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WO/2023/149474A1 |
Provided are: a terpene-based resin which has excellent adhesion to highly polar adherends such as glass, and which has high transparency and good weather resistance; and an adhesive composition using the same. Provided are: a hydrogen...
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WO/2023/145776A1 |
A polymer film wherein, when irradiation is performed with UV light that has a wavelength of 365 nm, a peak is detected at an electron spin nuclear magnetic resonance (ESR), and four such peaks are not detected, or if four peaks are dete...
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WO/2023/147115A1 |
Structural adhesives containing a core-shell toughening component miscible in methylacrylic-based adhesives in addition to at least one toughening agent which is not miscible in methacrylic adhesives, produced surprisingly improved impac...
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WO/2023/145360A1 |
Provided is a peelable surface protective sheet which adheres well to an object to be treated when the object is treated, and allows for peeling without damaging or deforming an adherend when peeled off. Provided is a surface protective ...
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WO/2023/144538A1 |
A facade surface covering for installation on a surface of a structure, wherein the facade surface covering comprises one or more surface elements, and the surface elements comprise a flexible material comprising a flexible polymer compo...
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WO/2023/145504A1 |
A foaming adhesive sheet comprising a first adhesive layer that contains a curable adhesive and a foaming agent, and a second adhesive layer that is disposed on one surface of the first adhesive layer, contains a curable adhesive, and do...
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WO/2023/145292A1 |
[PROBLEM] To provide a polymer which has a novel alicyclic structure and can be used as an adhesive. [SOLUTION] A polymer having an alicyclic structure according to the present invention has a crystal heat of fusion of 30.0 J/g or less, ...
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WO/2023/146043A1 |
The present invention relates to: an adhesive composition for semiconductor processing that can produce film having highly reliable adhesiveness to wafers; film comprising the adhesive composition for semiconductor processing; and a meth...
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WO/2023/145942A1 |
This moisture-curable hot-melt resin composition is a reactant of a polyol (A) and a polyisocyanate compound (B), and contains a urethane prepolymer having an isocyanate group. The polyol (A) includes a polyether polycarbonate polyol (a1...
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WO/2023/137791A1 |
Provided are a waterproof gas-permeable TPU hot-melt adhesive film and a preparation process therefor. The waterproof gas-permeable TPU hot-melt adhesive film comprises the following components in parts by weight: 75-90 parts of TPU; 15-...
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WO/2023/140316A1 |
The purpose of the present invention is to provide an adhesive composition that readily forms a thin, high-quality polyester adhesive in a composition that contains a polyester polymer and a crosslinking agent and additionally contains a...
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WO/2023/137792A1 |
A high-temperature-resistant EVA hot melt adhesive film, comprising the following raw materials, in parts by weight: 60-100 parts of an EVA resin; 10-30 parts of europium acrylate; 5-20 parts of diphenylmethane bismaleimide; 4-15 parts o...
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WO/2023/138616A1 |
An optical imaging element with magnetic reflective layer imaging units, and a preparation method therefor. The optical imaging element comprises a plurality of superposed optical imaging units, wherein each optical imaging unit comprise...
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WO/2023/136145A1 |
The purpose of the present invention is to provide a resin composition that is appropriate for forming an adhesive layer suitable as a shock-absorbing layer endowed with both shock absorption properties and processability/workability. ...
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WO/2023/136131A1 |
The present invention addresses the problem of providing an adhesive sheet and an adhesive agent having outstanding adhesive strength, heat resistance, resistance to humidity-induced whitening, outgas resistance, and light resistance. Sa...
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WO/2023/136171A1 |
The purpose of the present invention is to provide a single-sided adhesive tape that does not tend to wrinkle even when affixed to a thin adherend and that has exceptional resistance to strong alkaline solutions. The present invention is...
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WO/2023/136272A1 |
This adhesive composition contains (A) an epoxy resin, (B) a curing agent, and (C) a film-forming component, wherein component (A) includes more than 90 mass% of an aromatic epoxy resin with respect to the total amount of component (A), ...
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WO/2023/136274A1 |
Provided is an adhesive agent composition containing (A) an epoxy resin and (B) a curing agent, wherein, for the (A) ingredient, a xylene-novolac based glycidyl ether is included. Further provided is an adhesive agent film for circuit co...
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WO/2023/136361A1 |
[Problem] To provide an adhesive composition that has excellent adhesion to both metal substrates and various resin substrates such as those made of polyimide, and that also has exceptional solder heat resistance, low dielectric characte...
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WO/2023/136052A1 |
One embodiment of the present invention relates to a pressure-sensitive adhesive composition for a polarizing plate or a polarizing plate with a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive composition for a pol...
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WO/2023/136273A1 |
An adhesive composition comprising (A) an epoxy resin and (B) a curing agent, said adhesive composition containing a multifunctional epoxy resin as the component (A) and a pyridinium salt as the component (B), wherein the pyridinium salt...
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WO/2023/136299A1 |
The present invention provides: a method in which electrical pulses are applied to an article including a portion where two or more members have been bonded together by an adhesive layer containing an electroconductive filler, thereby lo...
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WO/2023/136286A1 |
An adhesive composition that contains (A) an epoxy resin and (B) a curing agent, in which a pyridinium salt is included as the (B) component, the pyridinium salt includes a pyridinium cation and an anion, the pyridinium cation has a benz...
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WO/2023/132578A1 |
The present invention relates to an adhesive composition and, more specifically, to an adhesive composition comprising an acrylic copolymer, a non-yellowing isocyanate-based or aziridine-based cross-linking agent, and an organosilicon co...
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WO/2023/130609A1 |
The present disclosure relates to the technical field of pressure-sensitive adhesives, in particular to a water-resistant and sweat-resistant hot-melt pressure-sensitive adhesive, and a preparation method therefor and the use thereof. Th...
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WO/2023/132020A1 |
The present invention addresses the problem of providing: an oxygen-absorbing compound which has oxygen-absorbing properties and generates a reduced amount of odor; and an oxygen-absorbing adhesive composition and a coating agent composi...
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WO/2023/132051A1 |
A paste-like resin composition according to the present invention includes silver-containing particles A, a solvent B, and a thermosetting resin C, and the difference between a Hansen solubility parameter a of the silver-containing parti...
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WO/2023/130722A1 |
The present invention relates to a hot melt adhesive film for bonding a metal and PVC, and a preparation method therefor. The hot melt adhesive film comprises a first adhesive layer for bonding with PVC, a second adhesive layer for bondi...
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WO/2023/127675A1 |
A room-temperature-curing resin composition, which contains in specific ratios (A) an organic polymer in which molecular chain ends are capped by hydrolyzable silyl groups and/or hydroxysilyl groups and (B) a hydrolyzable organosilane co...
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WO/2023/123608A1 |
A hydrolysis-resistant TPU hot melt adhesive film, comprising the following raw materials, in parts by weight: 65 to 80 parts TPU granules, 6 to 10 parts hydrolysis-resistant auxiliary agent, 4 to 8 parts yellowing-resistant agent and 0....
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WO/2023/123607A1 |
A high adhesion-strength TPU hot melt adhesive film, which comprises the following raw materials, in parts by weight: 50-70 parts of TPU particles, 45-50 parts of a tackifying resin, 0-10 parts of a modified polyester, 0.1-1 parts of an ...
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WO/2023/127551A1 |
The present invention provides a curable resin composition that has excellent adhesive strength at room temperature and high temperature, and that has excellent handling performance and sufficient heat-resistant creep properties. Specifi...
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WO/2023/127219A1 |
The present invention provides a silicone adhesive which contains a modified cyclodextrin. It is preferable that the modified cyclodextrin is at least one of a modified β-cyclodextrin and a modified γ-cyclodextrin. It is also preferabl...
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WO/2023/127235A1 |
The purpose of the present invention is to provide: a skin-patch thermometer which is not susceptible to the ambient temperature and has properties that are suitable for attachment to the skin; and a temperature indicating material-conta...
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WO/2023/126997A1 |
[Problem] To provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer which, even when adopted in communication devices for conducting high-speed communication, is less apt to reduce the co...
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WO/2023/128581A1 |
The present invention provides: an adhesive composition including a curable resin, an initiator, a getter, and a cross-linking agent; a cured body and a dam structure, in which the adhesive composition is cured; and a display device incl...
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WO/2023/127890A1 |
Provided is an epoxy-based adhesive composition excelling in re-dispersibility of a filler, having a re-peelable property in a B-stage state, and capable of forming an adhesive layer exhibiting excellent adhesive strength after a curing ...
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WO/2023/128632A1 |
An embodiment of the present invention provides: an adhesive resin composition comprising substituted or unsubstituted dicyclopentadiene and a substituted or unsubstituted acrylic compound and having a storage modulus of 100 Pa to 1000 P...
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WO/2023/124668A1 |
Disclosed is a polyamide composite material, which comprises the following components in parts by weight: 100 parts of a polyamide with a terminus amino group value of 45-200 mmol/kg, and 0.1-8 parts of an epoxy resin with an epoxy value...
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WO/2023/128631A1 |
An embodiment of the present invention provides an adhesive resin mixture having controlled fluidity, and a self-assembling anisotropic conductive adhesive comprising the adhesive resin mixture. The self-assembling anisotropic conductive...
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WO/2023/120946A1 |
Disclosed are an additive for an epoxy adhesive and a one-component epoxy adhesive composition comprising same. The additive for an epoxy adhesive may be obtained by reacting epoxy, maleinized polybutadiene and polyetheramine. In additio...
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WO/2023/116465A1 |
The present invention relates to the technical field of anti-corrosion adhesive tape materials. Disclosed are an elastic anti-corrosion adhesive, an elastic anti-corrosion adhesive tape, and a preparation method therefor. The elastic ant...
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WO/2023/120136A1 |
An adhesive sheet with a release film having a space part between the release film and the adhesive sheet and having a porosity (X) of 3 to 70% in the space part is proposed as an adhesive sheet with a release film including an adhesive ...
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WO/2023/120778A1 |
The present invention relates to a silicone tape composition for sensing hydrogen gas, a hydrogen-gas-sensing silicone tape thereof, and a production method for same, wherein the silicone tape composition can be simply made into an adhes...
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WO/2023/119015A1 |
The present invention relates to a hot melt adhesive composition for disposable medical articles, specifically, to an X-rays detectable hot melt adhesive composition that allows the identification of non-woven material left inside the pa...
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WO/2023/120991A1 |
The present invention relates to an adhesive composition with excellent transparency and, more specifically, to an adhesive composition, which has excellent adhesion retention while realizing high transparency and low turbidity, through ...
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WO/2023/120542A1 |
This adhesive composition contains: a pyridinium salt represented by general formula (1); a cationic polymerizable compound; and a polymerization initiator, wherein the polymerization initiator contains an onium salt. An adhesive film fo...
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WO/2023/117975A1 |
The invention relates to an indicator mixture comprising at least one dye, which indicator mixture is provided for joint use with at least one coating compound and at least one cross-linking agent. In order to improve identification, it ...
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WO/2023/119849A1 |
A flocked spring (30) according to the present invention comprises: a spring main body (31); a coating layer (32) which is arranged on the surface of the spring main body (31); an adhesive layer (33) which is arranged on the surface of t...
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WO/2023/120511A1 |
[Problem] To provide an adhesive composition having excellent properties such as tensile shear properties on a substrate and curability. [Solution] The adhesive composition comprises: a bi- or higher functional aromatic epoxy resin (A), ...
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