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WO/2022/208815A1 |
An acrylic pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape which are excellent in terms of adhesiveness, high-temperature holding property, load resistance, and impact resistance even in application to poor...
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WO/2022/210189A1 |
The purpose of the present invention is to provide a novel curing catalyst, resin composition, sealing material, adhesive, and cured product. A curing catalyst having a compound according to structural formula (I) is used. (In the formul...
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WO/2022/210277A1 |
An objective of the present invention is to provide a radiation-curable adhesive sheet with which the progress of curing during storage can be suppressed, with which excellent thickness unevenness absorbability and stress relaxation prop...
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WO/2022/210364A1 |
Provided is a polyester resin which has a high degree of freedom of design and which, even when having an increased molecular weight, can have excellent biodegradability. The polyester resin is a polyester comprising a hydroxylated dicar...
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WO/2022/211247A1 |
Disclosed are: an adhesive composition, which comprises a urethane polymer, an acrylate-based compound containing a non-polar alkyl group, and an acrylate-based compound containing a polar group; and a packaging material for a battery, w...
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WO/2022/210703A1 |
An adhesive composition which comprises one or more polymerizable monomers each having a carbon-carbon double bond, an elastomer, and a polymerization initiator. At least some of the polymerizable monomers is a highly polar monomer havin...
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WO/2022/209643A1 |
Provided is an anisotropic light-diffusing adhesive layer that achieves excellent viewing angle expansion. The anisotropic light-diffusing adhesive layer contains an adhesive and an acicular filler. The acicular filler is dispersed in th...
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WO/2022/209918A1 |
[Problem] To provide an adhesive composition that exhibits excellent adhesion to a base material, which is mainly composed of a polyolefin resin such as a polypropylene, a polyethylene and an ethylene-vinyl acetate copolymer (EVA), witho...
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WO/2022/209830A1 |
An adhesive sheet (2) is obtained by forming, into a layered configuration, an adhesive composition that contains an acrylic base polymer and a polyfunctional (meth)acrylate having four or more (meth)acryloyl groups in one molecule as a ...
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WO/2022/210055A1 |
The present invention pertains to an adhesive sheet having a band shape and provided with an adhesive layer, said adhesive sheet comprising a slanted part formed in a tapering shape such that the width thereof tapers toward one end of th...
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WO/2022/210408A1 |
Disclosed is a reactive hot-melt adhesive which comprises a urethane prepolymer having structural units derived from a polyol and structural units derived from a polyisocyanate, a phenolic antioxidant, and an ultraviolet absorber. The st...
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WO/2022/208605A1 |
In order to provide an adhesive tape which hardly deforms while satisfying required characteristics expected of adhesive tape, such as adhesive force and holding power, is capable of suppressing stickiness of side surfaces, and is capabl...
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WO/2022/210054A1 |
The present invention relates to an aqueous dispersion which contains a modified polyolefin resin that is obtained by modifying a polyolefin resin (A) with an α,β-unsaturated carboxylic acid and/or an acid anhydride (B) thereof, wherei...
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WO/2022/210190A1 |
The purpose of the present invention is to provide a novel amine derivative. The present invention provides an amine derivative having a phthalimide backbone, wherein according to differential scanning calorimetry (DSC), the value of (me...
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WO/2022/209042A1 |
Provided are: a curable water dispersion composition containing water serving as a solvent, a polymerizable compound A that is solid or has a viscosity of at least 100 mPa∙s at 25ºC, and a surfactant; and an optical film which include...
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WO/2022/208814A1 |
The purpose of the present invention is to provide: a rubber-based pressure-sensitive adhesive composition having excellent adhesive force, high-temperature holding properties, and removability in application to various adherends includi...
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WO/2022/209064A1 |
The present invention provides an adhesive paste that contains a curable organopolysiloxane compound and a heat conductive filler, wherein: the thermal conductivity of a cured product which is obtained by heat curing of the adhesive past...
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WO/2022/202560A1 |
The purpose of the present invention is to provide an electroconductive adhesive layer which has excellent connection stability between adherends that are electroconductive members and which, even at high temperatures, retains the connec...
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WO/2022/202778A1 |
A purpose of the present invention is to provide an adhesive tape capable of exerting excellent adhesive force on a rough surface. Another purpose of the present invention is to provide: a method for immobilizing an electronic device com...
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WO/2022/202856A1 |
The present invention relates to a multilayer label having a substrate, one or more resin layers and an adhesive layer in the order stated. Any interlayer in a laminate structure composed of the substrate and the one or more resin layers...
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WO/2022/199579A1 |
The present disclosure relates to the technical field of encapsulation films, and in particular to a black high-reflection high-heat-conducting anti-PID EVA encapsulation film, and a preparation method therefor and an application thereof...
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WO/2022/201767A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and a resin layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces, wherein the resin layer 11 contains 10 mass% or more of ...
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WO/2022/202845A1 |
The present invention is an adhesive paste that contains a curable organopolysiloxane compound. The storage elastic modulus at -60°C of a cured product obtained by heating and curing the adhesive paste for 20 hours at 80°C and then fur...
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WO/2022/202832A1 |
[Problem] The present invention addresses the problem of providing an adhesive agent composition and a coating composition each having excellent storage stability, high adhesiveness, and excellent blocking resistance and water resistance...
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WO/2022/201766A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 11; and an boundary surface ablation layer 12 which is laminated on one surface of the substrate 11 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202414A1 |
The purpose of the present invention is to provide: a protective tape that has exceptional heat resistance, and that can reliably generate a gas and easily be detached from an adherend such as a semiconductor device even when light has b...
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WO/2022/202028A1 |
The provided optical laminate includes an optical base material and an adhesive layer disposed on the surface of the optical base material. The adhesive layer contains an adhesive composition containing a silane coupling agent. The silan...
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WO/2022/202774A1 |
A purpose of the present invention is to provide an adhesive tape which can maintain high adhesive strength at high temperatures while being easily releasable. Another purpose of the present invention is to provide: a method for fixing a...
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WO/2022/202153A1 |
Provided is an adhesive composition which is suitable for temporarily bonding a bumped semiconductor substrate to a supporting substrate and which gives an adhesion layer that can inhibit or reduce bump deformation caused by an external ...
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WO/2022/201765A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and an boundary surface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202271A1 |
A dicing die attach film which comprises a dicing film and a die attach film that is superposed on the dicing film, wherein: a surface of the die attach film has an arithmetic mean roughness Ra1 of 0.05 μm to 2.50 μm, the surface being...
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WO/2022/203033A1 |
Provided is an ink-jet adhesive which, when a transparent member is used as an adherent member, can inhibit a component of the adhesive from adhering to areas of the transparent member which are not intended to be bonded. This ink-jet ...
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WO/2022/202844A1 |
The present invention relates to an adhesive paste containing a curable organopolysiloxane compound (A), wherein a cured product, obtained by heat-curing the adhesive paste at 80 °C for 20 hours and then further heat-curing the adhesive...
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WO/2022/202160A1 |
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...
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WO/2022/200974A1 |
The present invention relates to adhesive mixtures. In particular, the invention concerns the use of lignin in biobased hot-melt (non-pressure sensitive) and pressure sensitive adhesives, as well as novel adhesive mixtures suitable for u...
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WO/2022/201687A1 |
A dicing die attach film which has a dicing film and a die attach film layered on this dicing film, wherein the die attach film contains an organic solvent which has a boiling point no less than 100°C and less than 150°C and a vapor pr...
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WO/2022/202683A1 |
The present disclosure addresses the problem of providing a thermosetting composition with which it is possible to achieve a long pot life, excellent thermosetting properties, and excellent photocuring properties that enables temporary b...
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WO/2022/202846A1 |
The present invention is an adhesive paste, containing a thermosetting organopolysiloxane compound and a liquid constituent that satisfies requirement 1 and requirement 2, wherein the content ratio of the liquid constituent relative to t...
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WO/2022/202857A1 |
The present invention pertains to a multilayer label having a base material, a resin layer, and an adhesive layer in the stated order. The base material and the resin layer are detachably adhered. The resin layer contains a biodegradable...
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WO/2022/196298A1 |
A heat-sealable resin composition including an ethylene-vinyl ester copolymer (A) and a tackifying resin (B), in which the content of a constituent unit derived from the vinyl ester included in the ethylene-vinyl ester copolymer (A) with...
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WO/2022/196328A1 |
Provided are: a resin composition which has a low modulus, can cure at low temperatures, and has a long pot-life and which is useful as electroconductive adhesives, materials for mounting components, sealants for protecting components, a...
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WO/2022/193662A1 |
Provided in the present invention are a one-component silane-modified polyether sealant, a preparation method therefor and the application thereof. The preparation raw materials for the one-component silane-modified polyether sealant com...
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WO/2022/196987A1 |
The present invention relates to an adhesive composition comprising acrylic copolymer having refractive index of 1.55-1.70, and to an adhesive sheet, an optical member, and a display apparatus produced using the adhesive composition.
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WO/2022/195655A1 |
An adhesive (101) of a stress relaxation type configured by using an epoxy compound having two or more allyl functional groups as a main ingredient and an amine-based hardener having a bisphenol A type resin skeleton to configure an epox...
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WO/2022/196586A1 |
[Problem] To provide: an adhesive composition which has excellent heat resistance, excellent adhesive strength, low relative dielectric constant, low dielectric loss tangent and excellent dielectric characteristics; and a bonding sheet, ...
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WO/2022/194241A1 |
The present invention relates to the technical field of processing and manufacturing. Disclosed are a protective colloid and a use method therefor. The protective colloid is prepared from the following raw materials: a UV epoxy modified ...
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WO/2022/196354A1 |
The present invention relates to: a thermally expandable adhesive composition which contains a thermosetting resin (A), thermally expandable particles (B) and an inorganic filler (C), wherein the inorganic filler (C) has an average parti...
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WO/2022/195937A1 |
An adhesive for provisional fixing an electronic component to a solder precoat, at least a part of which is covered by an organic film, wherein: the adhesive contains a base resin and a solvent that dissolves the base resin; the content ...
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WO/2022/191109A1 |
A bonding sheet according to the present invention contains a matrix resin, solder particles, and a flux agent. With respect to this bonding sheet, the solder particles are dispersed in the matrix resin, and the flux agent is unevenly di...
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WO/2022/188504A1 |
The present application relates to the field of conductive adhesives, and specifically relates to a heat-cured conductive adhesive and a preparation method therefor. The preparation method for the heat-cured conductive adhesive mainly co...
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