, without using halogen. The adhesive composition is suitable for applications in conductive adhesives which are especially suita...
|
|
WO/2010/028948A1 |
Heat-activatable adhesive tape, in particular for the production and further processing of electronic components and conductor tracks, comprising an adhesive composition which comprises at least a) a polyamide, which is soluble in ethano...
|
|
WO/2009/150818A1 |
Disclosed is a flame-retardant adhesive composition which does not contain any halogen compound and contains a phosphorus compound. Also disclosed is a novel laminated film having superior flame retardancy. The laminated film comprises...
|
|
WO/2009/150328A2 |
1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - fr...
|
|
WO/2009/049781A2 |
The invention relates to radiation-curable acrylated polyaminoamides that are obtained by Michael-Addition of polyaminoamides with terminal amine groups (A) and polyol ester acrylates (B). The molar ratio of the acrylate groups in the po...
|
|
WO/2009/028170A1 |
Disclosed is a thermosetting resin composition containing (i) a reactive hydroxy group-containing polyamide resin, (ii) at least one epoxy resin selected from the group consisting of epoxy resins having a polycondensate skeleton of dicyc...
|
|
WO/2008/112834A1 |
Laminate structures comprising one or more sheets of material bonded together with an adhesive polymer. The adhesive polymer is a polyester amide, polyester urethane, or polyester urea.
|
|
WO/2008/104719A2 |
The invention relates to a copolyamide containing at least two patterns and of the general formula A/(Cz diamine). (Cw diacid), in which : z is the number of carbon atoms of the diamine and w is the number of carbon atoms of the diacid; ...
|
|
WO/2008/068996A1 |
[PROBLEMS] To provide: a thermosetting resin which can be used in the production of a laminate for use in an destiné à être employé dans un component, an electrical product or a fiber, particularly can be used in a multilayer circuit...
|
|
WO/2008/064950A1 |
The invention relates to a molded part for bonding to metal or plastic substrates for use as a fastening element. Said molded part comprises a hot melt adhesive, said hot melt adhesive being based on polyamide, polyolefins, polyesters, p...
|
|
WO/2008/029070A1 |
The invention provides a self-adhesive composition in powder form for the coating of metallic substrates, composed of homopolyamide (A) selected from PA11 and PA12, copolyamide (B), calcium carbonate and, optionally, at least one compone...
|
|
WO/2007/030791A1 |
The use of a polyester-amide in a hot melt adhesive formulation, wherein the polyester-amide includes a short aliphatic dicarboxylic acid functionality and a short symmetrical, crystallizing amid diol functionality.
|
