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WO/2012/090828A1 |
The purpose of the present invention is to provide a method for effectively manufacturing a hexagonal semiconductor plate crystal with small warpage. This method for manufacturing the hexagonal semiconductor plate crystal is a method for...
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WO/2012/081589A1 |
[Problem] To provide a power tool having a gear-shift mechanism that contributes towards improving the smoothness of a gear-shift operation. [Solution] A power tool in which a tip tool (113) is driven and predetermined machining work is ...
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WO/2012/081239A1 |
A wire saw slurry management device is provided with: a first tank (5A) which receives slurry waste (3); a centrifugal separator (14) into which the slurry waste (3b) from the first tank (5A) is introduced and which isolates the slurry (...
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WO/2012/077730A1 |
[Problem] The present invention addresses the problem of providing a roller for a wire saw, the roller for a wire saw being configured so that a hollow cylindrical outer layer body can be fitted with sufficient strength over a core mater...
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WO/2012/077645A1 |
Provided is a method which is capable of processing a hard substrate laminated body efficiently and preferably. The method for processing the hard substrate laminated body includes a step of preparing a hard substrate laminated body (14)...
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WO/2012/076418A1 |
Grinding device (1) for mechanically grinding rotor blades (100) for wind power plants, having at least one industrial robot (30) and a grinding unit (10, 50, 70), which is guided by the industrial robot (30), wherein the grinding unit (...
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WO/2012/057793A1 |
A method of abrading the surface of a tire including steps of securing a tire to prevent rotation thereof, providing a mechanism extending from a base comprising an abrading member, the mechanism constraining the abrading member to move ...
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WO/2012/053165A1 |
The present invention includes: a detection step for detecting foreign material (100) on the surface of a work (W) and acquiring information regarding the position and size of the detected foreign material (100); an initial setting step ...
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WO/2012/050307A2 |
Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot.
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WO/2012/045399A1 |
An abrasive cutting-off device has a tool holding fixture (2) for rotatably holding a cutting wheel (3) in a receiving space. Also provided is a deflecting element (5), which is arranged in an area around the receiving space, wherein a w...
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WO/2012/043951A1 |
Provided is a single crystal ingot sawing apparatus. The A single crystal ingot sawing apparatus includes a wire saw configured to slice an ingot, a roller for configured to drive the wire saw, and a slurry bath for configured to receive...
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WO/2012/043251A1 |
Provided is a method for detecting a wire break of a wire saw (2) which has a work processing wire (3) wound around a plurality of processing rollers (8, 9) to form a wire train and which allows the processing rollers (8, 9) to rotate ca...
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WO/2012/032265A1 |
Device for transporting, turning over and surface-treating components (5) moved by conveyor belts (2 and 3) associated with drive motors (13) that drive each of the belts (2 and 3) in opposite directions in order to transport components ...
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WO/2012/026437A1 |
A silicon wafer processing solution for use in a silicon wafer processing method contains a friction modifier comprising a nitrogenated compound, wherein the nitrogenated compound can exhibit a pH value of 2 to 8 inclusive when mixed wit...
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WO/2012/019668A1 |
The invention relates to a polishing device (1) for polishing a metal product (2), in particular a continuously cast slab, billet, or block. The aim of the invention is to achieve a high polishing rate when said metal products are polish...
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WO/2012/017947A1 |
It is possible to control thickening of the processing solution contaminated by scraps by means of at least one water-soluble polymer selected from a copolymer containing (A) polyvinylpyrrolidone and vinylpyrrolidone and in addition by m...
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WO/2012/011346A1 |
This invention relates to an instrument for measuring the height of a protruding defect on a color filter, and a repair device. For details, a color filter having, at the boundary portions between adjacent colored layers, protruding stru...
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WO/2012/007654A1 |
The invention relates to a method for trimming an ophthalmic eyeglass lens (10; 20) according to a desired outline (E, F), the lens (10; 20) comprising a substrate (11; 21) and a coating film (12; 22). The method comprises a step of cutt...
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WO/2012/003828A1 |
An abrasion arrangement is disclosed to abrade a surface of an item, the arrangement comprising a multiple axis robotic arm having at least five axes, an abrading cylinder mounted on the robotic arm and comprising abrasive means which co...
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WO/2011/158834A1 |
Disclosed is a saw wire which comprises: a steel wire (11) comprising a base steel wire (11a) having a given composition; abrasive grains (13) adhered to the steel wire (11) by means of an adhesion part (12); and an intermetallic compoun...
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WO/2011/145521A1 |
Disclosed is a semiconductor device, wherein the surface of a semiconductor substrate (1) is formed with abrasive grain marks (62), and dopant diffusing regions (3,5) have a section which extends in a direction which forms an angle withi...
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WO/2011/137467A1 |
The invention related to a linear conveyor (21) for transporting glass panels (3) in the vicinity of grinding stations (9, 13) or a washing station (15) of a system for producing glass panel blanks comprising a linear conveyor (23), for ...
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WO/2011/126073A1 |
Disclosed is a wire material for a saw wire and a method for producing the same, wherein parameter P expressed by formula (1) for the C, Si, Mn, and Cr content is 1000 or higher. The metallographic structure includes an areal proportion ...
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WO/2011/122144A1 |
The disclosed main roller for a wire saw has wire grooves with increased rigidity, improves cutting precision, and can improve the yield of a product. As well as maintaining the rigidity of the partitions and a high level of yield, even ...
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WO/2011/118864A1 |
The present invention relates to a method for slicing an ingot that can reduce slicing time and wire consumption when slicing a synthetic corundum single-crystal ingot having an R-axis direction. According to the present invention, the m...
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WO/2011/114399A1 |
A grinding head is lowered. Subsequently, with a large foreign object (A) (defect) being ground, the grinding head is moved, without being raised, along the large foreign object (A), in a state where a grinding tape feeding direction (d2...
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WO/2011/111136A1 |
The disclosed foreign body polishing method involves creating information for capturing and correcting defects in the (work) surface of an array substrate (W), selecting a large foreign body (A) larger than a prescribed size from said in...
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WO/2011/105450A1 |
Provided is a method for designing a resin-coated saw wire such that when a workpiece is cut off using a resin-coated saw wire formed by coating the surface of a steel wire with resin, the depth of a machining-altered layer is shallow, a...
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WO/2011/105339A1 |
Provided is a base wire that is used as a coated saw wire having an organic film on the surface, wherein the base wire is able to minimize the peeling of the organic film. Furthermore, the base wire for the coated saw wire provides the c...
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WO/2011/105255A1 |
Disclosed is a manufacturing method for semiconductor wafer whereby pure water not containing free abrasives is supplied during all treatment stages carried out by machining, except for polishing treatment, which results in reduced quant...
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WO/2011/096619A1 |
The present invention relates to a wire saw with 3D-shaped beads. More particularly, the wire saw includes: a wire; first beads inserted on the wire and formed curvedly; second beads inserted on the wire to be adjacent to the first beads...
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WO/2011/096018A1 |
Provided is a method of cutting a workpiece efficiently and with high accuracy in such a way that by using tension adjusting devices, only the tension in the portion of the wire on the winding side is effectively reduced, said tension ad...
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WO/2011/096019A1 |
Provided is a wire saw which uses a cutting wire to cut a workpiece, this wire saw being such that wire tension can be adjusted with high responsiveness. The wire saw has first and second workpiece cutting sections (1A, 1B). The workpiec...
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WO/2011/092803A1 |
Provided is a cutting device wherein even if the spacing between a plurality of cutting blades is reduced, it is possible to prevent the cutting blades from falling over or performing improper cutting. Said cutting device (30) serves to ...
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WO/2011/074615A1 |
Disclosed is a polishing method having improved operation efficiency in a polishing step without being affected by generation state of surface defects (17) on a glass plate (G) surface to be polished. The distribution state of the surfac...
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WO/2011/070386A1 |
A wire monitoring device for a wire saw device, a wire saw device and a method of monitoring a wire saw device are described. The wire monitoring device includes at least two sensors, adapted to provide a change of a sensor output signal...
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WO/2011/070717A1 |
A defect on the surface of a workpiece is captured, information for correction is created, a foreign object requiring correction is selected, the center of the selected foreign object, that is, the foreign object center (Xa) is identifie...
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WO/2011/070723A1 |
A device is configured such that a tape which comprises either an abrasive and/or an adhesive on a surface thereof can be run and pressed against a foreign object on the surface of a workpiece, and the state of contact of the tape with a...
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WO/2011/067074A1 |
The invention relates to a system for cutting objects, comprising a driven spindle (2) and a cutting wheel (1, 1a) bent at an angle with a central bore which is surrounded by a retaining region, said retaining region being recessed with ...
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WO/2011/064919A1 |
Disclosed is a method for polishing a foreign material on a work, wherein defects on the surface of the work are captured, information for correction is generated, and a foreign material which requires correction is selected on the basis...
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WO/2011/061765A1 |
A smoothing-polishing machine is described, for slab-type products (100) made of stone material, such as marble, granite, agglomerate and the like, which comprises at least two operating heads (1) with vertical axis, assembled and radial...
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WO/2011/061884A1 |
A defect on the surface of a workpiece is captured, and information for correction is prepared. On the basis of this information, the height of a foreign object requiring correction is measured. If this measured height is less than the f...
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WO/2011/058929A1 |
Disclosed are: a water-soluble cutting solution for a fixed abrasive wire saw, which has high cutting performance and can prevent the generation of a hydrogen gas through the reaction between silicon and water; a method for cutting an in...
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WO/2011/052193A1 |
Disclosed is a guide roller wherein bearings are held in a housing, and liquid mixed with abrasive grains is prevented from entering the interior of the housing through a shaft hole, thereby improving service life. The guide roller (1) i...
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WO/2011/042462A1 |
The invention relates to a reducing ring having a reducing segment 6 comprising an outer diameter for inserting in the central hole of a cutoff grinder grinding disc 3 and an inner diameter for centering relative to the centering area 4 ...
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WO/2011/043177A1 |
Disclosed is a method for cutting a silicon ingot, wherein the quantity of a fixed-abrasive grain wire required for the purpose of slicing the silicon ingot is reduced as much as possible and manufacture cost is significantly reduced, in...
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WO/2011/042931A1 |
Disclosed is a process that can stably produce a fixed abrasive grain wire provided with a covering of a metal plating layer with a plurality of abrasive grains incorporated therein. A metallic wire is immersed in an electrolysis soluti...
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WO/2011/020566A1 |
The invention relates to a method and an apparatus for handling slabs (2a, 2b), produced in particular by continuous casting, the surfaces of which are ground before they are rolled in a rolling train, wherein the slab, lying on a revers...
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WO/2011/009425A1 |
The invention relates to a tool (A) for rolling an eccentric rotational component (B) having an eccentric portion, in particular an eccentric worm shaft, wherein the tool (A) has a rotational device (R) having a rolling device (410), by ...
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WO/2011/007590A1 |
Provided is a water-soluble working fluid for a fixed-abrasive wire saw, which comprises glycol (A) and water, has a viscosity at 25°C that is between 3 mPa·s and 50 mPa·s, and has excellent silicon workability.
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