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WO/2015/091066A1 |
The object of the invention is to produce a hand-held grinder with a robust design, which is easy and ergonomic to use. To achieve this, according to the invention the hand-held grinder comprises a holder for holding the grinder, a drive...
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WO/2015/087294A1 |
A machine (10) for grinding and/or polishing slabs of stone material, such as natural or agglomerated stone, ceramics or glass, comprises: a support bench (12) for the slabs to be machined. At least one working station (14) is provided a...
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WO/2015/076037A1 |
Provided is a silicon carbide ingot (1) comprising an end face (1a) and an end face (1b) that is the end face on the opposite side from the end face (1a). In the silicon carbide ingot (1), the gradient of the nitrogen concentration in a ...
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WO/2015/075869A1 |
The present invention is a workpiece cutting method in which an array of wires is formed with a wire that is wound helically between multiple wire guides and runs in the axial direction and a workpiece is cut by pressing the workpiece ag...
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WO/2015/073845A1 |
One exemplary embodiment of this disclosure relates to a method of forming an engine component. The method includes forming an engine component having an internal passageway, the internal passageway formed with an initial dimension. The ...
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WO/2015/068597A1 |
This production method for a semiconductor element (10) includes: a semiconductor-element formation step in which the semiconductor element (10) including a dielectric film (3) is formed; a dicing-region formation step in which the diele...
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WO/2015/059868A1 |
The present invention is a semiconductor wafer manufacturing method comprising a cutting step for cutting out a wafer by winding a wire to which abrasive grains are fixed around a plurality of grooved rollers, causing the wire to travel ...
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WO/2015/053148A1 |
The present invention is provided with: a first reel (31) around which a pre-usage wire is wound; and a second reel (32) around which a post-usage wire is wound and retrieved. When workpiece processing is performed on a first occasion, w...
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WO/2015/046069A1 |
Provided is a dicing/die-bonding tape wherein peeling is smoothly performed at a peeling start point of a dicing layer at the time of obtaining a semiconductor chip that is provided with an adhesive layer. A dicing/die-bonding tape (1) r...
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WO/2015/032534A1 |
The invention relates to a grinding system, comprising: a grinding machine, which has a head plate driven in an rotating and/or oscillating manner, which head plate is designed to receive a grinding disk and retain said grinding disk in ...
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WO/2015/029988A1 |
Provided are a dicing device and a dicing method which are capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. A dicing device for cutting a work...
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WO/2015/029987A1 |
Provided is a dicing blade capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. This dicing blade (26) is attached to a rotatable spindle, and whi...
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WO/2015/029323A1 |
The present invention is an ingot cutting method involving forming wire rows with axially running wires wound in a spiral shape between a plurality of wire guides, and pressing an ingot into contact with the wire rows while supplying a p...
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WO/2015/023859A1 |
A method is provided for removing metal honeycomb from a substrate. The method includes directing a forced pulse jet of fluid at an angle of attack of between about 70-110 degrees with respect to the substrate. The fluid strikes the subs...
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WO/2014/182203A1 |
The invention relates to an apparatus arranged to secure a portable cutting machine on an elongated profiled object (11), said apparatus comprising a base (100) adapted to be disposed on an upper surface of the profiled object (11) and a...
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WO/2014/175072A1 |
Provided are: a silicon wafer for solar cells, which is obtained using a slice that is obtained by slicing a polycrystalline silicon ingot by bonded abrasive machining, and which has low reflectance and less gloss unevenness; and a metho...
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WO/2014/083243A9 |
The present invention relates to a method and an arrangement for grinding spherical products (12), such as e.g. bowling balls, in particular. Such an arrangement comprises at least one grinding machine (1) having a spherically oscillatin...
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WO/2014/162945A1 |
Provided are a water soluble cutting fluid for a fixed abrasive grain wire saw that has little foaming and high cutting performance, an ingot cutting method using the same, and a substrate for electronic material obtained by means of the...
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WO/2014/150549A1 |
A power saw includes a cutting arm, a blade guard pivotably supported by the cutting arm and movable to a closed position and an open position, a guard lock lever pivotably supported by the cutting arm and movable to a locked position an...
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WO/2014/140191A1 |
A honing apparatus (22, 24) includes a sharpening stone (35, 36) that has a sharpening surface (35a, 36a) configured to sharpen the edge of the blade (16, 18) upon engaging contact with the edge of the blade (16, 18). A frame (30) is ope...
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WO/2014/139604A1 |
The present invention describes a finishing line for a metallic product comprising a stripping system (DECA), said system being positioned at a periphery of at least one product inlet or product outlet (1, 2) of at least one of the finis...
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WO/2014/136830A1 |
An aqueous working fluid according to the present invention can be used in the cutting of a brittle material using a wire saw, and is characterized by being prepared by adding an alkylene oxide adduct of acethylene glycol and a glycol to...
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WO/2014/129304A1 |
A method for processing a wafer in which: a wafer is obtained by slicing a semiconductor monocrystal ingot using a wire saw apparatus; one surface of the wafer is ground flat using, as a reference surface, a flat surface obtained by appl...
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WO/2014/127926A1 |
The invention relates to a device (10) and system for finish-machining a workpiece in the form of a crankshaft (18) or a camshaft, comprising a workpiece holder (16) and a rotational drive (22) for rotating the workpiece around its workp...
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WO/2014/109149A1 |
[Problem] To provide a resin-bond wire saw having good cutting performance and a long lifespan. [Solution] A resin-bond wire saw in which abrasive grains are fixed to the surface of the wire by a resin bond containing a novolac-type phen...
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WO/2014/108956A1 |
In a wire saw operation for cutting a workpiece into wafers by supplying new wire from a supply side to a recovery side while the wire is reciprocated in the axial direction of the wire and supplying a cutting slurry to the wire as the w...
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WO/2014/107254A2 |
A key device (10) includes a generally elongate shaft portion (12) including a key combination surface (16) that has a plurality of key cut stations (18) for forming telescoping key cuts at each key cut station (18). Each key cut station...
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WO/2014/091383A1 |
A diamond cutting machine with manual control, particularly for gold, silver and costume jewelry, comprising a supporting frame for a spindle, connected to motor means, for moving a driving head around an axis of rotation substantially p...
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WO/2014/083590A1 |
A coolant regeneration method for making coolant, which has been used when cutting an ingot using a wire saw, reusable is characterized in that coolant is supplied respectively into the respective hollow sections of one or multiple hollo...
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WO/2014/065372A1 |
The wire tool (100) with abrasive grains comprises a wire (1), and abrasive grains (5) fixed by electrification hole plating (4) in electrification holes (3), which are provided at multiple spots on the outer circumferential surface of t...
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WO/2014/063075A1 |
A setup platform is provided for a grinder including a cutoff wheel. The setup platform includes an upper planar surface including a first edge, which may be shaped similar to the grinder housing, the first edge including a slot therein ...
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WO/2014/061053A1 |
In a wire saw apparatus (1), a cutting wire (3) wrapped in a spiral on a plurality of wire guides (2) is caused to travel, and a workpiece (W) is simultaneously pressed against the cutting wire (3) and cut and machined while the cutting ...
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WO/2014/057061A1 |
The invention relates to a method for the automated surface machining, in particular grinding, of a profiled component in the form of a profiled large component, in particular of a rotor blade, of a wind energy plant, having a machining ...
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WO/2014/053469A1 |
The invention concerns a hand-held tool apparatus (10) with a braking device (11) for braking a machining tool (12) comprising: a rear handle (22) for operating the tool apparatus (10); a drive arrangement (13) for driving the machining ...
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WO/2014/034841A1 |
A method for cutting a high-hardness material by a multi-wire saw comprises: a step (A) for preparing at least one ingot having a main body portion (10a) having both ends and a low-quality crystalline portion (10e) located at only one of...
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WO/2014/010468A1 |
Provided is a wire saw in which a wire (47) is wound between a plurality of machining rollers (45), and the wire (47) is moved around the machining rollers (45) by rotation of said machining rollers (45), whereby a workpiece (49) is cut ...
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WO/2014/003157A1 |
An aqueous processing liquid to be used when cutting a fragile material with a wire saw incorporates a water-soluble polymer, and is characterized in that the mass average molecular weight of the water-soluble polymer is 3×103 to 6×105...
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WO/2013/191868A1 |
A tool head (52) for a machine tool comprising a plurality of tool spindles (54, 56, 58) with each tool spindle being rotatable about a respective tool axis. The plurality of tool spindles comprises at least a first tool spindle (54) rot...
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WO/2013/179509A1 |
Provided is a wire saw that has superior cutting quality and is not liable to clog due to chips. The wire saw is provided with a main body (6) having a first metal wire (1) made from a cobalt base alloy, two second metal wires (2a, 2b) m...
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WO/2013/179434A1 |
[Problem] To provide a fixed-abrasive-grain wire-saw that enables improved workpiece cutting plane accuracy and grinding efficiency and further allows for a longer product service life, a method for manufacturing the fixed-abrasive-grain...
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WO/2013/179384A1 |
Provided is a wire saw that is light and small and has excellent portability, has excellent sharpness compared to the conventional wire saw, and is difficult to jam by chips. A wire saw (7) is provided with a main body (6) having a first...
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WO/2013/179498A1 |
[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cuttin...
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WO/2013/178625A1 |
The invention relates to a device (10) for machining work pieces, particularly for sharpening tools with cutters for cutting-machining, such as for example drills, milling tools or the like, the device (10) comprising: a monolithic machi...
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WO/2013/172353A1 |
Provided is an apparatus for processing a laminated article allowing movement of a workpiece when contouring a glass substrate or other laminated article, and also allowing processing into a shape that is non-linear when viewed from the ...
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WO/2013/171845A1 |
[Problem] To provide a method for processing both end faces of round bars, the method being capable of efficiently performing chamfering and cutting of both end faces of the round bars with a series of operations. [Solution] While being ...
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WO/2013/168425A1 |
A pressing force adjusting device adjusts a pressing force of a tip tool (24) on a workpiece (W) when the tip tool (24) of a power tool (11) is pressing on the workpiece (W) and the workpiece (W) is being processed. The pressing force ad...
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WO/2013/167831A1 |
The invention relates to a method for cutting-out a multi-layer ophthalmic lens (100) following a desired contour (C3), including: a step of pre-blanking the ophthalmic lens (100) using a preliminary tool (210; 223), according to a preli...
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WO/2013/149965A1 |
This process for manufacturing a cutting wire formed of abrasive particles held on a central core by a binder, comprises: a) the deposition (204) of abrasive particles on the central core, each abrasive particle comprising a magnetic mat...
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WO/2013/135331A1 |
The invention relates to a polishing machine (14) for in particular spectacle lenses (L), comprising at least one workpiece spindle (20) protruding into a workspace (18) for a rotary drive of the spectacle lens (L) about a workpiece rota...
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WO/2013/131786A1 |
A spring-end grinding machine (100) for grinding spring ends of helical compression springs has a grinding unit (120), which has a pair of grinding discs with two rotatable grinding discs (130, 140) between which a grinding space (135) i...
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