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WO/2023/176768A1 |
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide comp...
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WO/2023/176345A1 |
Provided are: a method for producing a laminated film capable of reducing environmental impact and capable of suppressing the occurrence of air bubbles in the adhesive layer; a laminated film; and a packaging container. In the method f...
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WO/2023/176607A1 |
Provided is an adhesive sheet in which interlayer stress can be reduced when the sheet is folded, especially in a low temperature state, which exhibits excellent durability for suppressing cracks in a member sheet or flexible member, and...
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WO/2023/177255A1 |
The present invention relates to a method for manufacturing an eco-friendly adhesive resin using a low carbon emission process, an adhesive resin prepared thereby, an adhesive composition containing the adhesive resin, and an adhesive la...
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WO/2023/176023A1 |
Provided is an adhesive sheet 1 comprising: a base material 11 formed from a paper material; and an adhesive layer 12 laminated on at least one surface of the base material 11, wherein an adhesive constituting the adhesive layer 12 conta...
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WO/2023/176833A1 |
The purpose of the present invention is to provide an adhesive agent composition capable of forming and adhesive agent layer that exhibits low surface resistivity and has excellent antistatic performance. An adhesive agent composition ...
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WO/2023/176134A1 |
The present disclosure provides an article comprising a first member, a second member, and an adhesive member disposed between the first member and the second member, wherein: the adhesive member has at least a cured adhesive layer, and ...
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WO/2023/176941A1 |
The purpose of the present invention is to provide a resin composition exhibiting thermal adhesion and water vapor barrier properties with respect to non-polar substrates, as well as handleability, and said purpose is achieved by a resin...
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WO/2023/176958A1 |
Provided is a resin composition characterized by containing an epoxy resin, a curing agent, a foaming agent, and a filler, the shape of the filler being a flake shape, a plate shape, a needle shape, a fiber shape, or a branch shape, and ...
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WO/2023/171572A1 |
The purpose of the present invention is to provide an epoxy resin composition which contains a reactive diluent that is capable of decreasing the viscosity of an epoxy resin with a minimum deterioration in the normal performance of the e...
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WO/2023/171515A1 |
Provided is a sheet for workpiece processing, which is provided with a base material and an adhesive layer that is superposed on one surface of the base material, and which is such that the adhesive layer is composed of an active energy ...
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WO/2023/171615A1 |
This aqueous dispersion contains a resin component, a wetting agent, and water. The resin component contains an ethylene-unsaturated carboxylic acid copolymer. The wetting agent contains a silicon-based wetting agent and an acetylene-bas...
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WO/2023/168833A1 |
Disclosed in the present application are a composition, an adhesive film comprising the composition, and a chip packaging structure. The composition comprises epoxy resin, a surfactant, a curing agent and a filler, the surfactant being s...
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WO/2023/171079A1 |
Provided is a sheet for workpiece processing, which is provided with a base material and an adhesive layer that has been laminated on one side of the base material, and which is such that the adhesive layer is composed of an active energ...
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WO/2023/171516A1 |
Provided is a sheet for workpiece processing comprising a base material, an adhesive layer that has been laminated on one side of the base material, and a protective film forming layer that has been laminated on the adhesive layer, on th...
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WO/2023/167239A1 |
The present disclosure provides a foaming adhesive sheet having: a first adhesive layer; a base material; and a second adhesive layer in the stated order. The first and second adhesive layers contain a curable adhesive. At least one of t...
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WO/2023/167067A1 |
The present disclosure provides a curable composition containing an ene compound and a thiol compound. A cured product of this curable composition has good adhesiveness and the adhesive strength of the cured product tends not to diminish...
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WO/2023/167360A1 |
Disclosed are a water-dispersible polyurethane adhesive composition for a water-soluble label, and a preparation method therefor, the composition comprising: a water-dispersible polyurethane-urea adhesive resin obtained by polymerization...
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WO/2023/166811A1 |
[Problem] To provide a window film that has an adhesive agent layer in which glue slippage due to deformation of the adhesive agent layer is suppressed. [Solution] A window film having a substrate and an adhesive agent layer that is posi...
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WO/2023/167011A1 |
Provided is a curable composition which contains a polymer having a hydrolyzable silyl group and which has improved adhesiveness to polyolefin-based materials. The curable composition comprises (A) a (meth)acrylic-ester-based polymer hav...
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WO/2023/167052A1 |
The present invention provides: a thermosetting adhesive sheet which can be stored at room temperature and completes bonding without requiring a curing process after thermal compression bonding, while being capable of suppressing bonding...
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WO/2023/167014A1 |
The present invention addresses the problem of providing a resin composition and an adhesive with which a cured material, in which unreacted residues are suppressed after thermal curing following UV curing, can be obtained. Provided is...
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WO/2023/166996A1 |
The present invention provides: a solvent-less adhesive agent in which defects in appearance due to bubbles are unlikely to occur; a laminate obtained using the adhesive agent; a manufacturing method for the laminate; and packaging mater...
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WO/2023/166775A1 |
Provided is an adhesive sheet 1 including a single-layered or multi-layered adhesive agent layer 11, in which at least one of layers constituting the adhesive agent layer 11 comprises an adhesive agent comprising a modified cyclodextrin....
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WO/2023/168177A1 |
Epoxy-based adhesive compositions are provided, exhibiting improved uncured humidity resistance, cured humidity resistance and improved wash-off resistance, which upon curing result in crash durable and stress resistant cured bonds on st...
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WO/2023/162928A1 |
Provided is a resin composition that can enhance heat dissipating ability of an obtained cured product and that can enhance the flexibility of the obtained cured product. A resin composition according to the present invention contains ...
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WO/2023/163293A1 |
Embodiments of the present invention provide an adhesive sheet and a display device comprising same. The adhesive sheet is formed from an adhesive composition including: a polymer of (meth)acrylic monomers and polar functional group-cont...
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WO/2023/162664A1 |
The purpose of the present invention is to provide a curable composition having excellent workability and exceptional adhesiveness even after alkali treatment without using an epoxy resin. The above problem is solved by providing a curab...
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WO/2023/160197A1 |
The present invention discloses a single-component organic silicon-modified sealant and a preparation method therefor. The single-component organic silicon-modified sealant is prepared from the following raw materials: 15 to 40 parts of ...
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WO/2023/157904A1 |
The present invention addresses the problem of providing a pressure-sensitive adhesive sheet which exhibits excellent adhesion to an adherend even in a moist heat environment and in which whitening is suppressed. The present invention re...
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WO/2023/157384A1 |
The present invention provides a moisture-curable polyurethane hot-melt resin composition comprising a urethane prepolymer (i) having an isocyanate group, which is a product of reaction between a polyol (A) and a polyisocyanate (B), and ...
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WO/2023/157846A1 |
The present invention discloses a film-like adhesive. The film-like adhesive contains an epoxy resin, a phenolic resin, an elastomer and an inorganic filler. The ratio of the epoxy groups in the epoxy resin to the hydroxyl groups in the ...
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WO/2023/157946A1 |
Provided is a liquid paste that is for paper and that can be applied to further various applications and needs by having a compositional makeup and components different from those in conventional products. The liquid paste is particularl...
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WO/2023/155276A1 |
Disclosed are an EVA hot melt adhesive film capable of blocking ultraviolet rays and a preparation method therefor. The hot melt adhesive film comprises 60-80 parts of an EVA main body resin; 3-8 parts of an ultraviolet light absorber; 1...
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WO/2023/157404A1 |
Provided is a production method for a polarizing film having at least a polarizer, the method comprising an application step for applying a curable aqueous dispersion composition to at least one surface of a polarizer and a drying step f...
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WO/2023/158042A1 |
The present invention relates to a reusable nail tip, and specifically, to a nail tip that can be easily attached to a nail and used for a certain period of time and then removed, and used again. The nail tip according to the present inv...
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WO/2023/157632A1 |
The present invention addresses the problem of providing a laminated film that improves defects in the corresponding prior art and that is provided with the physical characteristics required for use as a laminated film, the laminated fil...
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WO/2023/157838A1 |
The purpose of the present invention is to provide an epoxy-based adhesive which exhibits good toughness while exhibiting excellent adhesion to a substrate and which also exhibits heat resistance. This adhesive composition can be advanta...
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WO/2023/153514A1 |
This photo/moisture curable resin composition contains a radical polymerizable compound, a moisture-curable resin, a photoradical polymerization initiator, and zirconium nitride, and the OD value of the cured product having a thickness o...
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WO/2023/152912A1 |
The present invention addresses the problem of providing an electrically peelable adhesive product which has excellent electrical peelability even under such conditions that the electrically peelable adhesive product is exposed to high t...
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WO/2023/153444A1 |
The purpose of the present invention is to provide: a composition which, upon heating to a prescribed temperature, has excellent adhesiveness with a dissimilar material; and a cured product of the same. The present invention is an adhe...
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WO/2023/153512A1 |
An adhesive film 1 is provided with a release film 2, and an adhesive layer 3 laminated on one surface 2a side of the release film 2. The adhesive layer 3 comprises a body portion 3A, and a strip-shaped micro piece 3B protruding from the...
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WO/2023/153196A1 |
Excellent adhesive strength can be maintained to improve product reliability, even after storage under high humidity, by a curing agent (B) for an epoxy resin, the curing agent (B) containing a reactive terminated polydiene (B1), a react...
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WO/2023/152837A1 |
Disclosed is a film-form adhesive. The film-form adhesive contains a thermosetting resin component, an elastomer, and an inorganic filler. The total content value for the thermosetting resin component and elastomer is 58 mass% or greater...
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WO/2023/152911A1 |
The present invention addresses the problem of providing an electrically peelable pressure-sensitive adhesive product that exhibits excellent electrical peeling properties even under conditions where the product is exposed to high temper...
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WO/2023/152913A1 |
The present invention addresses the problem of providing an electrically removable pressure-sensitive adhesive sheet which is thin and is easy to apply to adherends. The electrically removable pressure-sensitive adhesive sheet comprises ...
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WO/2023/153152A1 |
Provided are: a pressure-sensitive adhesive that contains an emulsion type polymer, an active energy ray-curable resin and, preferably, a photopolymerization initiator; and a pressure-sensitive adhesive sheet 1 that is constituted of a p...
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WO/2023/154497A1 |
Described herein is a fire-resistant adhesive coating composition which emits water vapor when exposed to fire. Such compositions comprise an ionic polyacrylate dispersant, aluminum hydroxide, silicate, and an alkoxylated alcohol. In cer...
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WO/2023/149581A1 |
The purpose of the present invention is to provide: a surface treatment solution that does not contain Si atoms and shows almost no deterioration in adhesion even when applied to the surface of a resin and left on the surface-treated res...
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WO/2023/149023A1 |
Provided is an adhesive sheet that can be used in transfer of electronic components, said adhesive sheet being capable of contributing to a reduction in production costs, achieving excellent positional accuracy of electronic components a...
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